Abstract:
The invention provides an optical amplifying system having a structure with two amplification levels to amplify received optical signals. The optical amplifying system includes a Michelson interferometer, a preamplifier, and a post amplifier. In the preamplifier and the post-amplifier, respectively have a light pumping source, a wavelength multiplexer, and an optical gain media. The Michelson interferometer includes an optical coupler and an optical grating set composed of a pair of optical gratings. The optical gratings are located different optical passes, and its central wavelength is equal to the intended wavelength. The optical grating can be formed on a piezoelectric substrate or an electrothermal substrate so that the central wavelength can be changed by applying stress or heat. The intended wavelength reflected by the Michelson interferometer can therefore be adjusted. The preamplifier and the post-amplifier are coupled together through the optical coupler of the Michelson interferometer. Furthermore, an isolator can also be coupled between the preamplifier and the Michelson interferometer so as to avoid the backward propagation noise.
Abstract:
A lift-control buckle, which includes a female buckle member and a male buckle member respectively fastened to two distal ends of a belt, and a locking plate pivoted to two upright blocks inside the female buckle for locking the male buckle member after insertion of the male buckle member into a receiving space defined within the male buckle member between the upright blocks, wherein the locking plate has two springy side arms respectively supported on a respective step inside the female buckle member and stopped against the upright blocks for automatically returning the locking plate to the locking position after each unlocking operation.
Abstract:
A plummet level for checking the horizontal state of a surface and locating two vertically spaced points generally required by wood working in most interior decorative works. The plummet level includes a rectangular main body divided into front and rear compartments for balance beam and weight-loaded swing link, respectively, to mount therein on a central pivot shaft. Two long clear windows are separately provided on walls of the main body facing the balance beam and the swing link. A plurality of spaced and parallel check lines horizontally extend a full length of the windows. A user may visually overlap one of the check lines on the windows and a reference level/vertical line on the balance beam/swing link to check a working surface for its horizontal or vertical state. Two extensible links are connected to two ends of the main body with four right-angled corners defined by an end plate of each extensible link always in alignment with four side walls of the main body, so that the plummet level may be easily extended to conveniently locate and mark a horizontally or vertically corresponding point at a distance longer than the main body of the plummet level.
Abstract:
A planarization method of manufacturing a semiconductor component is provided. A dielectric layer is formed above a substrate and defines a trench therein. A barrier layer and a metal layer are formed in sequence in the trench. A first planarization process is applied to the metal layer by using a first reactant so that a portion of the metal layer is removed. An etching rate of the first reactant to the metal layer is greater than that of the first reactant to the barrier layer. A second planarization process is applied to the barrier layer and the metal layer by using a second reactant so that a portion of the barrier layer and the metal layer are removed to expose the dielectric layer. An etching rate of the second reactant to the barrier layer is greater than that of the second reactant to the metal layer.
Abstract:
A black ink composition is provided. The black ink composition includes a dispersive black colorant; less than 1 wt % of a glycol ether compound based on total weight of the black ink composition; a solvent; and water. The black ink composition of the present invention is free of surfactants and has excellent compatibility with a nozzle, and thus provides good smoothness in printing and high-quality image.
Abstract:
A planarization method of manufacturing a semiconductor component is provided. A dielectric layer is formed above a substrate and defines a trench therein. A barrier layer and a metal layer are formed in sequence in the trench. A first planarization process is applied to the metal layer by using a first reactant so that a portion of the metal layer is removed. An etching rate of the first reactant to the metal layer is greater than that of the first reactant to the barrier layer. A second planarization process is applied to the barrier layer and the metal layer by using a second reactant so that a portion of the barrier layer and the metal layer are removed to expose the dielectric layer. An etching rate of the second reactant to the barrier layer is greater than that of the second reactant to the metal layer.
Abstract:
A phase change memory structure and method for forming the same, the method including providing a substrate comprising a conductive area; forming a spacer having a partially exposed sidewall region at an upper portion of the spacer defining a phase change memory element contact area; and, wherein the spacer bottom portion partially overlaps the conductive area. Both these two methods can reduce active area of a phase change memory element, therefore, reducing a required phase changing electrical current.
Abstract:
A phase change memory structure and method for forming the same, the method including providing a substrate comprising a conductive area; forming a spacer having a partially exposed sidewall region at an upper portion of the spacer defining a phase change memory element contact area; and, wherein the spacer bottom portion partially overlaps the conductive area. Both these two methods can reduce active area of a phase change memory element, therefore, reducing a required phase changing electrical current.
Abstract:
Disclosed herein are toggle-mode magnetoresistive random access memory (MRAM) devices having small-angle toggle write lines, and related methods of toggle-mode switching MRAM devices. Also disclosed are layouts for MRAM devices constructed according to the disclosed principles. Generally speaking, the disclosed principles provide for non-orthogonally aligned toggle-mode write lines used to switch toggle-mode MRAM devices that employ a bias field to decrease the threshold needed to switch the magnetic state of each device. While the conventional toggle-mode write lines provide for the desired orthogonal orientation of the applied magnetic fields to optimize device switching, the use of a bias field affects this orthogonal orientation. By non-orthogonally aligning the two write lines as disclosed herein, the detrimental affect of the bias field may be compensated for such that the net fields applied to the device for both lines are again substantially orthogonal, as is desired.