中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

75 records (took 0.018 seconds)

    MIXING CHAMBER FOR LAUNDRY SUPPLIES
    31.
    发明申请
    MIXING CHAMBER FOR LAUNDRY SUPPLIES 审中-公开

    公开(公告)号：US20190003097A1

    公开(公告)日：2019-01-03

    申请号：US16064188

    申请日：2016-04-08

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Michael W Cumbie ,  David Olsen ,  Diane R Hammerstad ,  Eric M Laplante

    IPC: D06F33/02 ,  D06F39/02

    Abstract: Example implementations relate to a mixing chamber for laundry supplies. For example, an appliance may include a mixing chamber to receive at least one laundry supply and a processor coupled to the mixing chamber. The processor is to identify a user-specified setting associated with a laundry load, determine a characteristic of the laundry load, calculate an amount of the at least one laundry supply to apply to the laundry load based on the user-specified setting and the characteristic, and provide the amount of the at least one laundry supply to the mixing chamber, where the mixing chamber is to mix the amount of the at least one laundry supply.

    Wide array printhead module
    33.
    发明授权
    Wide array printhead module 有权

    公开(公告)号：US10046562B2

    公开(公告)日：2018-08-14

    申请号：US15518306

    申请日：2014-10-28

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Peter James Fricke ,  Michael W Cumbie ,  Scott A Linn

    IPC: B41J29/38 ,  B41J2/15 ,  B41J2/045

    Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

    Microfluidic devices
    37.
    发明授权
    Microfluidic devices 有权

    公开(公告)号：US11583861B2

    公开(公告)日：2023-02-21

    申请号：US16605675

    申请日：2017-10-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Viktor Shkolnikov ,  Michael W Cumbie ,  Chien-Hua Chen

    IPC: B81B3/00 ,  G01N35/10 ,  B01L3/00

    Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

    Fluid property sensor
    39.
    发明授权
    Fluid property sensor 有权

    公开(公告)号：US11318750B2

    公开(公告)日：2022-05-03

    申请号：US16605088

    申请日：2017-10-18

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Anthony D. Studer

    IPC: B41J2/175

    Abstract: In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.

    MOLDED STRUCTURES WITH CHANNELS
    40.
    发明申请
    MOLDED STRUCTURES WITH CHANNELS 有权

    公开(公告)号：US20220111647A1

    公开(公告)日：2022-04-14

    申请号：US17312360

    申请日：2019-06-25

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Michael G Groh

    IPC: B41J2/16 ,  B41J2/18 ,  B41J2/14

    Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

Patent Agency Ranking