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1.发明授权Method for fabricating miniature structures or devices such as RF and microwave components 有权用于制造微型结构或诸如RF和微波部件的器件的方法公开(公告)号：US08713788B2
公开(公告)日：2014-05-06
申请号：US13205357
申请日：2011-08-08
Applicant: Elliot R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Inventor： Elliot R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
CPC classification number: H01P1/202 , B33Y10/00 , B33Y70/00 , B81B2201/042 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H05K3/4647 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018
Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
Abstract translation: 多层多材料制造方法包括在形成多个层期间沉积至少一种结构材料和至少一种牺牲材料，其中每层的沉积材料被平坦化以设定各层的边界水平， 其中在形成至少一层期间，在沉积最终材料之前发生的平坦化操作沉积至少三种材料，以便在层边界水平之上设置平坦化水平，并且其中在沉积最后一种材料之后发生平坦化，由此边界水平 为图层设置。 一些形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平面化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。
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2.发明申请Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权用于接触电子元件的悬臂式微孔和制造这种探针的方法公开(公告)号：US20120061009A1
公开(公告)日：2012-03-15
申请号：US13273897
申请日：2011-10-14
Applicant: Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
Inventor： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC: B32B38/00
CPC classification number: C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。
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3.发明申请公开(公告)号：US20120007698A1
公开(公告)日：2012-01-12
申请号：US13205357
申请日：2011-08-08
Applicant: Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
CPC classification number: H01P1/202 , B33Y10/00 , B33Y70/00 , B81B2201/042 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H05K3/4647 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018
Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
Abstract translation: 提供RF和微波辐射引导或控制部件，其可以是单片的，其可以由多个电沉积操作和/或从多个沉积的材料层形成，其可以包括开关，电感器，天线，传输线，滤波器 ，和/或其他主动或被动部件。 部件可以包括用于将牺牲材料与结构材料分离的非辐射入口和非辐射出口通道。 优选的形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平坦化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。
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公开(公告)号：US20100288186A1
公开(公告)日：2010-11-18
申请号：US12467753
申请日：2009-05-18
Applicant: Christopher A. Bang
Inventor： Christopher A. Bang
CPC classification number: C30B15/24
Abstract: Techniques are generally disclosed for forming crystalline bodies. An example system, device or method for forming crystalline bodies may include a crucible for containing molten crystalline material and a support for accommodating a seed on an end thereof, the support being movable along a translation axis in a pull direction to draw the seed crystal from the molten crystalline, thereby initiating growth of a crystalline body along a growth path. Further examples may include one or more nozzles configured to be coupled to a fluid source, the nozzles being positioned relative to the growth path for shaping the crystal body as the molten crystalline is pulled in the pull direction along the growth path.
Abstract translation: 通常公开了形成结晶体的技术。 用于形成结晶体的示例性系统，装置或方法可以包括用于容纳熔融结晶材料的坩埚和用于在其一端容纳种子的支撑件，所述支撑件沿着平行轴线在拉力方向上移动以将晶种从 熔融的晶体，从而引发晶体沿着生长路径的生长。 另外的实例可以包括被配置为耦合到流体源的一个或多个喷嘴，当沿着生长路径沿着拉伸方向拉动熔融晶体时，喷嘴相对于生长路径定位，用于成形晶体。
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公开(公告)号：US20100155253A1
公开(公告)日：2010-06-24
申请号：US12631632
申请日：2009-12-04
Applicant: Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
Inventor： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
CPC classification number: G01R1/0483 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/06716 , G01R1/06744 , G01R1/07314 , G01R1/07357 , G01R3/00 , G01R31/2886 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , Y10T156/10 , H01L2924/00
Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。
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Patent Agency Ranking
6.发明授权Cantilever microprobes for contacting electronic components and methods for making such probes 有权用于接触电子部件的悬臂微型纺织品和用于制造这种探针的方法公开(公告)号：US07557595B2
公开(公告)日：2009-07-07
申请号：US11929666
申请日：2007-10-30
Applicant: Richard T. Chen , Ezekiel J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
Inventor： Richard T. Chen , Ezekiel J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC: G01R31/02
CPC classification number: C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的顺应性元件，改善的行程，改进的顺应性，改进的擦洗 能力和/或类似物。
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7.发明申请公开(公告)号：US20080157793A1
公开(公告)日：2008-07-03
申请号：US11928739
申请日：2007-10-30
Applicant: Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kievn Kim , Gang Zhang , Dennis R. Smalley
Inventor： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Vacit Arat , Adam L. Cohen , Kievn Kim , Gang Zhang , Dennis R. Smalley
IPC: G01R31/02
CPC classification number: G01R3/00 , A61N1/00 , C25D1/00 , C25D1/003 , G01R1/06722 , G01R1/06744 , G01R1/06761
Abstract: Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.
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8.发明授权公开(公告)号：US07265565B2
公开(公告)日：2007-09-04
申请号：US11028960
申请日：2005-01-03
Applicant: Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
Inventor： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC: G01R31/02
CPC classification number: C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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9.发明授权Miniature RF and microwave components and methods for fabricating such components 有权微型RF和微波组件以及用于制造这些部件的方法公开(公告)号：US07239219B2
公开(公告)日：2007-07-03
申请号：US10607931
申请日：2003-06-27
Applicant: Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
CPC classification number: B81C1/00126 , B33Y70/00 , B33Y80/00 , B81B2201/0292 , B81C2201/0109 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H01P11/007 , H01Q3/40 , H01Q21/0006 , H01Q21/065 , H05K3/4647
Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
Abstract translation: 提供RF和微波辐射引导或控制部件，其可以是单片的，其可以由多个电沉积操作和/或从多个沉积的材料层形成，其可以包括开关，电感器，天线，传输线，滤波器 ，混合耦合器，天线阵列和/或其他主动或无源部件。 部件可以包括用于将牺牲材料与结构材料分离的非辐射入口和非辐射出口通道。 优选的形成方法使用电化学制造技术（例如包括选择性沉积，体积沉积，蚀刻操作和平坦化操作）和后沉积工艺（例如选择性蚀刻操作和/或反向填充操作）。
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10.发明申请公开(公告)号：US20120064226A1
公开(公告)日：2012-03-15
申请号：US13273823
申请日：2011-10-14
Applicant: Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
Inventor： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
CPC classification number: C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
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