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公开(公告)号：US11864314B2
公开(公告)日：2024-01-02
申请号：US17417506
申请日：2019-12-18
Inventor： Kohei Hayashi , Soichi Obata , Yasuhiro Shirotani , Masashi Nitani , Mayumi Uno , Kazuki Maeda
CPC classification number: H05K1/038 , D06M10/001 , D06M23/16 , H05K3/28 , H05K3/4644 , H05K2201/0275
Abstract: The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.
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32.发明授权公开(公告)号：US11786951B2
公开(公告)日：2023-10-17
申请号：US16469780
申请日：2017-12-28
Applicant: ISHIZAKI PRESS INDUSTRIAL CO., LTD. , OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
Inventor： Taizo Ishizaki , Naruaki Shinomiya , Nobuhiko Shirakawa
CPC classification number: B21D22/022 , B21D37/16
Abstract: The manufacturing apparatus for a metal component includes: a preheating portion configured to locally induction-heat a metal plate; and a stamping portion configured to stamp the metal plate. The preheating portion includes a heating coil. The heating coil is arranged such that an axial direction of the heating coil is along a movement direction of the pressing portion and the heating coil faces, in the axial direction, an area where an amount of deformation is relatively large in a processing region of the metal plate to be stamped by the stamping portion. The heating coil is configured such that at least a part of the area where the amount of deformation is relatively large in the processing region of the metal plate is heated to a higher temperature than an area where the amount of deformation is relatively small in the processing region.
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公开(公告)号：US20210387255A1
公开(公告)日：2021-12-16
申请号：US17295205
申请日：2019-11-29
Inventor： Daisuke KATAYAMA , Masato NAKAZAWA , Kaori IGAMI , Takahiro SUGAHARA , Takayuki NAKAMOTO , Takao MIKI , Sohei UCHIDA
Abstract: The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 μm or more and 150 μm or less, containing copper oxide in an amount of 0.10 g/m2 or more and 7.0 g/m2 or less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.
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Patent Agency Ranking
公开(公告)号：US11147162B2
公开(公告)日：2021-10-12
申请号：US16962171
申请日：2018-12-25
Inventor： Mayumi Uno , Kazuki Maeda , Masashi Nitani , Busang Cha , Junichi Takeya
Abstract: A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.
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公开(公告)号：US11084915B2
公开(公告)日：2021-08-10
申请号：US16062741
申请日：2016-12-26
Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD. , OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
Inventor： Kiyoshi Nishioka , Hiroki Maeda , Kei Ishikura , Kimihiro Matsukawa , Yukiyasu Kashiwagi , Masashi Saitoh
IPC: B29C71/02 , C08K3/22 , C08K3/26 , C08K5/098 , C08L69/00 , C08J7/00 , C08L63/00 , C08G59/42 , C08G64/34
Abstract: Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.
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36.发明申请公开(公告)号：US20210017124A1
公开(公告)日：2021-01-21
申请号：US17043416
申请日：2019-03-18
Inventor： Youji SUZUKI , Rie KAKEHASHI , Naoji TOKAI
IPC: C07C233/36 , C07C231/02 , C07C231/12 , C09D11/033 , C09J11/06 , C09D7/20
Abstract: Provided is a compound that thickens a fluid organic material to a desired viscosity and uniformly stabilizes composition thereof. A compound of the present invention is represented by Formula (1): where R1 represents a monovalent linear aliphatic hydrocarbon group having from 10 to 25 carbons; R2 and R3 are the same or different, representing a divalent aliphatic hydrocarbon group having 2, 4, 6, or 8 carbons, a divalent alicyclic hydrocarbon group having 6 carbons, or a divalent aromatic hydrocarbon group; R4 represents a divalent aliphatic hydrocarbon group having from 1 to 8 carbon(s); R5 and R6 are the same or different, representing a monovalent aliphatic hydrocarbon group having from 1 to 3 carbon(s) or a hydroxyalkylether group L1 to L3 represent an amide bond; in a case where L1 and L3 are —CONH—, L2 is —NHCO—, and in a case where L1 and L3 are —NHCO—, L2 is —CONH—.
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公开(公告)号：US10752755B2
公开(公告)日：2020-08-25
申请号：US16081430
申请日：2017-02-28
Inventor： Takeshi Fujiwara , Takayuki Hattori , Jyunichi Inagaki , Takafumi Kuninobu , Kazuhiro Takizawa , Yasuyuki Agari , Hiroshi Hirano , Joji Kadota , Akinori Okada
IPC: C08K9/06 , C08L63/00 , C08L83/04 , C08G59/32 , C09K5/14 , C08L83/06 , C08K9/04 , H01L23/26 , C09C3/12 , C08K3/04 , C08G77/04 , C08K3/14 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , H01L23/373
Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.
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公开(公告)号：US20180371197A1
公开(公告)日：2018-12-27
申请号：US16062741
申请日：2016-12-26
Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD. , OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
Inventor： Kiyoshi NISHIOKA , Hiroki MAEDA , Kei ISHIKURA , Kimihiro MATSUKAWA , Yukiyasu KASHIWAGI , Masashi SAITOH
Abstract: Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.
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