Highly conductive electrically conductive adhesives
    31.
    发明授权
    Highly conductive electrically conductive adhesives 有权
    高导电性导电胶

    公开(公告)号:US09490043B2

    公开(公告)日:2016-11-08

    申请号:US13403943

    申请日:2012-02-23

    CPC classification number: H01B1/22 C09J9/02

    Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.

    Abstract translation: 本发明提供了一种相对简单的方法,通过使用还原剂的原位纳米颗粒形成和烧结来降低导电粘合剂的电阻率。 发现还原剂通过促进银薄片表面上的脂肪酸的银盐的还原而导致导电粘合剂内的烧结,导致纳米/亚微米银颈部的形成。 这些银颈围绕相邻的银薄片,降低了导电胶粘剂中薄片之间的接触电阻。 还原剂还除去在导电粘合剂中使用的银薄片上通常发现的润滑剂的至少一部分,从而降低了银薄片之间的隧道阻力。

    HIGHLY CONDUCTIVE ELECTRICALLY CONDUCTIVE ADHESIVES
    32.
    发明申请
    HIGHLY CONDUCTIVE ELECTRICALLY CONDUCTIVE ADHESIVES 有权
    高导电性导电粘合剂

    公开(公告)号:US20130056689A1

    公开(公告)日:2013-03-07

    申请号:US13403943

    申请日:2012-02-23

    CPC classification number: H01B1/22 C09J9/02

    Abstract: The present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.

    Abstract translation: 本发明提供了一种相对简单的方法,通过使用还原剂的原位纳米颗粒形成和烧结来降低导电粘合剂的电阻率。 发现还原剂通过促进银薄片表面上的脂肪酸的银盐的还原而导致导电粘合剂内的烧结,导致纳米/亚微米银颈部的形成。 这些银颈围绕相邻的银薄片,降低了导电胶粘剂中薄片之间的接触电阻。 还原剂还除去在导电粘合剂中使用的银薄片上通常发现的润滑剂的至少一部分,从而降低了银薄片之间的隧道阻力。

    Insulator coating and method for forming same
    33.
    发明授权
    Insulator coating and method for forming same 有权
    绝缘子涂层及其形成方法

    公开(公告)号:US07722951B2

    公开(公告)日:2010-05-25

    申请号:US10966963

    申请日:2004-10-15

    Abstract: The present invention is a method of applying Lotus Effect materials as a (superhydrophobicity) protective coating for external electrical insulation system applications, as well as the method of fabricating/preparing Lotus Effect coatings. Selected inorganic or polymeric materials are applied on the insulating material surface, and stable superhydrophobic coatings can be fabricated. Various UV stabilizers and UV absorbers can be incorporated into the coating system to enhance the coating's UV stability.

    Abstract translation: 本发明是将莲花效应材料应用于外部电绝缘系统应用的(超疏水性)保护涂层的方法以及制备/制备莲花效应涂层的方法。 选择的无机或聚合物材料被施加在绝缘材料表面上,并且可以制造稳定的超疏水涂层。 可以将各种UV稳定剂和UV吸收剂掺入涂料体系中以增强涂料的UV稳定性。

    Reworkable high temperature adhesives
    35.
    发明授权
    Reworkable high temperature adhesives 失效
    可重复使用的高温胶粘剂

    公开(公告)号:US06380322B1

    公开(公告)日:2002-04-30

    申请号:US09335082

    申请日:1999-06-17

    Abstract: A reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.

    Abstract translation: 一种可再加工的高温粘合剂,其包含(a)选自聚醚酰亚胺,聚酰胺 - 酰亚胺,聚砜,聚醚砜,硅 - 碳热固性材料,聚苯硫醚及其混合物的热塑性粘合剂的反应产物; (b)金属丙酮酸酯; (c)环氧树脂; (d)交联剂; (e)和催化剂。

    Terpene-based method for removing flux residues from electronic devices
    36.
    发明授权
    Terpene-based method for removing flux residues from electronic devices 失效
    用于从电子设备中去除助焊剂残留物的基于萜烯的方法

    公开(公告)号:US5614032A

    公开(公告)日:1997-03-25

    申请号:US285679

    申请日:1994-08-04

    Inventor: Ching-Ping Wong

    Abstract: In a method for cleaning using terpene compositions, the generation of harmful precipitates is substantially eliminated or significantly reduced by adding a polar solvent, such as isopropyl alcohol, to the terpene composition. One to twenty percent of the cleaning composition should be alcohol, although it is preferred that it be in the five to fifteen percent range. The upper limit reflects primarily the desire to reduce the flammability of the solvent. Alternatively, the electronic devices can be rinsed with a terpene, alcohol mixture, but this alternative is much less preferred because of the flammability problem.

    Abstract translation: 在使用萜烯组合物进行清洁的方法中,通过向萜烯组合物中加入极性溶剂如异丙醇,基本上消除了或显着降低了有害沉淀物的产生。 清洁组合物的一至二十%应为酒精,尽管优选在百分之五至十五。 上限主要反映了降低溶剂易燃性的愿望。 或者,可以用萜烯,醇混合物冲洗电子器件,但是由于易燃性问题,这种替代方案不太优选。

    Method for curing silicone resins
    37.
    发明授权
    Method for curing silicone resins 失效
    硅树脂固化方法

    公开(公告)号:US5438112A

    公开(公告)日:1995-08-01

    申请号:US259101

    申请日:1994-06-13

    Inventor: Ching-Ping Wong

    CPC classification number: C08K3/08 C08L83/04 C08G77/06 C08G77/70

    Abstract: Silicone resin is used by adding, to the uncured silicone resin, platinum suspended in a liquid carrier which is miscible in the silicone resin, the liquid carrier being selected from the group consisting of silicone oil and liquid hydrocarbon materials. The platinum preferably consists of particles of essentially pure platinum, each particle having a diameter of less than ten microns. The ratio of the platinum to the silicone resin is preferably in the range of three to ten parts per million.

    Abstract translation: 通过向未固化的有机硅树脂中加入悬浮在可与硅树脂混溶的液体载体中的铂,使用硅氧烷树脂,液体载体选自硅油和液体烃材料。 铂优选由基本上纯铂的颗粒组成,每个颗粒的直径小于10微米。 铂与硅酮树脂的比例优选为百万分之三到十份。

    Devices featuring silicone elastomers
    38.
    发明授权
    Devices featuring silicone elastomers 失效
    具有硅橡胶的设备

    公开(公告)号:US5266352A

    公开(公告)日:1993-11-30

    申请号:US998106

    申请日:1992-12-30

    CPC classification number: C08K5/5419

    Abstract: Devices are described in which certain crosslinked silicone polymers are incorporated. These polymers have various functions such as encapsulating agents, surface protective agents or agents to index match optical components (e.g. optical fiber, optical waveguide, etc.) to other optical devices or articles. The polymer is a vinyl-terminated dimethyldiphenylsiloxane copolymer crosslinked with tri- or tetrafunctional silanes in the presence of a platinum catalyst. The phenyl group content of the crosslinked silicone copolymer is adjusted to change the index of refraction of the polymer to the optimum for the particular application contemplated. Polymer preparation procedures are described which yield good optical quality for the polymer as well as optimum physical and chemical properties.

    Abstract translation: 描述了其中掺入某些交联的硅氧烷聚合物的装置。 这些聚合物具有各种功能,例如封装剂,表面保护剂或试剂,以将光学组件(例如光纤,光波导等)分配到其它光学装置或制品。 聚合物是在铂催化剂存在下与三官能或四官能硅烷交联的乙烯基封端的二甲基二苯基硅氧烷共聚物。 调整交联的硅氧烷共聚物的苯基含量以将聚合物的折射率改变为对于所考虑的具体应用的最佳值。 描述了聚合物制备方法,其为聚合物产生良好的光学质量以及最佳的物理和化学性质。

    Silicone material
    39.
    发明授权
    Silicone material 失效
    硅胶材料

    公开(公告)号:US5085913A

    公开(公告)日:1992-02-04

    申请号:US515963

    申请日:1990-04-27

    Inventor: Ching-Ping Wong

    Abstract: An electronic device employs as a dielectric (17) a silicone resin consisting essentially of (a) about twenty-one to twenty-five percent by weight of a silicone resin consisting essentially of dimethylsiloxane, and/or dimethylmethylphenylsiloxane, and/or dimethyl-diphenylsiloxane, (b) about seventy to eighty percent by weight of a silica filler, (c) about 0.5 to 0.7 percent by weight of a tin catalyst, and (d) about 0.057 to 0.26 percent by weight of copper (II) benzoylacetonate.

    Abstract translation: 电子器件采用电介质(17),硅树脂基本上由(a)约二十一至二十五重量%的基本上由二甲基硅氧烷和/或二甲基甲基苯基硅氧烷组成的有机硅树脂和/或二甲基 - 二苯基硅氧烷 ,(b)二氧化硅填料的约百分之七十至八十重量百分比,(c)约0.5-0.7重量%的锡催化剂,和(d)约0.057-0.26重量%的苯甲酰丙酮铜(Ⅱ)。

    Encapsulated electronic devices and encapsulating compositions
    40.
    发明授权
    Encapsulated electronic devices and encapsulating compositions 失效
    封装的电子器件和封装组合物

    公开(公告)号:US4396796A

    公开(公告)日:1983-08-02

    申请号:US202286

    申请日:1980-10-30

    Inventor: Ching-Ping Wong

    CPC classification number: H01B3/46 C08K5/35

    Abstract: An electronic device such as an integrated circuit is encapsulated within a silicone resin formulation having a protonated heterocyclic compound contained therein. The compound complexes with free anionic contaminants to form a non-migratory, non-corrosive protonated heterocyclic compound-anion complex, thereby preventing anionic attack of metallic circuit elements.

    Abstract translation: 诸如集成电路的电子器件封装在其中含有质子化杂环化合物的硅树脂制剂中。 该化合物与游离的阴离子污染物复合形成非迁移性,非腐蚀性的质子化杂环化合物 - 阴离子络合物,从而防止金属电路元件的阴离子侵袭。

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