公开(公告)号：US20070099552A1

公开(公告)日：2007-05-03

申请号：US11555145

申请日：2006-10-31

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai ,  You Wang ,  Jie Diao ,  Renhe Jia ,  Lakshmanan Karuppiah ,  Robert Ewald

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai ,  You Wang ,  Jie Diao ,  Renhe Jia ,  Lakshmanan Karuppiah ,  Robert Ewald

IPC分类号： B23F21/03

CPC分类号： B24B37/046 ,  B24B27/0023 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34 ,  B82Y30/00

摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.

摘要翻译： 提供了一种用于处理基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。 电极设置在其间具有介电材料的抛光表面下方。 可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。 可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

公开(公告)号：US20070066201A1

公开(公告)日：2007-03-22

申请号：US11556011

申请日：2006-11-02

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23F21/03

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.

摘要翻译： 提供了一种用于平坦化基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔，以使材料流过其中。 电极还通过多个穿孔的至少一部分暴露于抛光表面。 制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

公开(公告)号：US20060172671A1

公开(公告)日：2006-08-03

申请号：US11393220

申请日：2006-03-30

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23F21/03

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US06988942B2

公开(公告)日：2006-01-24

申请号：US10894756

申请日：2004-07-20

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D11/00

CPC分类号： H01L21/32125 ,  B23H5/08 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B53/017 ,  B24B57/02 ,  B82Y30/00 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24628 ,  Y10T428/24917

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US07137879B2

公开(公告)日：2006-11-21

申请号：US11393220

申请日：2006-03-30

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D3/34 ,  B24D11/00 ,  B24D17/00

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US07311592B2

公开(公告)日：2007-12-25

申请号：US11556011

申请日：2006-11-02

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D3/34 ,  B24D11/00 ,  B24D17/00

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.

摘要翻译： 提供了一种用于平坦化基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔，以使材料流过其中。 电极还通过多个穿孔的至少一部分暴露于抛光表面。 制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

公开(公告)号：US07066800B2

公开(公告)日：2006-06-27

申请号：US10033732

申请日：2001-12-27

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel A. Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul D. Butterfield ,  Rashid Mavliev ,  Stan D. Tsai

IPC分类号： B24D11/00

CPC分类号： H01L21/32125 ,  B23H5/08 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B53/017 ,  B24B57/02 ,  B82Y30/00 ,  Y10T428/24273 ,  Y10T428/24355 ,  Y10T428/24628 ,  Y10T428/24917

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.

公开(公告)号：US20050000801A1

公开(公告)日：2005-01-06

申请号：US10880752

申请日：2004-06-30

申请人： Yan Wang ,  Siew Neo ,  Feng Liu ,  Stan Tsai ,  Yongqi Hu ,  Alain Duboust ,  Antoine Manens ,  Ralph Wadensweiler ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Donald Olgado ,  Paul Butterfield ,  Ming-Kuei Tseng ,  Shou-Sung Chang ,  Lizhong Sun

发明人： Yan Wang ,  Siew Neo ,  Feng Liu ,  Stan Tsai ,  Yongqi Hu ,  Alain Duboust ,  Antoine Manens ,  Ralph Wadensweiler ,  Rashid Mavliev ,  Liang-Yuh Chen ,  Donald Olgado ,  Paul Butterfield ,  Ming-Kuei Tseng ,  Shou-Sung Chang ,  Lizhong Sun

IPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/04 ,  B24B49/16 ,  B24B53/007 ,  B24D13/14 ,  H01L21/321 ,  C25D17/00

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/16 ,  B24B49/16 ,  B24B53/017 ,  H01L21/32125

摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.

摘要翻译： 本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。 在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的处理衬垫。 多个导电元件跨过上平坦化表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏压衬底。 多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。 在另一个实施例中，提供了具有批处理单元和残余处理单元的系统。 残余处理单元包括偏置的导电平面化表面。 在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

公开(公告)号：US20050284770A1

公开(公告)日：2005-12-29

申请号：US11215254

申请日：2005-08-30

申请人： Paul Butterfield ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

发明人： Paul Butterfield ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

IPC分类号： B23H5/00 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/04 ,  B24B49/16 ,  B24B53/007 ,  B24D13/14 ,  C25D17/00 ,  C25D17/10 ,  H01L21/321

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.

摘要翻译： 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中，抛光制品包括具有抛光表面的环形上层，以及耦合到上层并与其形成可更换组件的导电层。

公开(公告)号：US20080026681A1

公开(公告)日：2008-01-31

申请号：US11868829

申请日：2007-10-08

申请人： PAUL BUTTERFIELD ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

发明人： PAUL BUTTERFIELD ,  Liang-Yuh Chen ,  Yonqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai ,  Feng Liu ,  Ralph Wadensweiler ,  Lizhong Sun ,  Siew Neo ,  Alain Duboust

IPC分类号： B24B29/00

CPC分类号： B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

摘要： Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.

摘要翻译： 提供了用于研磨衬底的抛光制品的实施例。 在一个实施例中，抛光制品包括由与由导电材料制成的环形下层耦合的电介质材料制成的环形上层，以及夹在环形上层和环形下层之间的环形子垫，其与之形成可更换组件。