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    PROXIMITY SENSING DEVICE AND LIGHT GUIDING METHOD THEREOF
    32.
    发明申请
    PROXIMITY SENSING DEVICE AND LIGHT GUIDING METHOD THEREOF 审中-公开

    公开(公告)号：US20170184446A1

    公开(公告)日：2017-06-29

    申请号：US15458941

    申请日：2017-03-14

    Applicant: PixArt Imaging Incorporation

    Inventor： Hui-Hsuan Chen ,  Nien-Tse Chen

    IPC: G01J1/02 ,  G02B27/14 ,  G01J1/04

    Abstract: A proximity sensing device includes: a light source, a sensing unit, a light guide unit, and a window. The light source emits light, which is guided by the light guide unit to the window. The emitted light reflected by an object is received by the same window. The light guide unit includes a partial-transmissive-partial-reflective (PTPR) optical element, whereby the light emitted from the light source is reflected by the PTPR optical element, while the light reflected by the object passes through the PTPR optical element. There is only one window required.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
    33.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR 有权
    半导体器件及其制造方法

    公开(公告)号：US20160365423A1

    公开(公告)日：2016-12-15

    申请号：US15068573

    申请日：2016-03-12

    Applicant: PixArt Imaging Incorporation

    Inventor： Chih-Ming Sun ,  Hsin-Hui Hsu ,  Ming-Han Tsai

    IPC: H01L29/51 ,  H01L21/308 ,  H01L21/311 ,  H01L29/40 ,  H01L21/762

    CPC classification number: H01L29/518 ,  H01L21/3086 ,  H01L21/76224 ,  H01L29/401 ,  H01L29/42324

    Abstract: The present invention discloses a manufacturing method for a semiconductor device. The manufacturing method includes: providing a substrate; forming a semiconductor stacked structure on the substrate; forming at least apart of a stacked cap layer on the semiconductor stacked structure, wherein the part of the stacked cap layer includes a nitride layer; removing a part of the nitride layer; forming the rest part of the stacked cap layer; forming a protection layer on the stacked cap layer, and etching the protection layer to form an opening, wherein the nitride layer is not exposed by the opening; and introducing an etchant material into the opening to etch the substrate. The present invention also provides a semiconductor device made by the method.

    Abstract translation: 本发明公开了一种半导体器件的制造方法。 该制造方法包括：提供基板; 在所述基板上形成半导体堆叠结构; 在所述半导体堆叠结构上形成层叠的盖层的至少一部分，其中所述堆叠的盖层的所述部分包括氮化物层; 去除所述氮化物层的一部分; 形成堆叠盖层的其余部分; 在所述堆叠的盖层上形成保护层，并且蚀刻所述保护层以形成开口，其中所述氮化物层不被所述开口暴露; 并将蚀刻剂材料引入到所述开口中以蚀刻所述衬底。 本发明还提供了一种通过该方法制造的半导体器件。

    HIGH PRECISION PHOTONIC DISTANCE METER CIRCUIT AND DISTANCE MEASURING METHOD
    38.
    发明公开
    HIGH PRECISION PHOTONIC DISTANCE METER CIRCUIT AND DISTANCE MEASURING METHOD 审中-公开

    公开(公告)号：US20230400576A1

    公开(公告)日：2023-12-14

    申请号：US17840523

    申请日：2022-06-14

    Applicant: PixArt Imaging Incorporation

    Inventor： Wen-Hao Ho

    IPC: G01S17/10 ,  G01S7/484 ,  G01S7/4865

    CPC classification number: G01S17/10 ,  G01S7/484 ,  G01S7/4865

    Abstract: A distance meter circuit includes: a driver for generating a driving pulse according to a measuring control signal to drive a laser diode to emit a light pulse to an object; a photonic sensing device for generating a first light conversion signal in response to the light pulse reflected by the object; a read-out circuit for measuring a TOF of the light pulse reflected by the object; an adjustable delay circuit for providing an adjustable delay time between the measuring control signal and the measuring trigger signal, or between the measuring control signal and the driving pulse; and a DLL controller for generating a delay control signal by comparing a phase difference between the measuring trigger signal and a driving related signal related to the driving pulse such that the phase difference is regulated to a predetermined value.

    PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED LIGHT PASSAGE AND MANUFACTURING METHOD THEREOF
    39.
    发明申请
    PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMODATION SPACE WITH SEALED LIGHT PASSAGE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220317257A1

    公开(公告)日：2022-10-06

    申请号：US17842838

    申请日：2022-06-17

    Applicant: PixArt Imaging Incorporation

    Inventor： Nientse Chen

    IPC: G01S7/481 ,  G01S17/04

    Abstract: A proximity sensor includes: a transmitter unit for transmitting a light signal; a receiver unit for receiving the light signal reflected by an object to determine a proximity status of the object; and a housing defining a first enclosed accommodation space for accommodating the receiver unit, wherein the portion of the housing which defines the first enclosed accommodation space has a sealed light passage made of a light-transmissible material such that the receiver unit is capable of receiving the light signal reflected by the object through the light passage. The housing can further include a second enclosed accommodation space for accommodating the transmitter unit.

    WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
    40.
    发明申请
    WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES 有权

    公开(公告)号：US20210041298A1

    公开(公告)日：2021-02-11

    申请号：US17067718

    申请日：2020-10-11

    Applicant: PixArt Imaging Incorporation

    Inventor： Chih-Ming Sun ,  Ming-Han Tsai

    IPC: G01J5/02 ,  B81B7/02 ,  H04N5/225 ,  B81B7/00 ,  G01J5/14 ,  G01J5/04 ,  G01J5/00

    Abstract: The present invention discloses a wearable device with combined sensing capabilities, which includes a wearable assembly and at least one multi-function sensor module. The wearable assembly is suitable to be worn on apart of a user's body. The wearable assembly includes at least one light-transmissible window. The multi-function sensor module is located inside the wearable assembly, for performing an image sensing function and an infrared temperature sensing function. The multi-function sensor module includes an image sensor module for sensing a physical or a biological feature of an object through the light-transmissible window by way of image sensing; and an infrared temperature sensor module for sensing temperature through the light-transmissible window by way of infrared temperature sensing.

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