公开(公告)号：US07223683B2

公开(公告)日：2007-05-29

申请号：US10876582

申请日：2004-06-28

申请人： Chian-Chi Lin

发明人： Chian-Chi Lin

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00014

摘要： A bumping process mainly comprises the following steps. Initially, a wafer having a plurality of bonding pads and a passivation layer with passivation openings exposing the bonding pads is provided. Next, a first dielectric layer with first openings and second openings is disposed on the wafer. The first openings and second openings expose the bonding pads and the portions of the passivation layer respectively. Afterwards, a patterned first electrically conductive layer is formed over the first dielectric layer and the bonding pads. Then a second dielectric layer is formed over the first dielectric layer and the patterned first electrically conductive layer and exposes the patterned first conductive layer through the second openings to form a plurality of bump pads wherein the bump pads are electrically connected to bonding pads. Next, a second electrically conductive layer is formed over the second dielectric layer and the bump pads. Then, a plurality of bumps are formed on the portions of the second electrically conductive layer covering the bump pads. Finally, the bumps are reflowed and the portions of the second electrically conductive layer covered by the reflowed bumps are remained to form a patterned second electrically conductive layer.

摘要翻译： 碰撞过程主要包括以下步骤： 首先，提供具有多个接合焊盘的晶片和具有暴露焊盘的钝化开口的钝化层。 接下来，在晶片上设置具有第一开口和第二开口的第一电介质层。 第一开口和第二开口分别暴露了焊盘和钝化层的部分。 之后，在第一电介质层和接合焊盘上形成图案化的第一导电层。 然后在第一介电层和图案化的第一导电层上形成第二电介质层，并且通过第二开口暴露图案化的第一导电层，以形成多个凸块焊盘，其中凸块焊盘电连接到焊盘。 接下来，在第二介电层和凸块上形成第二导电层。 然后，在覆盖凸点焊盘的第二导电层的部分上形成多个凸块。 最后，回流凸起，并且被回流凸块覆盖的第二导电层的部分保留以形成图案化的第二导电层。

公开(公告)号：US07002805B2

公开(公告)日：2006-02-21

申请号：US10747037

申请日：2003-12-30

申请人： Shih-Chang Lee ,  Su Tao ,  Chian-Chi Lin

发明人： Shih-Chang Lee ,  Su Tao ,  Chian-Chi Lin

IPC分类号： H05K7/20

CPC分类号： H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1082 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity. The cavity not only accommodates the first package, the first carrier, the second package, the second carrier and the intermediate substrate but also provides alignment mechanism by the supporting portion and the alignment portion to prevent the dislocation after all the components of the thermal enhance MCM package are connected with each other. Furthermore, the first carrier has a first side and the second carrier has a second side. The first side and the second side both have grounding portions, for example recessed portions and metal layers, for providing a ground shielding of the first package and the second package against the outside. In addition, the grounding portions also provide thermal paths to increase the ability of the heat dissipation. Besides, a method for manufacturing the thermal enhance MCM package is provided.

摘要翻译： 热增强多芯片模块（MCM）封装主要包括第一封装，第一载体，第二封装，第二载体，中间基板和帽状散热器。 中间基板具有开口。 第一载体和第二载体分别电连接到第一封装和第二封装。 第二包装被容纳在开口中并且经由第一载体，第二载体和中间载体电连接到第一封装。 帽状散热器具有支撑部分和对准部分，其中支撑部分连接到对准部分以限定空腔。 空腔不仅容纳第一封装，第一载体，第二封装，第二载体和中间基板，而且还通过支撑部分和对准部分提供对准机构，以防止在热增强MCM的所有部件的所有部件之后的位错 包装相互连接。 此外，第一载体具有第一侧，第二载体具有第二侧。 第一侧和第二侧都具有接地部分，例如凹部和金属层，用于提供第一包装和第二包装的接地屏蔽抵抗外部。 此外，接地部分还提供热路径以增加散热能力。 此外，还提供了一种用于制造热增强MCM封装的方法。