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125 条记录 (耗时 0.02 秒)

    Chip-type resistor
    31.
    发明授权
    Chip-type resistor 失效
    片式电阻器

    公开(公告)号：US4792781A

    公开(公告)日：1988-12-20

    申请号：US015282

    申请日：1987-02-17

    申请人： Tetsuo Takahashi ,  Eisaku Miyauchi ,  Masayuki Yoshida ,  Shunichi Kumagai ,  Akio Sasaki

    发明人： Tetsuo Takahashi ,  Eisaku Miyauchi ,  Masayuki Yoshida ,  Shunichi Kumagai ,  Akio Sasaki

    IPC分类号： H01C17/00 ,  H01C17/28 ,  H01C1/012

    CPC分类号： H01C17/006 ,  H01C17/288 ,  Y10T29/49082 ,  Y10T29/49101 ,  Y10T29/49224

    摘要： A chip resistor having configuration and dimensions of high precision and capable of operating with high reliability. The chip resistor includes end electrodes deposited on both side end surfaces of an insulating substrate according to a thin film deposition technique and integrally formed into a substantially C-shape so as to continuously and thoroughly cover the side end surfaces of the substrate. A resistance element may be formed according to either a thick film deposition technique or a thin film deposition technique. Also, a method for manufacturing such a chip resistor is provided.

    摘要翻译： 片式电阻器，其结构尺寸精度高，能够高可靠性地工作。 芯片电阻器包括根据薄膜沉积技术沉积在绝缘基板的两个侧端表面上的一体形成为大致C形的端电极，以连续且彻底地覆盖基板的侧端面。 可以根据厚膜沉积技术或薄膜沉积技术形成电阻元件。 此外，提供了一种制造这种片式电阻器的方法。

    Apparatus and method for mounting chip type electronic parts
    32.
    发明授权
    Apparatus and method for mounting chip type electronic parts 失效
    安装芯片型电子零件的装置和方法

    公开(公告)号：US4619043A

    公开(公告)日：1986-10-28

    申请号：US591190

    申请日：1984-03-19

    申请人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kenichi Saito

    发明人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kenichi Saito

    IPC分类号： H05K13/04 ,  H05K3/34 ,  B23P19/00 ,  B65G29/00

    CPC分类号： H05K13/0408 ,  Y10S269/903 ,  Y10T29/49144 ,  Y10T29/53178

    摘要： An apparatus and method for mounting chip type electronic parts, in which the parts can be smoothly, reliably and accurately mounted on, for example, a printed circuit board. The apparatus for mounting the chip type parts comprises means for conveying the part to be mounted, means for supplying the part onto the conveying means, means for receiving the part from the conveying means and for mounting the same onto a printed circuit board for example, and also means for positioning the part upon the conveying means before transfer of the part to the receiving and mounting means. The method for mounting a chip type part according to the present invention comprises the steps of supplying the part onto means for conveying the same to be mounted, positioning of the part on the conveying means, and then removing the part off the conveying means and mounting the same.

    摘要翻译： 一种用于安装芯片型电子部件的装置和方法，其中部件可以平滑，可靠和准确地安装在例如印刷电路板上。 用于安装芯片型部件的装置包括用于输送待安装部件的装置，用于将部件供应到传送装置上的装置，用于从传送装置接收部件并将其安装到例如印刷电路板上的装置， 以及用于在将部件转移到接收和安装装置之前将部件定位在输送装置上的装置。 根据本发明的用于安装芯片型部件的方法包括以下步骤：将部件供给到用于输送要安装的部件的装置，将部件定位在输送装置上，然后将部件从输送装置移除并安装 一样。

    Machine for automatically inserting parallel lead electronic components into a printed circuit board
    33.
    发明授权
    Machine for automatically inserting parallel lead electronic components into a printed circuit board 失效
    将铅笔电子元件自动插入印刷电路板的机器

    公开(公告)号：US4263708A

    公开(公告)日：1981-04-28

    申请号：US43750

    申请日：1979-05-30

    申请人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane

    发明人： Tetsuo Takahashi ,  Yoshinobu Taguchi ,  Kotaro Harigane

    IPC分类号： H05K13/04 ,  H05K3/30

    CPC分类号： H05K13/0452 ,  Y10T29/5137 ,  Y10T29/5142 ,  Y10T29/53183

    摘要： A machine for processing and inserting parallel lead electronic components from electronic component web carriers into lead receiving openings in a printed circuit board has improved supply apparatus for selectively receiving an electronic component at a first position and supplying the electronic component to a second predetermined position. The supply apparatus includes a supply sub-assembly having electronic component web carrier apparatus for supporting a plurality of electronic component web carriers at predetermined intervals. Each electronic component web carrier supported by the electronic component web carrier support apparatus is intermittently fed by an intermittent feed device. One electronic component located at the front end of the electronic component web carrier fed by the intermittent feed device is received and gripped at the first position by an electronic component grip device. The electronic component thus received and gripped by the electronic component grip device is separated from the electronic component web carrier by a cutting device. The electronic grip device gripping the electronic component separated by the cutting device is moved to the second predetermined position by a transfer device.

    摘要翻译： 用于将平行的铅电子部件从电子元件幅材载体处理和插入印刷电路板中的引线接收开口的机器具有改进的供应装置，用于在第一位置选择性地接收电子部件并将电子部件供应到第二预定位置。 供给装置包括具有用于以预定间隔支撑多个电子元件幅材载体的电子元件幅材载体装置的供应子组件。 由电子元件腹板载体支撑装置支撑的每个电子元件幅材载体由间歇进给装置间歇地供给。 位于由间歇进给装置供给的电子部件腹板载体的前端的一个电子部件通过电子部件夹持装置在第一位置处被夹持并夹持。 由电子部件抓握装置接收和夹住的电子部件通过切割装置与电子部件幅材载体分离。 夹持由切割装置分离的电子部件的电子抓地装置通过传送装置移动到第二规定位置。

    Oscillators
    34.
    发明授权
    Oscillators 失效
    振荡器

    公开(公告)号：US3982198A

    公开(公告)日：1976-09-21

    申请号：US509274

    申请日：1974-09-25

    申请人： Noboru Saikaishi ,  Yukio Numata ,  Tetsuo Takahashi ,  Morio Kumagai ,  Michinori Naito

    发明人： Noboru Saikaishi ,  Yukio Numata ,  Tetsuo Takahashi ,  Morio Kumagai ,  Michinori Naito

    IPC分类号： H03L7/16 ,  H03L7/20 ,  H04B1/16 ,  H04B1/26

    CPC分类号： H04B1/1638 ,  H03L7/20

    摘要： An oscillator suitable for use as a local oscillator of high frequency apparatus comprises a voltage controlled oscillator, a reference oscillator, a phase detector for detecting the phase difference between the oscillation frequencies of the voltage controlled oscillator and the reference oscillator, means for filtering the output of the phase detector to produce a DC voltage and a phase synchronizing loop for feeding back the DC output of the low-pass filter means to the voltage controlled oscillator. Depending upon whether the oscillation frequency of the reference oscillator is maintained at a duty cycle of 50% or at a value other than 50%, the oscillation frequency of the voltage controlled oscillator is synchronized with an odd multiple or an integer multiple of the oscillation frequency of the reference oscillator when the oscillation frequency of the voltage controlled oscillator is varied forcibly.

    摘要翻译： 适合用作高频装置的本地振荡器的振荡器包括压控振荡器，参考振荡器，用于检测压控振荡器的振荡频率与参考振荡器之间的相位差的相位检测器，用于对输出进行滤波的装置 以产生DC电压和用于将低通滤波器装置的DC输出反馈到压控振荡器的相位同步回路。 根据基准振荡器的振荡频率是否保持在50％的占空比或50％以下的值，压控振荡器的振荡频率与振荡频率的奇数倍或整数倍同步 当压控振荡器的振荡频率被强制变化时，该参考振荡器的参考振荡器。

    Optical switch
    36.
    发明授权
    Optical switch 有权
    光开关

    公开(公告)号：US09307301B2

    公开(公告)日：2016-04-05

    申请号：US14239771

    申请日：2012-09-14

    申请人： Kenya Suzuki ,  Kazunori Seno ,  Naoki Ooba ,  Toshio Watanabe ,  Tetsuo Takahashi

    发明人： Kenya Suzuki ,  Kazunori Seno ,  Naoki Ooba ,  Toshio Watanabe ,  Tetsuo Takahashi

    IPC分类号： H04Q11/00 ,  G02B6/35

    CPC分类号： H04Q11/0003 ,  G02B6/3518 ,  G02B6/3534

    摘要： The discloser provides a multi-input and multi-output optical switch capable of switching over all WDM wavelengths. An optical switch according to one embodiment includes: an optical demultiplexing element (3) that demultiplexes an optical signal from at least one input port into individual wavelengths; a first optical deflection element (5), which deflects an incident optical signal, that deflects the wavelength-separated optical signal incoming from the optical demultiplexing element to change a traveling direction for each wavelength to a switch axis direction perpendicular to a wavelength dispersion axis direction; a second optical deflection element (8) that deflects the optical signal incoming from the first optical deflection element to change the traveling direction to the switch axis direction for output to at least one of the output ports; and an optical multiplexing element (10) that multiplexes the optical signal with the different wavelengths incoming from the second optical deflection element.

    摘要翻译： 该解决方案提供了能够切换所有WDM波长的多输入和多输出光开关。 根据一个实施例的光开关包括：光解复用元件（3），其将来自至少一个输入端口的光信号解复用为各个波长; 第一光偏转元件（5），其使入射光信号偏转，偏转从光解复用元件输入的波长分离的光信号，以将每个波长的行进方向改变为垂直于波长色散轴方向的开关轴方向 ; 第二光学偏转元件（8），其偏转从第一光学偏转元件入射的光学信号，以将行进方向改变到开关轴线方向，以输出到至少一个输出端口; 以及光复用元件（10），其将光信号与从第二光偏转元件入射的不同波长进行复用。

    Semiconductor device
    37.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US09236436B2

    公开(公告)日：2016-01-12

    申请号：US12651055

    申请日：2009-12-31

    申请人： Tetsuo Takahashi ,  Takami Otsuki

    发明人： Tetsuo Takahashi ,  Takami Otsuki

    IPC分类号： H01L23/58 ,  H01L29/40 ,  H01L29/06 ,  H01L29/739

    CPC分类号： H01L29/404 ,  H01L29/0619 ,  H01L29/0638 ,  H01L29/7395

    摘要： A semiconductor device includes: a semiconductor substrate having a main surface having an element formation region, a guard ring, a guard ring electrode, a channel stopper region, a channel stopper electrode, and a field plate disposed over and insulated from the semiconductor substrate. The field plate includes a first portion located between the main surface of the semiconductor substrate and the guard ring electrode, and a second portion located between the main surface of the semiconductor substrate and the channel stopper electrode. The first portion has a portion overlapping with the guard ring electrode when viewed in a plan view. The second portion has a portion overlapping with the channel stopper electrode when viewed in the plan view. In this way, a semiconductor device allowing for stabilized breakdown voltage can be obtained.

    摘要翻译： 半导体器件包括：具有设置在半导体衬底上并与半导体衬底绝缘的具有元件形成区域的主表面，保护环，保护环电极，沟道阻挡区域，沟道阻挡电极和场板的半导体衬底。 场板包括位于半导体衬底的主表面和保护环电极之间的第一部分和位于半导体衬底的主表面和通道阻挡电极之间的第二部分。 当在俯视图中观察时，第一部分具有与保护环电极重叠的部分。 当在平面图中观察时，第二部分具有与通道阻挡电极重叠的部分。 以这种方式，可以获得允许稳定的击穿电压的半导体器件。

    SEMICONDUCTOR DEVICE
    39.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20130153954A1

    公开(公告)日：2013-06-20

    申请号：US13614503

    申请日：2012-09-13

    申请人： Tetsuo TAKAHASHI

    发明人： Tetsuo TAKAHASHI

    IPC分类号： H01L29/739

    CPC分类号： H01L29/7395 ,  H01L29/0619 ,  H01L29/0696 ,  H01L29/404 ,  H01L29/861

    摘要： In one surface of a semiconductor substrate, an n− layer, a p base layer, a p well layer, another p well layer, a channel stopper layer, an emitter electrode, a guard ring electrode, and a channel stopper electrode for example are formed. In the other surface of the semiconductor substrate, an n+ buffer layer, a p+ collector layer, and a collector electrode are formed. In a curved corner of the p well layer, a p low-concentration layer having a lower impurity concentration than the impurity concentration of the p well layer is formed from the surface to a predetermined depth.

    摘要翻译： 在半导体衬底的一个表面中，形成例如n层，p基底层，p阱层，另一个p阱层，沟道阻挡层，发射极，保护环电极和沟道阻挡电极。 在半导体衬底的另一个表面上形成n +缓冲层，p +集电极层和集电极。 在p阱层的弯曲角部，从表面形成具有比p阱层的杂质浓度低的杂质浓度的p低浓度层至预定深度。