摘要:
A zener diode capable of breakdown at much higher voltages than in the prior art is fabricated by providing a semiconductor substrate of a first conductivity type having an opposite conductivity type first tank disposed therein. The first tank includes relatively lower and relatively higher resistivity portions, the relatively lower doped portion isolating the relatively higher doped portion from the substrate. A first region of first conductivity type is disposed in the higher doped portion and a second region of opposite conductivity type and more highly doped than the first tank is spaced from the first region. Structure is provided between the first and second regions for repelling majority charge carriers associated with the opposite conductivity type which can be a field plate spaced from the first tank; a portion at the surface of the first tank having the first conductivity type; or a tank, of first conductivity type disposed in the first tank, abutting the first region, extending more deeply into the first tank than does the first region and more lightly doped than the first region. In accordance with a further embodiment, the diode includes a semiconductor substrate, a first tank portion disposed in the substrate and a second tank portion disposed in the first tank portion as in the prior embodiments. A first region of first conductivity type is disposed in the second tank portion and extends into the first tank portion. A second region of opposite conductivity type more highly doped than the first tank portion is disposed in the first tank portion and spaced from the first region.
摘要:
The disclosed apparatus and systems are adapted to implement dynamic power control in order to condition and store, and/or immediately utilize, energy from one or more available power inputs, whether the inputs are constantly, regularly, or intermittently available, singly or in various combinations. Power control circuits according to the invention provide means for dynamically responding to input availability and output requirements in order to prioritize input energy selection, input signal conditioning, and output power delivery adapted to the application and operating environment.
摘要:
Disclosed are methods, apparatus, and systems for the interconnection of electronic system apparatus having one or more different communication protocols. A preferred embodiment is disclosed in which a single physical interface and a single protocol are used for providing an efficient and scalable interconnection between a host and operably coupled subsystem apparatus connected to the MMC. In a disclosed method, a bus is provided for coupling a system host to a plurality of system components and a Multi-Management Protocol (MMP) is employed. The Multi-Management Protocol includes a plurality of subclasses, each further including component identity information and function data. The subclasses are grouped by functionality into at least two groups comprising a standard group and an extension group. In a multi-component electronic system according to the invention, an electronic protocol packet structure includes a starting frame delimiter, a length field, a target address field, a subclass identifier, an operation identifier, a data field, and a frame check field. Disclosed preferred embodiments also include protocol conversion apparatus having a Multi-Management Controller (MMC) using a host bus for transmitting and receiving data between a host and the MMC based on a Multi-Management Protocol (MMP).
摘要:
The invention provides portable bags having integrated displays. Disclosed embodiments include apparatus and associated methods providing integrated electronic displays providing one or more illumination, audio, or radio frequency capabilities. Chemical displays include illumination and scent dispersal capabilities. Embodiments of bags with integrated displays also include electronic displays having at least one associated charging element for charging a charge storage element for powering the display.
摘要:
An EEPROM cell (10) formed on a substrate (18) using conventional process steps is provided. The cell (10) includes first (12) and second (14) conductive regions in the substrate (18) below the substrate's outer surface (28), and the first (12) and second (14) conductive regions are laterally displaced from one another by a predetermined distance (32). The cell (10) also includes an insulating layer (20) outwardly from the outer surface (28) of the substrate (18) positioned so that its edges are substantially in alignment between the first (12) and second (14) conductive regions. The cell (10) further includes a floating gate layer (22) outwardly from the insulating layer (20) and in substantially the same shape as the insulating layer (20). The cell (10) also includes a diffusion region (24 or 26) that extends laterally from at least one of the first (12) and second (14) conductive regions so as to overlap with the insulating layer (20). The diffusion region (24 or 26) provides a source of charge for placement on the floating gate layer (22) when programming the EEPROM cell (10).
摘要:
Disclosed are advances in the arts with novel and useful current mode regulators. Circuits, systems, and methods for current mode regulation include a primary side for receiving an input signal and a secondary for outputting an output signal. A regulator spans the primary and secondary sides in a configuration by which the input signal may be rectified and thereafter provided to the output node as an output signal. A current monitor is provided at the output node for comparing the output signal to a reference. A communication link is included for providing feedback to the primary side of the regulator for use in regulating the signal.
摘要:
Disclosed are advances in the arts with novel line interface apparatus for monitoring and controlling connections in an electrical system. Exemplary preferred embodiments include smart load ASICs and power control ASICs for monitoring signals at one or more device loads and controlling the monitored signals at the device loads and/or at the main transmission lines. The invention preferably provides the capability to test and monitor electrical interconnections without fully activating the host system.
摘要:
An ESD protection structure which includes, preferably a single semiconductor chip, a forward SCR for coupling across a source of potential and a reverse SCR for coupling across the same source of potential which is non-symmetrical to the forward SCR. The breakdown voltage of the forward SCR is different from the breakdown voltage of the reverse SCR. Each of the SCRs has a separate triggering mechanism. None of the anode, cathode and triggering elements of the forward SCR are common to the reverse SCR. A unidirectional device, preferably a Schottky diode, is disposed in the body of semiconductor material between the forward and reverse SCRs to prevent conduction from the body of semiconductor material when the source of potential across the SCRs is reversed.
摘要:
A resonant circuit dynamic optimization system is described herein that can exhibit improved system charging functionality, can have multi-input charging functionality, and can improve the efficiency and speed of charging electronic devices. The resonant circuit dynamic optimization system can comprise at least one antenna configured to receive or transmit an electromagnetic signal, at least one variable component, and at least one dynamic adjustment circuit. The dynamic adjustment circuit can adjust the variable component to thereby modify the power transfer efficiency of the electromagnetic signal.
摘要:
Disclosed are methods, apparatus, and systems for the interconnection of electronic system apparatus having one or more different communication protocols. A preferred embodiment is disclosed in which a single physical interface and a single protocol are used for providing an efficient and scalable interconnection between a host and operably coupled subsystem apparatus connected to the MMC. In a disclosed method, a bus is provided for coupling a system host to a plurality of system components and a Multi-Management Protocol (MMP) is employed. The Multi-Management Protocol includes a plurality of subclasses, each further including component identity information and function data. The subclasses are grouped by functionality into at least two groups comprising a standard group and an extension group. In a multi-component electronic system according to the invention, an electronic protocol packet structure includes a starting frame delimiter, a length field, a target address field, a subclass identifier, an operation identifier, a data field, and a frame check field. Disclosed preferred embodiments also include protocol conversion apparatus having a Multi-Management Controller (MMC) using a host bus for transmitting and receiving data between a host and the MMC based on a Multi-Management Protocol (MMP).