Photoelectric conversion apparatus
    31.
    发明授权
    Photoelectric conversion apparatus 有权
    光电转换装置

    公开(公告)号:US09263487B2

    公开(公告)日:2016-02-16

    申请号:US14313243

    申请日:2014-06-24

    IPC分类号: H04N5/225 H01L27/146

    摘要: A photoelectric conversion apparatus includes a semiconductor substrate having a photoelectric conversion portion. An insulator is provided on the semiconductor substrate. The insulator has a hole corresponding to the photoelectric conversion portion. A waveguide member is provided in the hole. An in-layer lens is provided on a side of the waveguide member farther from the semiconductor substrate. A first intermediate member is provided between the waveguide member and the in-layer lens. The first intermediate member has a lower refractive index than the in-layer lens.

    摘要翻译: 光电转换装置包括具有光电转换部分的半导体衬底。 绝缘体设置在半导体衬底上。 绝缘体具有与光电转换部对应的孔。 波导构件设置在孔中。 在距离半导体衬底更远的波导构件的一侧设置有层内透镜。 第一中间构件设置在波导构件和内层透镜之间。 第一中间构件具有比层内透镜低的折射率。

    PHOTOELECTRIC CONVERSION APPARATUS AND IMAGE PICKUP SYSTEM HAVING PHOTOELECTRIC CONVERSION APPARATUS
    32.
    发明申请
    PHOTOELECTRIC CONVERSION APPARATUS AND IMAGE PICKUP SYSTEM HAVING PHOTOELECTRIC CONVERSION APPARATUS 审中-公开
    具有光电转换装置的光电转换装置和图像拾取系统

    公开(公告)号:US20150377700A1

    公开(公告)日:2015-12-31

    申请号:US14843847

    申请日:2015-09-02

    IPC分类号: G01J1/44 H01L27/146

    摘要: A photoelectric conversion apparatus according to one aspect of the present invention includes a first substrate including a photoelectric conversion region and a surrounding region, and a second substrate including a circuit for processing a signal from the photoelectric conversion region, and overlapping the first substrate. In this case, the circuit for processing a signal from the photoelectric conversion region includes a first circuit and a second circuit with a higher drive frequency than that of the first circuit. In an orthogonal projection, the second circuit is only provided in the photoelectric conversion region.

    摘要翻译: 根据本发明的一个方面的光电转换装置包括:第一基板,包括光电转换区域和周围区域;以及第二基板,包括用于处理来自光电转换区域的信号的电路,并与第一基板重叠。 在这种情况下,用于处理来自光电转换区域的信号的电路包括具有比第一电路的驱动频率更高的驱动频率的第一电路和第二电路。 在正交投影中,第二电路仅设置在光电转换区域中。

    Solid-state imaging apparatus and camera
    34.
    发明授权
    Solid-state imaging apparatus and camera 有权
    固态成像装置和相机

    公开(公告)号:US09094624B2

    公开(公告)日:2015-07-28

    申请号:US14265711

    申请日:2014-04-30

    摘要: A solid-state imaging apparatus which includes a semiconductor portion having a first face on the light incident side and a second face opposite to the first face, and an optical system arranged on the first face, comprising a first semiconductor region of a first conductivity type provided on the second face side in the semiconductor region, a photoelectric conversion portion provided in the semiconductor portion so as to surround the first semiconductor region, including a second semiconductor region of the first conductivity type, and a gate electrode arranged between the first and the second semiconductor regions on the second face, for transferring a charge generated in the photoelectric conversion portion to the first semiconductor region, wherein the optical system is configured so that a light intensity in the second semiconductor region is higher than that in the first semiconductor region.

    摘要翻译: 一种固态成像装置,包括:在光入射侧具有第一面的半导体部分和与该第一面相反的第二面;以及配置在该第一面上的光学系统,具有第一导电型的第一半导体区域 设置在所述半导体区域中的所述第二面侧的光电转换部,设置在所述半导体部中以围绕包括所述第一导电型的第二半导体区域的所述第一半导体区域的光电转换部,以及配置在所述第一和第 在第二面上的第二半导体区域,用于将在光电转换部分中产生的电荷转移到第一半导体区域,其中光学系统被配置为使得第二半导体区域中的光强度高于第一半导体区域中的光强度。

    SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM INCLUDING SOLID-STATE IMAGE PICKUP APPARATUS, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS
    36.
    发明申请
    SOLID-STATE IMAGE PICKUP APPARATUS, IMAGE PICKUP SYSTEM INCLUDING SOLID-STATE IMAGE PICKUP APPARATUS, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP APPARATUS 审中-公开
    固态图像拾取装置,包括固态图像拾取装置的图像拾取系统以及制造固态图像拾取装置的方法

    公开(公告)号:US20150179700A1

    公开(公告)日:2015-06-25

    申请号:US14625513

    申请日:2015-02-18

    IPC分类号: H01L27/146

    摘要: A method for manufacturing a solid-state image pickup device is provided. The image pickup apparatus includes a photoelectric conversion portion disposed on the semiconductor substrate, a first insulating film over the photoelectric conversion portion, functioning as an antireflection film, a second insulating film on the first insulating film, disposed corresponding to the photoelectric conversion portion, and a waveguide having a clad and a core whose bottom is disposed on the second insulating film. The method includes forming an opening by anisotropically etching part of a member disposed over the photoelectric conversion portion, thereby forming the clad, and forming the core in the opening. In the method, the etching is performed under conditions where the etching rate of the second insulating film is lower than the etching rate of the member.

    摘要翻译: 提供了一种用于制造固态图像拾取装置的方法。 图像拾取装置包括设置在半导体衬底上的光电转换部分,在光电转换部分上的第一绝缘膜,用作抗反射膜,第一绝缘膜上的与光电转换部相对设置的第二绝缘膜,以及 具有包层和芯的波导,其底部设置在第二绝缘膜上。 该方法包括通过各向异性蚀刻设置在光电转换部分上的部件的一部分形成开口,从而形成包层,并在开口中形成芯。 在该方法中,在第二绝缘膜的蚀刻速率低于构件的蚀刻速率的条件下进行蚀刻。

    SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS
    37.
    发明申请
    SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS 审中-公开
    固态成像装置的固态成像装置及其制造方法

    公开(公告)号:US20150118782A1

    公开(公告)日:2015-04-30

    申请号:US14577985

    申请日:2014-12-19

    IPC分类号: H01L27/146

    摘要: The first face of the pad is situated between the front-side face of the second semiconductor substrate and a hypothetical plane including and being parallel to the front-side face, and a second face of the pad that is a face on the opposite side of the first face is situated between the first face and the front-side face of the second semiconductor substrate, and wherein the second face is connected to the wiring structure so that the pad is electrically connected to the circuit arranged in the front-side face of the second semiconductor substrate via the wiring structure.

    摘要翻译: 衬垫的第一面位于第二半导体衬底的前侧面和包括平行于前侧面的假想平面之间,并且衬垫的第二面是与第二面相反侧的面 所述第一面位于所述第二半导体衬底的所述第一面和所述正面之间,并且所述第二面与所述布线结构连接,使得所述衬垫电连接到布置在所述第二面的正面侧的电路 所述第二半导体衬底经由所述布线结构。

    Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device
    39.
    发明授权
    Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device 有权
    光电转换装置,摄像系统及光电转换装置的制造方法

    公开(公告)号:US08890331B2

    公开(公告)日:2014-11-18

    申请号:US13774150

    申请日:2013-02-22

    摘要: A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a second semiconductor substrate including a signal processing unit for processing an electrical signal on the basis of the signal charge generated in the photoelectric conversion unit. The signal processing unit is situated in an orthogonal projection area from the photoelectric conversion unit to the second semiconductor substrate. A multilayer film including a plurality of insulator layers is provided between the first semiconductor substrate and the second semiconductor substrate. The thickness of the second semiconductor substrate is smaller than 500 micrometers. The thickness of the second semiconductor substrate is greater than the distance from the second semiconductor substrate and a light-receiving surface of the first semiconductor substrate.

    摘要翻译: 光电转换装置包括:第一半导体衬底,其包括用于根据入射光产生信号电荷的光电转换单元;以及第二半导体衬底,其包括信号处理单元,用于根据产生的信号电荷来处理电信号 光电转换单元。 信号处理单元位于从光电转换单元到第二半导体基板的正交投影区域中。 在第一半导体衬底和第二半导体衬底之间设置包括多个绝缘体层的多层膜。 第二半导体衬底的厚度小于500微米。 第二半导体衬底的厚度大于距第二半导体衬底和第一半导体衬底的光接收表面的距离。

    PHOTOELECTRIC CONVERSION APPARATUS
    40.
    发明申请
    PHOTOELECTRIC CONVERSION APPARATUS 审中-公开
    光电转换装置

    公开(公告)号:US20140306309A1

    公开(公告)日:2014-10-16

    申请号:US14313243

    申请日:2014-06-24

    IPC分类号: H01L27/146

    摘要: A photoelectric conversion apparatus includes a semiconductor substrate having a photoelectric conversion portion. An insulator is provided on the semiconductor substrate. The insulator has a hole corresponding to the photoelectric conversion portion. A waveguide member is provided in the hole. An in-layer lens is provided on a side of the waveguide member farther from the semiconductor substrate. A first intermediate member is provided between the waveguide member and the in-layer lens. The first intermediate member has a lower refractive index than the in-layer lens.

    摘要翻译: 光电转换装置包括具有光电转换部分的半导体衬底。 绝缘体设置在半导体衬底上。 绝缘体具有与光电转换部对应的孔。 波导构件设置在孔中。 在距离半导体衬底更远的波导构件的一侧设置有层内透镜。 第一中间构件设置在波导构件和内层透镜之间。 第一中间构件具有比层内透镜低的折射率。