公开(公告)号：US20210005483A1

公开(公告)日：2021-01-07

申请号：US16460929

申请日：2019-07-02

申请人： International Test Solutions, Inc.

发明人： Alan E. Humphrey ,  Bret A. Humphrey ,  Jerry J. Broz ,  Wayne C. Smith

IPC分类号： H01L21/67 ,  B08B1/02 ,  B65G47/91

摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.

公开(公告)号：US10792713B1

公开(公告)日：2020-10-06

申请号：US16460935

申请日：2019-07-02

申请人： International Test Solutions, Inc.

发明人： Alan E. Humphrey ,  Bret A. Humphrey ,  Jerry J. Broz ,  Wayne C. Smith

IPC分类号： B08B7/00 ,  B65G45/10 ,  B65G47/91 ,  H01L21/67

摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.

公开(公告)号：US10741420B2

公开(公告)日：2020-08-11

申请号：US16136965

申请日：2018-09-20

申请人： International Test Solutions, Inc.

发明人： Alan E. Humphrey ,  James H. Duvall ,  Jerry Broz

IPC分类号： B08B1/04 ,  H01L21/67 ,  G03F7/20 ,  B08B1/00 ,  B24B37/34 ,  C23C16/02

摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

公开(公告)号：US20190263614A1

公开(公告)日：2019-08-29

申请号：US16283603

申请日：2019-02-22

申请人： INTERNATIONAL TEST SOLUTIONS, INC.

发明人： Mark M. Stark ,  Alan E. Humphrey

IPC分类号： B65H18/10 ,  B08B1/02 ,  B65H20/02

摘要： Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.

公开(公告)号：US20190262871A1

公开(公告)日：2019-08-29

申请号：US16283607

申请日：2019-02-22

申请人： INTERNATIONAL TEST SOLUTIONS, INC.

发明人： Mark M. Stark ,  Alan E. Humphrey

IPC分类号： B08B1/02

摘要： Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on movable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and movable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.

公开(公告)号：US10002776B2

公开(公告)日：2018-06-19

申请号：US13725827

申请日：2012-12-21

申请人： International Test Solutions, Inc.

发明人： Alan E. Humphrey ,  James H. Duvall ,  Jerry Broz

IPC分类号： B08B1/00 ,  H01L21/67 ,  B24B37/34

CPC分类号： H01L21/67011 ,  B08B1/001 ,  B08B1/04 ,  B24B37/34 ,  C23C16/0227 ,  G03F7/70925 ,  H01L21/67028 ,  Y10T29/49826

摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

公开(公告)号：US09825000B1

公开(公告)日：2017-11-21

申请号：US15495873

申请日：2017-04-24

申请人： International Test Solutions, Inc.

发明人： Alan E. Humphrey ,  Wayne C. Smith ,  Janakraj Shivlal ,  Bret A. Humphrey

IPC分类号： B23K31/02 ,  B23K37/00 ,  H01L23/00 ,  B23K20/00 ,  B23K20/26 ,  B23K101/40

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/26 ,  B23K2101/40 ,  H01L24/78 ,  H01L2224/7801 ,  H01L2224/78101 ,  H01L2224/78611 ,  H01L2224/85075 ,  H01L2224/851 ,  H01L2224/85203

摘要： A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.

公开(公告)号：US20140331421A1

公开(公告)日：2014-11-13

申请号：US14445003

申请日：2014-07-28

申请人： International Test Solutions, Inc.

发明人： Jerry J. Broz ,  Bret A. Humphrey ,  Alan E. Humphrey ,  James H. Duvall

IPC分类号： B08B1/00

CPC分类号： B08B1/00 ,  B08B7/0028 ,  B24B19/16 ,  B24D11/005 ,  G01R3/00

摘要： A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.

摘要翻译： 一种用于可靠地清洁接触元件并支持诸如探针卡和测试插座的测试仪接口的硬件的介质，同时它仍然在手动，半自动和自动化处理装置中，并且电气测试设备被公开使得 可以对各个管芯或IC封装的功能和性能进行电学评估。