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公开(公告)号:US20240380307A1
公开(公告)日:2024-11-14
申请号:US18652889
申请日:2024-05-02
Applicant: NXP USA, INC.
Inventor: Jerry Rudiak , Burton Jesse Carpenter , Fred T. Brauchler
Abstract: A system comprising a first gate driver comprising: a first die including a first controller for controlling a gate of a first power switch; a second die arranged with the first die and galvanically isolated from the first die, the second die comprising communication circuitry; wherein the first die includes a first connection element and the second die includes a second connection element, wherein the first and second connection elements are configured to provide a communication channel between the galvanically isolated first die and second die; and wherein the second die comprises at least one communication terminal for coupling to a second gate driver comprising a second controller, the second controller for controlling a gate of a second power switch; wherein the communication channel provides for communication between the first controller and the second controller.
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公开(公告)号:US20240370334A1
公开(公告)日:2024-11-07
申请号:US18480992
申请日:2023-10-04
Applicant: NXP USA, Inc.
Inventor: Martin Mienkina , Quyen Pho , Avni Arora
Abstract: A requestor of a data processing system provides read access requests, full write access requests with corresponding full write data each having a full-width data size, and partial write access requests with corresponding partial write data each having a partial-width data size onto a system interconnect. A memory array stores write data and corresponding error correction code (ECC) check bits in response to write access requests and provides read data and corresponding ECC check bits for the read data in response to read access requests. A memory controller executes a read-modify-write (RMW) sequence between a store buffer and the memory array to implement a partial write transaction in response to a partial write access request, in which the memory controller stores the partial write data into the store buffer upon receiving the partial write access request and suppresses signaling of ECC errors to the requestor during the RMW sequence.
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公开(公告)号:US20240365383A1
公开(公告)日:2024-10-31
申请号:US18644734
申请日:2024-04-24
Applicant: NXP USA, INC.
Inventor: Liwen CHU , Rui CAO , Kiseon RYU , Huizhao WANG , Hongyuan ZHANG
IPC: H04W74/0816 , H04L1/00 , H04W74/08
CPC classification number: H04W74/0816 , H04L1/0068 , H04W74/0866
Abstract: A method of method of dynamic channel switching by a station (STA), including: receiving a resource unit (RU) allocation in an initial frame exchange; determining that the STA cannot operate in its operating BW covering a primary channel based upon the RU allocation; switching to secondary channel(s) per an RU allocated to it to carry out communication by the STA during a transmit opportunity (TXOP); carrying out the communication during the TXOP; and switching back to the primary channel no later than an end of the TXOP if detecting that an AP will not do the initial frame exchange with it in the secondary channel(s) within the TXOP.
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公开(公告)号:US20240363519A1
公开(公告)日:2024-10-31
申请号:US18307082
申请日:2023-04-26
Applicant: NXP USA, INC.
Inventor: Michael B. Vincent , Ankur Shah , Namrata Kanth
IPC: H01L23/498 , H01L21/48 , H01L21/56 , H01L23/14 , H01L23/31 , H01L23/538 , H01L25/16
CPC classification number: H01L23/4985 , H01L21/4853 , H01L21/566 , H01L23/145 , H01L23/3128 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L23/5385 , H01L23/5386 , H01L23/5387 , H01L25/162 , H01L25/165 , H01L21/486 , H01L24/08 , H01L24/16 , H01L24/32 , H01L2224/08235 , H01L2224/16227 , H01L2224/16238 , H01L2224/32225 , H01L2924/182
Abstract: A method of forming a semiconductor device is provided. The method includes placing a semiconductor die on a carrier substrate and affixing a rigid-flex sub-assembly on the semiconductor die. The rigid-flex sub-assembly includes a rigid portion and a flex portion having a conductive trace. A distal region of the flex portion is bent such that the bent distal region is not coplanar with the rigid portion. An encapsulant encapsulates at least a portion of the semiconductor die and the rigid-flex sub-assembly.
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公开(公告)号:US12132473B2
公开(公告)日:2024-10-29
申请号:US18183006
申请日:2023-03-13
Applicant: NXP USA, Inc.
Inventor: David Edward Bien , Xu Jason Ma
IPC: H03K17/082
CPC classification number: H03K17/0822
Abstract: A switching device may include an input terminal, an output terminal, a primary switching transistor electrically coupled between the input terminal and the output terminal, and a cascode arrangement electrically coupled between the primary switching transistor and the input terminal. The cascode arrangement may include multiple cascode transistors, each having gate terminals coupled to nodes of a voltage divider that is coupled between a positive voltage supply and a reference voltage supply. Emitter-follower bipolar junction transistors (BJTs) may be configured to control voltages at the gate terminals of the primary switching transistor and the cascode transistors to accommodate changes in the output voltage at the output terminal.
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公开(公告)号:US12132093B2
公开(公告)日:2024-10-29
申请号:US17805774
申请日:2022-06-07
Applicant: NXP USA, INC.
IPC: H01L29/66 , H01L29/732 , H01L29/737
CPC classification number: H01L29/66242 , H01L29/732 , H01L29/7378
Abstract: A transistor with an emitter, base, and collector. The base includes a monocrystalline base layer. A sacrificial material is formed on the monocrystalline base layer. The sacrificial material is removed to expose a portion of the monocrystalline base layer. A base silicide includes a portion formed on the portion of the base monocrystalline base layer that was exposed by the removal of the sacrificial material.
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公开(公告)号:US20240354483A1
公开(公告)日:2024-10-24
申请号:US18335184
申请日:2023-06-15
Applicant: NXP USA, Inc.
Inventor: Gaurav Agarwal , Himanshu Mangal , Siddhartha Jain , Sachin Kalra , Amol Agarwal
IPC: G06F30/394 , G06F30/31
CPC classification number: G06F30/394 , G06F30/31
Abstract: A buffer in an integrated circuit comprises one or more logic circuits, an input signal pin electrically coupled to an input of one of the one or more logic circuits, and an output signal pin electrically coupled to an output of one of the one or more logic circuits. The input signal pin and output signal pin are positioned on a same routing track of the integrated circuit which specifies a routing in the integrated circuit. A respective segment of a net routed to the input and output signal pin is on the same routing track.
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公开(公告)号:US12125716B2
公开(公告)日:2024-10-22
申请号:US17337583
申请日:2021-06-03
Applicant: NXP USA, INC.
Inventor: Zhiwei Gong , Scott M. Hayes , Michael B. Vincent , Vivek Gupta , Richard Te Gan
CPC classification number: H01L21/561 , H01L21/67126 , H01L22/26 , H01L23/3121 , H01L23/3157 , H01L24/94 , H01L21/568
Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes placing a plurality of semiconductor die on a carrier substrate. The plurality of semiconductor die and an exposed portion of the carrier substrate are encapsulated with an encapsulant. A cooling fixture includes a plurality of nozzles and is placed over the encapsulant. The encapsulant is cooled by way of air exiting the plurality of nozzles. A property of air exiting a first nozzle of the plurality of nozzles is different from that of a second nozzle of the plurality of nozzles.
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公开(公告)号:US12124309B2
公开(公告)日:2024-10-22
申请号:US18055915
申请日:2022-11-16
Applicant: NXP USA, Inc.
Inventor: Kumar Abhishek , Subhashrahul Shekhar , Aditya Musunuri , Yi Zheng
IPC: G06F1/00 , G06F1/30 , G06F1/3296 , G06F11/07 , G06F11/30
CPC classification number: G06F1/30 , G06F1/3296 , G06F11/0772
Abstract: A system-on-chip (SoC) having a switchable power domain capable of being placed in a standby mode during which a power supply of the switchable power domain is gated and having an always-on power domain. The always-on power domain includes an input sampling circuit, and the switchable power domain includes an input/output (IO) circuit configured to, during normal operation, receive data at a corresponding signal pin when an input buffer of the IO circuit is enabled, in which the corresponding signal pin is coupled to the input sampling circuit. The input sampling circuit is configured to, while the switchable power domain is entering the standby mode but before the power supply is gated, provide an override input enable signal to enable the input buffer of the IO circuit, sample an input bit value on the corresponding signal pin, and store the sampled bit value to provide an injection current fault indicator.
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公开(公告)号:US20240345163A1
公开(公告)日:2024-10-17
申请号:US18354925
申请日:2023-07-19
Applicant: NXP USA, Inc.
Inventor: Shilpa Gupta , Rishi Bhooshan , Anis Mahmoud Jarrar , David Russell Tipple , Hadi Ahmadi Balef
IPC: G01R31/3185 , G01R31/317 , G01R31/3193
CPC classification number: G01R31/318525 , G01R31/31727 , G01R31/31932
Abstract: A margin sensing circuit coupled to a flip flop of a critical data path includes a delay generator, a selector circuit which selects a delayed data output from the delay generator, a shadow latch corresponding to the flip flop, a comparator circuit which provides a match error indicator based on a comparison between a latched data output from the flip flop and a latched shadow output from the shadow latch, and an error latch to provide an error indicator based on the match error indicator. A correcting circuit includes a clock delay generator configured to receive a clock and provide a plurality of delayed clocks, and a clock selector circuit to select a delayed clock of the plurality of delayed clocks based on a set of clock select signals, in which each of the flip flop and the shadow latch are clocked by the selected delayed clock.
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