摘要:
A phase change random access memory is provided which includes a memory array including a plurality of phase change memory cells, and wordlines respectively connected to the phase change memory cells, where, in a read operation, a voltage of a wordline connected to a selected phase change memory cell is transitioned between at least two voltage stages having different voltage levels.
摘要:
A phase change random access memory is provided which includes a memory array including a plurality of phase change memory cells, and wordlines respectively connected to the phase change memory cells, where, in a read operation, a voltage of a wordline connected to a selected phase change memory cell is transitioned between at least two voltage stages having different voltage levels.
摘要:
In one aspect, a semiconductor memory device includes a plurality of phase-change memory cells which are programmed according to a write current applied to the phase-change memory cells, a voltage boosting circuit which receives a first voltage and outputs a boosted voltage which is greater than the first voltage, and a write driver which receives the boosted voltage and which generates the write current from the boosted voltage. In another aspect, the write driver generates the write current corresponding to one of a set current pulse and a reset current pulse, and at least one of the set current pulse and the reset current pulse is gradually increased.
摘要:
In one aspect, a semiconductor memory device includes a plurality of phase-change memory cells which are programmed according to a write current applied to the phase-change memory cells, a voltage boosting circuit which receives a first voltage and outputs a boosted voltage which is greater than the first voltage, and a write driver which receives the boosted voltage and which generates the write current from the boosted voltage. In another aspect, the write driver generates the write current corresponding to one of a set current pulse and a reset current pulse, and at least one of the set current pulse and the reset current pulse is gradually increased.
摘要:
A phase change random access memory on aspect includes a memory cell array block including a plurality of phase change memory cells, a column decoder, a row decoder, a column selector, and a write driver. The memory further includes a write boosting unit having a plurality of internal charge pumps which boost a first voltage to generate a write driving voltage which drives the write driver, where the number of internal charge pumps that are activated during a write operation is varied according to a number of phase change memory cells which are selected during the write operation. The memory still further includes a column boosting unit which boosts the first voltage to generate a column driving voltage which drives the column decoder, and a row boosting unit which boosts the first voltage to generate a row driving voltage which drives the row decoder.
摘要:
A phase change random access memory on aspect includes a memory cell array block including a plurality of phase change memory cells, a column decoder, a row decoder, a column selector, and a write driver. The memory further includes a write boosting unit having a plurality of internal charge pumps which boost a first voltage to generate a write driving voltage which drives the write driver, where the number of internal charge pumps that are activated during a write operation is varied according to a number of phase change memory cells which are selected during the write operation. The memory still further includes a column boosting unit which boosts the first voltage to generate a column driving voltage which drives the column decoder, and a row boosting unit which boosts the first voltage to generate a row driving voltage which drives the row decoder.
摘要:
A phase change memory device includes a semiconductor substrate which includes a plurality of phase change memory cells, a plurality of local bit lines extending over the semiconductor substrate, each of the plurality of local bit lines being coupled to the plurality of phase change memory cells, and a plurality of global bit lines extending over the plurality of local bit lines, each of the plurality of global bit lines being selectively coupled to the plurality of local bit lines. The plurality of global bit lines are located at two or more different wiring line levels over the semiconductor substrate.
摘要:
A resistive memory device is provided. The resistive memory device includes word lines arranged in M rows, bit lines arranged in N columns, local source lines arranged in M/2 rows, and resistive memory cells arranged in M rows and N columns. Each of the resistive memory cells includes a resistance variable element having a first electrode connected to a corresponding bit line, and a cell transistor having a first terminal connected to a second electrode of the resistance variable element, a second terminal connected to a corresponding local source line, and a control terminal connected to a corresponding word line. The local source line is commonly connected to the second terminals of the cell transistors of the two neighboring rows.
摘要:
A PRAM includes a memory cell array of phase change memory cells, and a write circuit receiving an externally provided first voltage and supplying a write pulse for writing data to the memory cells in a normal operation mode. The write circuit also receives an externally provided second voltage higher than the first voltage and supplies a firing pulse to at least one firing-failed phase change memory cell.
摘要:
A phase-change memory device includes a semiconductor substrate, a bit line and a word line arranged on the semiconductor substrate to intersect each other, and a phase-change material strip interposed between the bit line and the word line and extending lengthwise in a direction that is substantially parallel to at least a portion of the word line.