摘要:
In one embodiment of the invention, a method of operating a memory system is provided, including concurrently reading data from a plurality of memories of the memory system and outputting the data from the memory system at an output channel capacity of an I/O port of the memory system by converting a data bus width of data read from at least some of the plurality of memories to a data bus width of the I/O port.
摘要:
A semiconductor module with a plurality of interface circuits has a configuration for the self-test of interface circuits, with two equally sized groups of interface circuits such that each interface circuit of the first group is assigned exactly one interface circuit of the second group. A circuit interacts with the first group and serves for generating test signals which can be output via the interface circuits of the first group. Another circuit interacts with the second group and serves for receiving and processing test signals received via the interface circuits of the second group, so that a connection of the assigned interface circuits of the first and second groups enables a self-test, the first and second groups of interface circuits having a separate voltage supply. This enables good test coverage by separate variation of the voltage of transmitting and receiving group.
摘要:
A circuit configuration with a temperature-dependent semiconductor component self-test and repair logic circuit, in which at least one temperature sensor is provided in a semiconductor chip having a semiconductor component. In addition, the semiconductor component is connected in the semiconductor chip with the self-test and repair logic circuit.
摘要:
A method of checking the operation of memory cells. A first group of memory cells and a second group of memory cells are provided. The first group of memory cells is tested and a first set of test results is obtained, and the first set of test results is stored in the second group of memory cells. The first set of test results is read from the second group of memory cells. The second group of memory cells is tested and a second set of test results is obtained. The second set of test results is stored in the first group of memory cells. The test results can be compressed before they are output. Errors can be corrected by using an error correction code or duplicate copies of the test results. The method allows a test device to be provided that does not have memory. The complexity of the test device is therefore advantageously reduced. An electronic circuit is provided that includes a first group of memory cells, a second group of memory cells, and a test device programmed such that the method can be performed.
摘要:
The density of an X-ray exposure depends not only on the exposure parameters, but also on the film development parameters. In order to eliminate the effect of fluctuations in the latter parameters, the X-ray generator in accordance with the invention comprises a measuring device which measures the density of a test exposure and which acts on an adjusting member for the exposure parameters. By subjecting the test exposure to the same conditions as the X-ray exposure, the effects of parameter fluctuations during film processing process can be eliminated to a high degree.
摘要:
In an embodiment, an integrated circuit having a memory cell arrangement is provided. The memory cell arrangement may include a plurality of multiple bit information storing memory cells, a plurality of buffer circuits, each buffer circuit being coupled to at least one multiple bit information storing memory cell of the plurality of multiple bit information storing memory cells, and a controller configured to control an access operation to access at least one multiple bit information storing memory cell using the buffer circuit coupled to the at least one multiple bit information storing memory cell to be accessed, and a buffer circuit of at least one other multiple bit information storing memory cell being coupled to at least one other multiple bit information storing memory cell.
摘要:
Embodiments of the present invention relate generally to integrated circuits and methods for manufacturing an integrated circuit. In an embodiment of the invention, an integrated circuit having a memory cell is provided. The memory cell may include a trench in a carrier, a charge trapping layer structure in the trench, the charge trapping layer structure comprising at least two separate charge trapping regions, electrically conductive material at least partially filled in the trench, and source/drain regions next to the trench.
摘要:
Embodiments of the present invention relate generally to integrated circuits, methods for manufacturing an integrated circuit, memory modules, and computing systems.
摘要:
A method for operating a semiconductor memory (M) comprising a plurality of memory cells (MC), wherein the memory cells (MC) are arranged adjacent to one another, the arrangement starts with a first memory cell (MF) and ends with a last memory cell (ML), each memory cell (MC) has a first side (S) and a second side (D), the memory cells (MC) are connected by a bitline (BL) on the first side (S) of the memory cell and connected by another bitline (BL) on the second side (D) of the memory cell, the first side (S) of a memory cell is connected to a same bitline (BL) as the second side (D) of an adjacent memory cell, each of the memory cells (MC) is connected by a same wordline (WL), comprising the steps of: selecting a memory cell (MC) for operation, applying a first potential (VS) to all the bitlines (BL) connected to memory cells (MC) arranged to the first side (S) of the memory cell, applying a second potential (VD) to all the bitlines (BL) connected to memory cells (MC) arranged to the second side (D) of the memory cell, and performing the desired operation on the memory cell (MC).
摘要:
The temperature of a semiconductor component is determined by way of a memory cell that includes a transistor and a capacitor. To that end, a signal is determined in dependence on a threshold voltage of the transistor and a value for the temperature of the transistor is determined in dependence on the signal.