公开(公告)号：US11367643B2

公开(公告)日：2022-06-21

申请号：US16838981

申请日：2020-04-02

Applicant: Applied Materials, Inc

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.

公开(公告)号：US20200373279A1

公开(公告)日：2020-11-26

申请号：US16422879

申请日：2019-05-24

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Yingdong Luo ,  Daihua Zhang ,  Hou T. Ng ,  Mingwei Zhu ,  Nag B. Patibandla

IPC: H01L25/075 ,  C09K11/02 ,  G03F7/028 ,  G03F7/00

Abstract: A photocurable composition includes a nanomaterial selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range, one or more (meth)acrylate monomers, and a photoinitiator that initiates polymerization of the one or more (meth)acrylate monomers in response to absorption of radiation in the second wavelength band. The second wavelength band is different than the first wavelength band. A light-emitting device includes a plurality of light-emitting diodes and the cured photocurable composition in contact with a surface through which radiation in a first wavelength band in the UV or visible light range is emitted from each of the light-emitting diodes.

公开(公告)号：US20240194836A1

公开(公告)日：2024-06-13

申请号：US18444277

申请日：2024-02-16

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Daihua Zhang ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/30

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/30

Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.

公开(公告)号：US11908979B2

公开(公告)日：2024-02-20

申请号：US17901831

申请日：2022-09-01

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Daihua Zhang ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L33/30 ,  H01L27/15

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/30

Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.

公开(公告)号：US11888096B2

公开(公告)日：2024-01-30

申请号：US17380998

申请日：2021-07-20

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/56 ,  C09K11/02 ,  C08F22/14 ,  C09D4/06 ,  C09D4/00 ,  C08G75/045 ,  B82Y20/00 ,  B82Y40/00

CPC classification number: H01L33/502 ,  C08F22/14 ,  C08G75/045 ,  C09D4/00 ,  C09D4/06 ,  C09K11/025 ,  H01L27/156 ,  H01L33/56 ,  B82Y20/00 ,  B82Y40/00 ,  C08F2800/20 ,  C08F2810/20

Abstract: A photocurable composition includes a nanomaterial selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The photocurable composition further includes one or more (meth)acrylate monomers, a thiol crosslinker, and a photoinitiator that initiates polymerization of the one or more (meth)acrylate monomers in response to absorption of radiation in the second wavelength band. A light-emitting device includes a plurality of light-emitting diodes and the cured photocurable composition in contact with a surface through which radiation in a first wavelength band in the UV or visible light range is emitted from each of the light-emitting diodes.

公开(公告)号：US11798831B2

公开(公告)日：2023-10-24

申请号：US17735018

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/68 ,  H01L21/02288 ,  H01L21/6715

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

公开(公告)号：US20230256560A1

公开(公告)日：2023-08-17

申请号：US18305264

申请日：2023-04-21

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Rajeev Bajaj ,  Daniel Redfield ,  Mayu Felicia Yamamura ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00

CPC classification number: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  H01L21/30625

Abstract: A method of forming a polishing pad that has a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US11638979B2

公开(公告)日：2023-05-02

申请号：US16897195

申请日：2020-06-09

Applicant: Applied Materials, Inc

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Rajeev Bajaj ,  Daniel Redfield ,  Mayu Felicia Yamamura ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00 ,  H01L21/306 ,  B29K63/00 ,  B29K75/00 ,  B29L31/00

Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US20220336246A1

公开(公告)日：2022-10-20

申请号：US17735018

申请日：2022-05-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.

公开(公告)号：US20220328336A1

公开(公告)日：2022-10-13

申请号：US17842681

申请日：2022-06-16

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: Printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.