Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor
    32.
    发明授权
    Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor 有权
    薄膜电容器,薄膜电容器嵌入式印刷电路板以及薄膜电容器的制造方法

    公开(公告)号:US07943858B2

    公开(公告)日:2011-05-17

    申请号:US12076989

    申请日:2008-03-26

    Abstract: There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.

    Abstract translation: 提供了薄膜电容器和电容器嵌入式印刷电路板,改善了漏电流特性。 电介质层由具有预定介电常数的BiZnNb基非晶态金属氧化物形成,而不在高温下进行热处理,并且将BiZnNb基非晶态金属氧化物的金属相铋的含量调节到所需的介电常数。 此外,可以形成具有不同金属相铋含量的另一介质层。 所述薄膜电容器包括:第一电极; 介电层,包括形成在所述第一电极上的第一电介质膜,所述电介质层包含BiZnNb基非晶态金属氧化物; 以及形成在所述电介质层上的第二电极,其中所述BiZnNb基非晶态金属氧化物含有金属相铋。

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