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447 条记录 (耗时 0.043 秒)

    Method and composition for polishing a substrate
    31.
    发明授权
    Method and composition for polishing a substrate 有权
    抛光基材的方法和组合物

    公开(公告)号：US07232514B2

    公开(公告)日：2007-06-19

    申请号：US10456220

    申请日：2003-06-06

    申请人： Feng Q. Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Siew S. Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

    发明人： Feng Q. Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Siew S. Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

    IPC分类号： C25F3/00

    CPC分类号： H01L21/32125 ,  B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/02 ,  C09G1/04 ,  C25F3/02 ,  H01L21/32134

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 一方面，组合物包括酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约2至约10 ，选自磨料颗粒，一种或多种氧化剂及其组合的研磨增强材料和溶剂。 该组合物可用于导电材料去除工艺中，包括在包括电极的处理设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。

    Conductive polishing article for electrochemical mechanical polishing
    35.
    发明授权
    Conductive polishing article for electrochemical mechanical polishing 失效
    电化学机械抛光用导电抛光制品

    公开(公告)号：US06979248B2

    公开(公告)日：2005-12-27

    申请号：US10140010

    申请日：2002-05-07

    申请人： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Ratson Morad ,  Sasson Somekh

    发明人： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Ratson Morad ,  Sasson Somekh

    IPC分类号： C25D7/12 ,  B23H5/08 ,  B24B37/04 ,  B24D13/14 ,  C25F3/00 ,  C25F3/30 ,  C25F7/00 ,  H01L21/304 ,  B24B1/00 ,  C25C7/04 ,  C25D17/00

    CPC分类号： B24B37/16 ,  B23H5/08 ,  B24B37/046 ,  B24B37/14 ,  Y10S977/902

    摘要： An article of manufacture, method, and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a body comprising at least a portion of fibers coated with a conductive material, conductive fillers, or combinations thereof, and adapted to polish the substrate. In another aspect, a polishing article includes a body having a surface adapted to polish the substrate and at least one conductive element embedded in the polishing surface, the conductive element comprising dielectric or conductive fibers coated with a conductive material, conductive fillers, or combinations thereof. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. A plurality of perforations and a plurality of grooves may be formed in the articles to facilitate flow of material through and around the polishing article.

    摘要翻译： 提供了一种用于平坦化基板表面的制造方法和装置。 在一个方面，提供了一种制造用品，用于抛光包括抛光制品的基材，所述抛光制品具有主体，该主体包括涂覆有导电材料的纤维的至少一部分，导电填料或其组合，并适于抛光该基材。 在另一方面，抛光制品包括具有适于抛光基底的表面和嵌入在抛光表面中的至少一个导电元件的主体，该导电元件包括​​涂覆有导电材料的电介质或导电纤维，导电填料或其组合 。 导电元件可以具有延伸超过由抛光表面限定的平面的接触表面。 可以在制品中形成多个穿孔和多个凹槽以促进材料通过和抛光制品周围的流动。

    METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTROCHEMICAL MECHANICAL PROCESSING
    37.
    发明申请
    METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTROCHEMICAL MECHANICAL PROCESSING 审中-公开
    通过电化学机械加工去除障壁材料的方法和设计

    公开(公告)号：US20080277787A1

    公开(公告)日：2008-11-13

    申请号：US11746135

    申请日：2007-05-09

    申请人： Feng Q. Liu ,  Alain Duboust ,  Yan Wang ,  Wei-Yung Hsu ,  Tianbo Du

    发明人： Feng Q. Liu ,  Alain Duboust ,  Yan Wang ,  Wei-Yung Hsu ,  Tianbo Du

    IPC分类号： H01L23/485 ,  H01L21/4763

    CPC分类号： B23H5/08 ,  H01L21/32125

    摘要： A method and apparatus for processing barrier and metals disposed on a substrate in an electrochemical mechanical planarizing system are provided. In certain embodiments a method for electroprocessing a substrate is provided. The method comprises contacting the substrate with the non-conductive surface of a polishing pad assembly, establishing a first electrically conductive path through an electrolyte between an exposed layer of barrier material and a first electrode, establishing a second electrically conductive path through the electrolyte between the exposed layer of barrier material and a second electrode, applying a voltage to the first electrode to cause a voltage drop between the substrate and the second electrode, and removing the barrier material from the substrate.

    摘要翻译： 提供了一种用于在电化学机械平面化系统中处理设置在基板上的屏障和金属的方法和装置。 在某些实施例中，提供了一种用于对基底进行电处理的方法。 该方法包括使衬底与抛光垫组件的非导电表面接触，建立穿过暴露的阻挡材料层和第一电极之间的电解质的第一导电路径，建立通过电解质之间的第二导电路径 暴露的阻挡材料层和第二电极，向第一电极施加电压以在衬底和第二电极之间引起电压降，以及从衬底去除阻挡材料。

    Method and composition for polishing a substrate
    39.
    发明授权
    Method and composition for polishing a substrate 失效
    抛光基材的方法和组合物

    公开(公告)号：US07160432B2

    公开(公告)日：2007-01-09

    申请号：US10608404

    申请日：2003-06-26

    申请人： Feng Q. Liu ,  Liang-Yuh Chen ,  Stan D. Tsai ,  Alain Duboust ,  Siew S. Neo ,  Yongqi Hu ,  Yan Wang ,  Paul D. Butterfield

    发明人： Feng Q. Liu ,  Liang-Yuh Chen ,  Stan D. Tsai ,  Alain Duboust ,  Siew S. Neo ,  Yongqi Hu ,  Yan Wang ,  Paul D. Butterfield

    IPC分类号： B23H5/08

    CPC分类号： B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/04 ,  C25F3/02 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/32134 ,  H01L21/7684

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义之上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率。 电化学机械抛光技术可以包括抛光组合物，其包含酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约 2和约10，和溶剂。