公开(公告)号：US20090256583A1

公开(公告)日：2009-10-15

申请号：US12429110

申请日：2009-04-23

Applicant: Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

Inventor： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

IPC: G01R1/067 ,  G01R31/02

CPC classification number: G01R3/00 ,  A61N1/00 ,  C25D1/00 ,  C25D1/003 ,  G01R1/06722 ,  G01R1/06744 ,  G01R1/06761

Abstract: Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.

Abstract translation: 用于测试或以其他方式与半导体管芯或其他电子部件进行电接触的多层探针结构通过在多个覆盖层和附着层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括旨在增强功能性，可构建性或两者的配置。

公开(公告)号：US07372616B2

公开(公告)日：2008-05-13

申请号：US11139391

申请日：2005-05-27

Applicant: Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  John D. Evans

Inventor： Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  John D. Evans

IPC: G02B26/00 ,  C25D1/00 ,  C25D7/00 ,  H01L21/00

CPC classification number: H02N1/008 ,  B33Y10/00 ,  B81C1/0019 ,  C25D1/003

Abstract: Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB™).

Abstract translation: 本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。 在一些实施例中，通过电化学制造（EFAB TM）形成器件。

公开(公告)号：US07259640B2

公开(公告)日：2007-08-21

申请号：US10309521

申请日：2002-12-03

Applicant: Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

Inventor： Elliott R. Brown ,  John D. Evans ,  Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Morton Grosser

IPC: H01P3/06 ,  H01P3/00

CPC classification number: H01P1/202 ,  B33Y10/00 ,  B33Y70/00 ,  B81B2201/042 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H01P11/007 ,  H05K3/4647 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract translation: 提供RF和微波辐射引导或控制部件，其可以是单片的，其可以由多个电沉积操作和/或从多个沉积的材料层形成，其可以包括开关，电感器，天线，传输线，滤波器 ，和/或其他主动或被动部件。 部件可以包括用于将牺牲材料与结构材料分离的非辐射入口和非辐射出口通道。 优选的形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平坦化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。

公开(公告)号：US07229542B2

公开(公告)日：2007-06-12

申请号：US10434315

申请日：2003-05-07

Applicant: Christopher A. Bang

Inventor： Christopher A. Bang

IPC: B41C3/02 ,  C25D1/10 ,  B29C33/40 ,  B29C45/14 ,  B29B13/00

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了模制结构，制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：US06311561B1

公开(公告)日：2001-11-06

申请号：US09241273

申请日：1999-02-01

Applicant: Christopher A. Bang ,  Marcus S. Just ,  Xiaofeng Yang ,  Michael L. Nagy

Inventor： Christopher A. Bang ,  Marcus S. Just ,  Xiaofeng Yang ,  Michael L. Nagy

IPC: G01L1904

CPC classification number: G01L19/0038 ,  G01L9/0073 ,  G01L19/0645 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A media compatible package for a pressure sensing device is made from a non-corrosive, highly chemical resistant material. The package includes a base which holds a printed circuit board having a pressure sensor mounted thereon. A sealing member is placed on the circuit board encircling the pressure sensor and a diaphragm is disposed on the sealing member. A fluid port is attached to the base and compressingly engages the diaphragm creating a sealed chamber around the pressure sensor. The sealed chamber is filled with a pressure transmissive fluid such as oil through a fill hole provided in the printed circuit board. This configuration allows the sensor package to be easily assembled with ordinary components and provides a design where all exposed surfaces of the package can be made from a highly corrosion resistive material.

Abstract translation: 用于压力感测装置的介质兼容包由非腐蚀性高耐化学性材料制成。 该封装包括一个保存有安装在其上的压力传感器的印刷电路板的基座。 密封构件被放置在环绕压力传感器的电路板上，隔膜设置在密封构件上。 流体端口连接到基座并且压缩地接合隔膜，从而在压力传感器周围形成密封室。 该密封室通过设置在印刷电路板上的填充孔填充有诸如油的压力传递流体。 该配置允许传感器封装容易地与普通部件组装，并且提供了一种设计，其中封装的所有暴露表面可以由高度耐腐蚀的电阻材料制成。

公开(公告)号：US5264375A

公开(公告)日：1993-11-23

申请号：US870125

申请日：1992-04-15

Applicant: Christopher A. Bang ,  Markus I. Flik ,  Martin A. Schmidt ,  Zhoumin Zhang

Inventor： Christopher A. Bang ,  Markus I. Flik ,  Martin A. Schmidt ,  Zhoumin Zhang

IPC: G01J5/20 ,  H01L39/14 ,  H01L31/18

CPC classification number: G01J5/20 ,  H01L39/143 ,  Y10S148/012 ,  Y10S505/701 ,  Y10S505/703

Abstract: A detector useful for detecting infrared (IR) radiation is described which is formed of an epitaxial film of superconductive material having a high transition temperature Tc. Specifically, an oxide of yttrium barium and copper is preferred for the high Tc material. The sensor is formed on a single crystalline silicon body suspended by a silicon nitride membrane over a gap formed in a silicon base body and thermally isolated thereby.

Abstract translation: 描述了用于检测红外（IR）辐射的检测器，其由具有高转变温度Tc的超导材料的外延膜形成。 具体地，对于高Tc材料，优选钇钡和铜的氧化物。 传感器形成在由氮化硅膜悬置在单个晶体硅体上，形成在硅基体上的间隙上并被热隔离。

公开(公告)号：US08717054B2

公开(公告)日：2014-05-06

申请号：US13273823

申请日：2011-10-14

Applicant: Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R31/00

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods of forming probe structures include formation of a plurality of planar multi-material electrodeposited layers wherein each probe structure includes a contact tip and a compliant body, wherein the compliant body is formed from at least one material that is different from the contact tip material and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 一些实施例涉及悬臂式探针结构的各种设计，而其他实施例涉及用于制造探针结构的方法。 在一些实施例中，形成探针结构的方法包括形成多个平面多材料电沉积层，其中每个探针结构包括接触末端和柔顺体，其中柔顺体由至少一种与 接触尖端材料，并且其中柔顺体在使用期间在主运动平面中提供探针的弹性压缩，并且其中在层的形成期间，多个层的堆叠方向垂直于主运动平面。

公开(公告)号：US20120064227A1

公开(公告)日：2012-03-15

申请号：US13273873

申请日：2011-10-14

Applicant: Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: B05D5/00 ,  C25D1/00 ,  C23C14/34 ,  B05D1/02 ,  B05D1/18 ,  C23C16/44 ,  C25D5/02 ,  C25D7/00

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US20110187397A1

公开(公告)日：2011-08-04

申请号：US13025489

申请日：2011-02-11

Applicant: Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

Inventor： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/067

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US07872394B1

公开(公告)日：2011-01-18

申请号：US10319403

申请日：2002-12-12

Applicant: John Gritters ,  Christopher A. Bang ,  Erno Klaassen ,  Li Fan ,  Richard Chen ,  Hsin-Chih Yeh ,  Ezekiel John Joseph Kruglick

Inventor： John Gritters ,  Christopher A. Bang ,  Erno Klaassen ,  Li Fan ,  Richard Chen ,  Hsin-Chih Yeh ,  Ezekiel John Joseph Kruglick

IPC: H02N1/00 ,  G02B26/08

CPC classification number: G02B26/0841 ,  H02N1/006

Abstract: In certain embodiments, a MEMS actuator is provided comprising a frame and a movable structure coupled to the frame. A vertical comb drive is provided between the frame and the movable structure to actuate the movable structure.

Abstract translation: 在某些实施例中，提供了MEMS致动器，其包括框架和耦合到框架的可移动结构。 在所述框架和所述可移动结构之间提供垂直梳齿驱动器以致动所述可移动结构。