公开(公告)号：US20120244734A1

公开(公告)日：2012-09-27

申请号：US13429454

申请日：2012-03-26

Applicant: XIAO-ZHI FU ,  ZE-LIN YAO ,  ZHUANG-XING LI

Inventor： XIAO-ZHI FU ,  ZE-LIN YAO ,  ZHUANG-XING LI

IPC: H01R13/62 ,  H01R24/50

CPC classification number: H01R12/721 ,  H01R13/506 ,  H01R13/648

Abstract: A card edge connector for connecting a card to a printed circuit board includes an insulative housing, a plurality of contacts and a pair of grounding pads. The insulative housing has a lengthwise base portion having a card-receiving slot and a pair of locating arms having an extending portion which extends forwardly from the base portion. The contacts are retained in the insulative housing and extend into the card-receiving slot to electrically contact with the inserted card. The grounding pads each include a main body which has a frame and a solder pad. The locating arms each further include a spring fork-shaped locking portion extending from the extending portion for preventing the grounding pad releasing from the corresponding locating arm when the frame of the grounding pad is securely seated in the extending portion from the locking portion.

Abstract translation: 用于将卡连接到印刷电路板的卡缘连接器包括绝缘外壳，多个触点和一对接地垫。 绝缘壳体具有长度方向的基部，该基部具有卡接收槽和一对定位臂，该定位臂具有从基部向前延伸的延伸部分。 触点保持在绝缘壳体中并延伸到卡接收槽中以与插入的卡电接触。 接地垫各自包括具有框架和焊盘的主体。 所述定位臂还包括从所述延伸部分延伸的弹簧叉状锁定部分，用于当所述接地垫的框架从所述锁定部分牢固地安置在所述延伸部分中时，防止所述接地垫从相应的定位臂释放。

公开(公告)号：US08235738B2

公开(公告)日：2012-08-07

申请号：US12842051

申请日：2010-07-23

Applicant: Zhuang-Xing Li ,  Ze-Lin Yao ,  Wen-Jun Tang

Inventor： Zhuang-Xing Li ,  Ze-Lin Yao ,  Wen-Jun Tang

IPC: H01R13/62

CPC classification number: H01R13/639 ,  H01R12/721 ,  H05K7/1404

Abstract: A card edge connector for mating with an electronic card includes an elongated housing (1), a number of contacts retained to the housing (1), and a retainer (2) at one end of the housing (1). The housing (1) has a pair of opposed side walls (11), a central slot (12) between the side walls and a fitting section at one end thereof. The fitting section defines a pair of axes holes (145). The retainer (2) has a base portion (21) with a pair of pivots (211) engaging with the axes holes (145), a latch projection (22) inwardly extending from the base portion for locking the electronic card, a flexible arm (23) unitarily extending from the base portion (21) to resist an inner wall of the fitting section for fastening the retainer (2) to the housing (1).

Abstract translation: 用于与电子卡匹配的卡边缘连接器包括细长壳体（1），保持在壳体（1）上的多个触点以及在壳体（1）的一端的保持器（2）。 壳体（1）具有一对相对的侧壁（11），在侧壁之间的中心狭槽（12）和在其一端的配合部分。 装配部分限定一对轴孔（145）。 所述保持器（2）具有基部（21），其具有与所述轴孔（145）接合的一对枢轴（211），从所述基部向内延伸以锁定所述电子卡的闩锁突起（22） （23）从所述基部（21）整体延伸以抵抗所述装配部分的内壁，用于将所述保持器（2）紧固到所述壳体（1）。

公开(公告)号：US20120088375A1

公开(公告)日：2012-04-12

申请号：US13249255

申请日：2011-09-30

Applicant: XIAO-ZHI FU ,  ZE-LIN YAO ,  ZHUANG-XING LI

Inventor： XIAO-ZHI FU ,  ZE-LIN YAO ,  ZHUANG-XING LI

IPC: H01R24/00 ,  H01R12/73

CPC classification number: H01R12/716 ,  H01R27/00

Abstract: A card edge connector includes an elongated housing extending along an elongated direction thereof, and having a first housing half, a second housing half being discrete from the first housing half, and a central slot formed between the first and the second housing halves. A plurality of contacts are retained in the housing, and each has a contact portion protruding into the central slot. A width of the central slot could be adjusted before mounting the card edge connector to a mother board for receiving different daughter boards with different thicknesses.

Abstract translation: 卡边缘连接器包括沿其细长方向延伸的细长壳体，并且具有第一壳体半部，与第一壳体半部分离的第二壳体半部以及形成在第一和第二壳体半部之间的中心狭槽。 多个触点保持在壳体中，并且每个触头具有突出到中心狭槽中的接触部分。 在将卡边缘连接器安装到母板以接收不同厚度的不同子板之前，可以调整中心槽的宽度。

公开(公告)号：US20120007135A1

公开(公告)日：2012-01-12

申请号：US13235963

申请日：2011-09-19

Applicant: Chiu-Lin YAO ,  Hin-Hsun HSIEH ,  Tzer-Perng CHEN

Inventor： Chiu-Lin YAO ,  Hin-Hsun HSIEH ,  Tzer-Perng CHEN

IPC: H01L33/62

CPC classification number: H01L33/382 ,  H01L33/08 ,  H01L33/22 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An exemplary semiconductor device is provided. The semiconductor device includes a semiconductor stacked layer and a conductive structure. The conductive structure is located on the semiconductor stacked layer. The conductive structure includes a bottom portion and a top portion on opposite sides thereof. The bottom portion is in contact with the semiconductor stacked layer. A ratio of a top width of the top portion to a bottom width of the bottom portion is less than 0.7. The conductive structure can be a conductive dot structure or a conductive line structure.

Abstract translation: 提供了示例性的半导体器件。 半导体器件包括半导体堆叠层和导电结构。 导电结构位于半导体堆叠层上。 导电结构包括底部和在其相对侧上的顶部。 底部与半导体堆叠层接触。 顶部的顶部宽度与底部的底部宽度之比小于0.7。 导电结构可以是导电点结构或导线结构。

公开(公告)号：USD646234S1

公开(公告)日：2011-10-04

申请号：US29380704

申请日：2010-12-09

Applicant: Chiu-Lin Yao ,  Chia-Liang Hsu ,  Ching-Bei Lin ,  Sheng-Fang Hung

Designer： Chiu-Lin Yao ,  Chia-Liang Hsu ,  Ching-Bei Lin ,  Sheng-Fang Hung

公开(公告)号：US08007323B1

公开(公告)日：2011-08-30

申请号：US12946862

申请日：2010-11-16

Applicant: Kun-Lin Yao ,  Kai-Hsiang Chang

Inventor： Kun-Lin Yao ,  Kai-Hsiang Chang

IPC: H01R24/00

CPC classification number: H01R13/6593 ,  H01R13/405 ,  H01R13/506 ,  H01R2107/00

Abstract: An HDMI (High Definition Multimedia Interface) connector includes an insulating housing which has a receiving cavity and an inserting mouth. A connecting body is formed between the receiving cavity and the inserting mouth and defines two rows of passing holes. An insulating body is secured in the receiving cavity and includes a first insulating body and a second insulating body engaged with the first insulating body. A plurality of first signal terminals and a plurality of second signal terminals each have a fastening portion, a contacting portion and a flexible portion. The first signal terminals are integrated with the first insulating body by means of insert molding the corresponding fastening portions in the first insulating body and the second signal terminals are integrated with the second insulating body by means of insert molding the corresponding fastening portions in the second insulating body. The flexible portions are elastically received in the corresponding passing holes.

Abstract translation: HDMI（高清晰度多媒体接口）连接器包括具有接收腔和插入口的绝缘壳体。 连接体形成在容纳腔和插入口之间并且限定两排通孔。 绝缘体固定在容纳腔中，并包括与第一绝缘体接合的第一绝缘体和第二绝缘体。 多个第一信号端子和多个第二信号端子各自具有紧固部分，接触部分和柔性部分。 第一信号端子通过在第一绝缘体中插入模制相应的紧固部分而与第一绝缘体集成，并且第二信号端子通过在第二绝缘体中插入模制相应的紧固部分而与第二绝缘体一体化 身体。 柔性部分弹性地容纳在相应的通孔中。

公开(公告)号：US07968867B2

公开(公告)日：2011-06-28

申请号：US12453183

申请日：2009-05-01

Applicant: Chiu-Lin Yao ,  Ta-Cheng Hsu

Inventor： Chiu-Lin Yao ,  Ta-Cheng Hsu

IPC: H01L33/00

CPC classification number: H01L33/06 ,  H01L2933/0083

Abstract: A light-emitting device and the method for making the same is disclosed. The light-emitting device is a semiconductor device, comprising a growth substrate, an n-type semiconductor layer, a quantum well active layer and a p-type semiconductor layer. It combines the holographic and the quantum well interdiffusion (QWI) to form a photonic crystal light-emitting device having a dielectric constant of two-dimensional periodic variation or a material composition of two-dimensional periodic variation in the quantum well active layer. The photonic crystal light-emitting devices can enhance the internal efficiency and light extraction efficiency.

Abstract translation: 公开了一种发光器件及其制造方法。 发光装置是包括生长衬底，n型半导体层，量子阱有源层和p型半导体层的半导体器件。 它结合了全息和量子阱相互扩散（QWI）以形成具有二维周期性变化的介电常数或量子阱活性层中的二维周期性变化的材料组成的光子晶体发光器件。 光子晶体发光器件可以提高内部效率和光提取效率。

公开(公告)号：US20110121291A1

公开(公告)日：2011-05-26

申请号：US13022098

申请日：2011-02-07

Applicant: Shih-I Chen ,  Chia-Liang Hsu ,  Chiu-Lin Yao ,  Tzu-Chieh Hsu ,  Chien-Fu Huang

Inventor： Shih-I Chen ,  Chia-Liang Hsu ,  Chiu-Lin Yao ,  Tzu-Chieh Hsu ,  Chien-Fu Huang

IPC: H01L33/10

CPC classification number: H01L33/46 ,  H01L33/0079 ,  H01L33/145 ,  H01L33/22 ,  H01L33/38

Abstract: A light-emitting element includes a light-emitting stack for emitting light and a substrate structure including: a first substrate disposed under the light-emitting stack and having a first surface facing the light-emitting stack; and a second substrate disposed under the light-emitting stack and having a second surface facing the light-emitting stack; and a reflective layer formed between the first substrate and the second substrate and having an inclined angle not perpendicular to the first surface.

Abstract translation: 发光元件包括用于发光的发光叠层和基板结构，包括：第一基板，设置在所述发光堆叠下方，并具有面向所述发光叠层的第一表面; 以及第二基板，其设置在所述发光堆叠下方并且具有面向所述发光叠层的第二表面; 以及形成在第一基板和第二基板之间并具有不垂直于第一表面的倾斜角度的反射层。

公开(公告)号：US07880182B2

公开(公告)日：2011-02-01

申请号：US12482419

申请日：2009-06-10

Applicant: Chiu-Lin Yao ,  Min-Hsun Hsieh ,  Wen-Huang Liu

Inventor： Chiu-Lin Yao ,  Min-Hsun Hsieh ,  Wen-Huang Liu

IPC: H01L29/88

CPC classification number: H01L25/0753 ,  F21K9/00 ,  H01L27/153 ,  H01L2224/24 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting element array includes a conductive substrate; an adhesive layer disposed on the conductive substrate; a first epitaxial light-emitting stack layers disposed on the adhesive layer, the first epitaxial light-emitting stack layers including a first p-contact and an first n-contact, wherein the first p-contact and the first n-contact are disposed on the same side of the first epitaxial light-emitting stack layer; and a second epitaxial light-emitting stack layers disposed on the adhesive layer including a second p-contact and an second n-contact, wherein the second p-contact and the second n-contact are disposed on the opposite side of the epitaxial light-emitting stack layer; wherein the first epitaxial light-emitting stack layers and the second epitaxial light-emitting stack layers are electrically connected in anti-parallel.

Abstract translation: 发光元件阵列包括导电基板; 设置在导电基板上的粘合剂层; 布置在所述粘合剂层上的第一外延发光堆叠层，所述第一外延发光堆叠层包括第一p型接触和第一n型接触，其中所述第一p型接触和所述第一n型接触设置在 第一外延发光堆叠层的同一侧; 以及设置在所述粘合剂层上的第二外延发光叠层，包括第二p型接触和第二n型接触，其中所述第二p型接触和所述第二n型接触设置在所述外延发光层的相对侧上， 发射堆叠层; 其中所述第一外延发光堆叠层和所述第二外延发光堆叠层以反并联方式电连接。

公开(公告)号：US20100244077A1

公开(公告)日：2010-09-30

申请号：US12751642

申请日：2010-03-31

Applicant: Chiu-Lin YAO

Inventor： Chiu-Lin YAO

IPC: H01L33/00 ,  H01L31/02 ,  H01L31/0232

CPC classification number: H01L33/641 ,  H01L33/0079 ,  H01L33/145 ,  H01L33/22 ,  H01L33/38 ,  H01L33/44 ,  H01L33/46 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A photoelectronic element includes a composite substrate including an electrically insulative substrate having a chamber; an intermediate layer; and an electrically conductive substrate; a bonding layer including an electrically conductive region and an electrically insulative region; a first current spreading layer; a first semiconductor stacked layer including a first semiconductor layer, an active layer, and a second semiconductor layer; a current blocking layer; a second current spreading layer; and a first electrode.

Abstract translation: 光电元件包括​​：复合衬底，其包括具有腔室的电绝缘衬底; 中间层 和导电基板; 包括导电区域和电绝缘区域的接合层; 第一电流扩散层; 包括第一半导体层，有源层和第二半导体层的第一半导体层叠层; 电流阻挡层; 第二电流扩散层; 和第一电极。