Abstract:
The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.
Abstract:
The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.
Abstract:
The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability.
Abstract:
A poly(arylene ether) polymer includes polymer repeat units of the following structure: —(O—Ar1—O—Ar2—O—)m—(—O—Ar3—O—Ar4—O)n— where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0.05 to 0.95, n is 1-m, and at least one of the aryl radicals is grafted to at least one hydroxyalkyl group, such as 2-undecanol. The polymer is especially useful in electrically conductive adhesives.
Abstract:
A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.
Abstract:
In a method for cleaning using terpene compositions, the generation of harmful precipitates is substantially eliminated or significantly reduced by adding a polar solvent, such as isopropyl alcohol, to the terpene composition. One to twenty percent of the cleaning composition should be alcohol, although it is preferred that it be in the five to fifteen percent range. The upper limit reflects primarily the desire to reduce the flammability of the solvent. Alternatively, the electronic devices can be rinsed with a terpene, alcohol mixture, but this alternative is much less preferred because of the flammability problem.
Abstract:
Silicone resin is used by adding, to the uncured silicone resin, platinum suspended in a liquid carrier which is miscible in the silicone resin, the liquid carrier being selected from the group consisting of silicone oil and liquid hydrocarbon materials. The platinum preferably consists of particles of essentially pure platinum, each particle having a diameter of less than ten microns. The ratio of the platinum to the silicone resin is preferably in the range of three to ten parts per million.
Abstract:
Devices are described in which certain crosslinked silicone polymers are incorporated. These polymers have various functions such as encapsulating agents, surface protective agents or agents to index match optical components (e.g. optical fiber, optical waveguide, etc.) to other optical devices or articles. The polymer is a vinyl-terminated dimethyldiphenylsiloxane copolymer crosslinked with tri- or tetrafunctional silanes in the presence of a platinum catalyst. The phenyl group content of the crosslinked silicone copolymer is adjusted to change the index of refraction of the polymer to the optimum for the particular application contemplated. Polymer preparation procedures are described which yield good optical quality for the polymer as well as optimum physical and chemical properties.
Abstract:
An electronic device employs as a dielectric (17) a silicone resin consisting essentially of (a) about twenty-one to twenty-five percent by weight of a silicone resin consisting essentially of dimethylsiloxane, and/or dimethylmethylphenylsiloxane, and/or dimethyl-diphenylsiloxane, (b) about seventy to eighty percent by weight of a silica filler, (c) about 0.5 to 0.7 percent by weight of a tin catalyst, and (d) about 0.057 to 0.26 percent by weight of copper (II) benzoylacetonate.
Abstract:
An electronic device such as an integrated circuit is encapsulated within a silicone resin formulation having a protonated heterocyclic compound contained therein. The compound complexes with free anionic contaminants to form a non-migratory, non-corrosive protonated heterocyclic compound-anion complex, thereby preventing anionic attack of metallic circuit elements.