公开(公告)号：US20190244729A1

公开(公告)日：2019-08-08

申请号：US16362862

申请日：2019-03-25

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: H01B17/30 ,  B23K1/00 ,  H01B19/02 ,  B23K1/008 ,  B23K1/19 ,  B23K26/32 ,  A61N1/375 ,  C04B41/00 ,  C04B41/51 ,  C04B41/88 ,  C04B41/45 ,  B23K26/21

CPC classification number: H01B17/30 ,  A61N1/3754 ,  B22F7/04 ,  B22F7/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K26/21 ,  B23K26/32 ,  B23K2101/36 ,  B23K2103/14 ,  C04B41/0072 ,  C04B41/4578 ,  C04B41/5122 ,  C04B41/5177 ,  C04B41/5194 ,  C04B41/88 ,  H01B19/02

Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

公开(公告)号：US20190217086A1

公开(公告)日：2019-07-18

申请号：US16364953

申请日：2019-03-26

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  A61N1/37 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/00 ,  H05K9/00 ,  A61N1/375 ,  H01G4/35 ,  H05K1/18 ,  H01G4/06 ,  H05K5/00 ,  H03H7/01

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K999/99 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US10249415B2

公开(公告)日：2019-04-02

申请号：US15863194

申请日：2018-01-05

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/37 ,  B23K1/00 ,  B23K35/00 ,  C04B41/45 ,  H01B17/30 ,  A61N1/375 ,  C04B41/51 ,  C04B41/88 ,  H01B19/02 ,  C04B41/00 ,  B23K1/008 ,  B23K1/19 ,  B23K26/32 ,  B23K26/21 ,  B22F7/04 ,  B23K101/36 ,  B23K103/14

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.

公开(公告)号：US20180326206A1

公开(公告)日：2018-11-15

申请号：US16045035

申请日：2018-07-25

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  A61N1/37 ,  A61N1/375 ,  H01G4/35 ,  H05K1/18 ,  H01G4/06

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K999/99 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US20180197661A1

公开(公告)日：2018-07-12

申请号：US15863194

申请日：2018-01-05

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: H01B17/30 ,  A61N1/375 ,  C04B41/51 ,  C04B41/45 ,  C04B41/00 ,  C04B41/88 ,  H01B19/02

CPC classification number: H01B17/30 ,  A61N1/3754 ,  B22F7/04 ,  B22F7/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K26/21 ,  B23K26/32 ,  B23K2101/36 ,  B23K2103/14 ,  C04B41/0072 ,  C04B41/4578 ,  C04B41/5122 ,  C04B41/5177 ,  C04B41/5194 ,  C04B41/88 ,  H01B19/02

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.

公开(公告)号：US09656064B2

公开(公告)日：2017-05-23

申请号：US14316896

申请日：2014-06-27

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Warren S. Dabney ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/00 ,  A61N1/08 ,  A61N1/05 ,  H01F17/02 ,  H03H1/00

Abstract: A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.

公开(公告)号：US20170087356A1

公开(公告)日：2017-03-30

申请号：US15375315

申请日：2016-12-12

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  A61N1/375 ,  H03H1/00 ,  A61N1/37

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  A61N2001/086 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the Insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. There is also an active path electrically extending between the active end metallization of the chip capacitor and the lead wire. The active path comprises at least a first electrical connection material connected directly to both the second gold braze and the lead wire, and the first electrical connection material is electrically connected to the active end metallization of the chip capacitor.

公开(公告)号：US20170087354A1

公开(公告)日：2017-03-30

申请号：US15373139

申请日：2016-12-08

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  H01G4/40 ,  H01G4/35 ,  A61N1/375 ,  H03H1/00 ,  H03H7/01 ,  H05K1/18 ,  A61N1/37 ,  H01R13/7195 ,  H05K5/00

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  A61N2001/086 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US09492659B2

公开(公告)日：2016-11-15

申请号：US14182569

申请日：2014-02-18

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: H01R43/00 ,  A61N1/08 ,  A61N1/05 ,  H01G4/35 ,  H01G2/10 ,  H01G4/005 ,  H01G4/12 ,  H01G4/40 ,  H02G3/22 ,  A61N1/372 ,  A61N1/375 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

公开(公告)号：US20160263373A1

公开(公告)日：2016-09-15

申请号：US15163241

申请日：2016-05-24

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Robert Shawn Johnson ,  Warren S. Dabney ,  Thomas Marzano ,  Richard L. Brendel ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Keith W. Seitz ,  John E. Roberts

IPC: A61N1/08 ,  A61N1/375 ,  H01G4/35 ,  H01G4/30 ,  H01G4/005 ,  A61N1/37 ,  H01G4/12

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3754 ,  A61N1/3758 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H03H1/0007

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

Abstract translation: AIMD包括导电壳体，具有绝缘体的导电套圈密封密封套圈开口。 导电通路密封并通过绝缘体设置。 滤波电容器设置在壳体内的电路板上，并且具有支撑交错的至少两个有源和两个接地电极板的电介质体，其中至少两个有源电极板电连接到器件侧的导电路径，以及 所述至少两个接地电极板电耦合到套圈和/或导电壳体。 电介质体的介电常数小于1000，电容为10至20,000皮​​法。 滤波电容器被配置为通过低ESR对MRI高RF脉冲功率进行EMI滤波，其中以RF射频脉冲频率或频率范围的滤波电容器的ESR小于2.0欧姆。