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    SEMICONDUCTOR PACKAGE
    5.
    发明申请
    SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250079421A1

    公开(公告)日：2025-03-06

    申请号：US18757626

    申请日：2024-06-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jihyun Lim ,  Yoonyoung Jeon

    IPC: H01L25/16 ,  H01L23/00 ,  H01L23/498

    Abstract: Provided is a semiconductor package including a first wiring structure, a second wiring structure disposed on the first wiring structure, an expanded layer electrically connecting the first wiring structure and the second wiring structure to each other, and including an expanded base layer and a plurality of via structures, a semiconductor chip disposed in the expanded layer and between the first wiring structure and the second wiring structure, and a buried capacitor structure including a plurality first through-holes spaced apart from each other that penetrate the expanded base layer adjacent to the semiconductor chip, and extend in a first horizontal direction along a side surface of the semiconductor chip, and a plurality of electrode layers disposed on sidewalls of the plurality of first through-holes.

    Capacitively-coupled plasma substrate processing apparatus including a focus ring and a substrate processing method using the same
    7.
    发明授权
    Capacitively-coupled plasma substrate processing apparatus including a focus ring and a substrate processing method using the same 有权

    公开(公告)号：US11450545B2

    公开(公告)日：2022-09-20

    申请号：US16683707

    申请日：2019-11-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jongwoo Sun ,  Incheol Song ,  Hongmin Yoon ,  Jihyun Lim ,  Masayuki Tomoyasu ,  Jewoo Han

    IPC: H01L21/683 ,  H01J37/32

    Abstract: According to some embodiments, a semiconductor substrate processing apparatus includes a housing, a plasma source unit, an electrostatic chuck, and a ring unit. The housing encloses a process chamber. The plasma source unit is connected to the housing, and includes a shower head and a fixing ring positioned to support the shower head. The shower head includes an upper electrode mounted on the fixing ring, and includes injection holes passing through part of the upper electrode and configured to inject gas into the chamber. The electrostatic chuck is connected to the housing and includes a lower electrode, and is for mounting a semiconductor substrate thereon. The ring unit is mounted on an edge portion of the electrostatic chuck, and includes a focus ring and a cover ring surrounding the focus ring. One of the lower electrode and the upper electrode is connected to a high frequency power supply, and the other of the lower electrode and the upper electrode is connected to ground. The focus ring has an inner side surface, and an opposite outer side surface that contacts the cover ring, and a width between the inner side surface and the outer side surface of the focus ring is a first width. The cover ring has an inner side surface that contacts the outer side surface of the focus ring, and an outer side surface, and a width between the inner side surface and the outer side surface of the cover ring is a second width. The first width is between 2 and 10 time the second width.

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