公开(公告)号：US20040142646A1

公开(公告)日：2004-07-22

申请号：US10754997

申请日：2004-01-10

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Hung Chih Chen ,  John M. White ,  Shijian Li ,  Fred C. Redeker ,  Ramin Emami

IPC分类号： B24B005/00 ,  B24B029/00

CPC分类号： B24B37/30 ,  B24B37/12 ,  B24B37/32 ,  B24B41/007

摘要： A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.

公开(公告)号：US20040106357A1

公开(公告)日：2004-06-03

申请号：US10722305

申请日：2003-11-25

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Manoocher Birang ,  Allan Glenson

IPC分类号： B24B049/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683 ,  Y10T428/15 ,  Y10T428/162 ,  Y10T428/163 ,  Y10T428/17 ,  Y10T428/218 ,  Y10T428/234 ,  Y10T428/24273 ,  Y10T428/24281 ,  Y10T428/24289 ,  Y10T428/24322 ,  Y10T428/24364 ,  Y10T428/24479 ,  Y10T428/249978 ,  Y10T428/31

摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

摘要翻译： 使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。 该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。 该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

公开(公告)号：US20030190865A1

公开(公告)日：2003-10-09

申请号：US10425684

申请日：2003-04-28

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Sasson Somekh

IPC分类号： B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24B007/19 ,  B24B007/30

CPC分类号： B24B37/245 ,  B24B37/013 ,  B24B37/042 ,  B24B37/205 ,  B24B49/12

摘要： In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.

公开(公告)号：US20030161951A1

公开(公告)日：2003-08-28

申请号：US10090103

申请日：2002-02-27

申请人： Applied Materials, Inc. a Delaware Corporation

发明人： Zheng Yuan ,  Xinyun Xia

IPC分类号： C23C016/00 ,  B05D005/12

CPC分类号： H01L21/31612 ,  C23C16/402 ,  C23C16/45525 ,  H01L21/02164 ,  H01L21/0228 ,  H01L21/32105

摘要： A thin layer of silicon oxide is formed by cyclic introduction of a silicon-containing precursor gas and an oxidizing gas separated by an intervening purge step. The resulting thin oxide layer enables subsequent conventional CVD of oxide to produce a more uniform deposited oxide layer over nonhomogenous surfaces, for example the silicon nitride mask/thermal oxide liner surfaces created during fabrication of shallow trench isolation structures.

摘要翻译： 通过循环引入含硅前体气体和通过中间吹扫步骤分离的氧化气体形成氧化硅薄层。 所得到的薄氧化物层使得随后的常规氧化物CVD能够在不均匀的表面上产生更均匀的沉积氧化物层，例如在浅沟槽隔离结构的制造期间产生的氮化硅掩模/热氧化物衬里表面。

公开(公告)号：US20030139123A1

公开(公告)日：2003-07-24

申请号：US10364081

申请日：2003-02-10

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Sasson Somekh

IPC分类号： B24B007/22

CPC分类号： B24B37/30 ,  B24B37/0053

摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

公开(公告)号：US20020179251A1

公开(公告)日：2002-12-05

申请号：US10199738

申请日：2002-07-18

申请人： Applied Materials, Inc., a Delaware corporation

发明人： Steven M. Zuniga ,  Hung Chih Chen

IPC分类号： C23F001/02 ,  B28B001/00 ,  B32B013/00

CPC分类号： B24B37/32 ,  B24B37/28

摘要： A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.