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公开(公告)号:US10300701B2
公开(公告)日:2019-05-28
申请号:US15890058
申请日:2018-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie
Abstract: In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.
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公开(公告)号:US20190145896A1
公开(公告)日:2019-05-16
申请号:US16097922
申请日:2016-07-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Devin A. Mourey
Abstract: An apparatus may include a frame layer having a recess, a substrate secured to the frame layer at least partially across the recess and a surface enhanced luminescence (SEL) stage supported by the substrate within the recess.
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公开(公告)号:US20190126631A1
公开(公告)日:2019-05-02
申请号:US16094138
申请日:2016-04-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Daryl E. Anderson , James Michael Gardner , Scott A. Linn , Michael W. Cumbie , Berkeley Fisher
IPC: B41J2/175
Abstract: An example printing cartridge includes a fluid container, a plurality of capacitor plates to detect fluid in the fluid container, each of the capacitor plates associated with a respective fluid level, and a shift register to capture fluid level information from the plurality of capacitor plates.
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公开(公告)号:US20190118540A1
公开(公告)日:2019-04-25
申请号:US16092547
申请日:2016-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Devin Alexander Mourey
Abstract: A fluid level sensing device includes a substrate (210) and a sensing die (216) cantilevered at one end from the substrate. A number of sensing components (218), preferably thermal or impedance sensing components, are disposed on the sensing die and detect a fluid level in a fluid reservoir. A protective member (208) is also cantilevered at one end from the substrate alongside the sensing die. Electrical interconnects (212) output data collected from the number of sensing components. A number of sensing dies may be provided to lengthen the sensing device, in which case the protective cover extends alongside and parallel to the number of sensing dies.
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公开(公告)号:US20190111696A1
公开(公告)日:2019-04-18
申请号:US16094113
申请日:2016-04-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Daryl E. Anderson , Michael W. Cumbie , James Michael Gardner , Berkeley Fisher
IPC: B41J2/175
Abstract: An example printing cartridge includes a sensing die including a plurality of sensing locations in thermal contact with a fluid container, an on-die controller to select a sensing location of the plurality of sensing locations to activate and to provide a variable threshold voltage, and a voltage comparator to compare a sensed voltage generated at a selected sensing location to the variable threshold voltage, and output time-based information based on the comparison, the time-based information representative of whether a fluid is present at a fluid level associated with the selected sensing location.
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公开(公告)号:US10220620B2
公开(公告)日:2019-03-05
申请号:US15850174
申请日:2017-12-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie
Abstract: In one example, a printhead structure includes multiple printhead dies and a printed circuit board embedded in a single monolithic molding with fully encapsulated wire bonds that electrically connect the dies to conductive routing in the printed circuit board. Fluid may pass through a slot in the molding directly to the dies.
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公开(公告)号:US10207497B2
公开(公告)日:2019-02-19
申请号:US15986593
申请日:2018-05-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Garrett E. Clark , Mark H. MacKenzie
IPC: B41J2/045
Abstract: Selecting nozzles can include selecting nozzles of a plurality of nozzles to print a portion of a print job based on content of the print job and assigning firing reservations to the selected nozzles, where a total number of the firing reservations assigned to the selected nozzles is comparatively less than a total number of the plurality of nozzles.
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公开(公告)号:US10195851B2
公开(公告)日:2019-02-05
申请号:US15632224
申请日:2017-06-23
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Silam J. Choy
Abstract: A print bar may include a mounting structure and a printhead mounted to the mounting structure. The printed may include multiple printhead dies molded into a monolithic body and arranged parallel to one another in the body. The body may have multiple channels therein through which printing fluid may pass directly to the dies.
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公开(公告)号:US20180333956A1
公开(公告)日:2018-11-22
申请号:US16050912
申请日:2018-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Arun K. Agarwal
CPC classification number: B41J2/1632 , B29C69/001 , B41J2/14016 , B41J2/1404 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1607 , B41J2/162 , B41J2/1623 , B41J2/1628 , B41J2/1637 , B41J2/1645 , B41J2002/14419 , B41J2002/14491 , B41J2202/19 , B41J2202/20 , H05K1/186 , H05K3/284 , H05K3/32 , H05K3/4007 , H05K2203/0228 , H05K2203/1316
Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.
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公开(公告)号:US20180319655A1
公开(公告)日:2018-11-08
申请号:US15772377
申请日:2016-02-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Garrett E. Clark , Michael W. Cumbie , Chien-Hua Chen
CPC classification number: B81B7/0083 , B01L3/5027 , B01L3/502707 , B01L3/50273 , B01L3/502784 , B01L2300/0867 , B01L2300/087 , B01L2300/088 , B01L2300/1827 , B01L2300/1894 , B01L2400/0442 , B01L2400/046 , B41J2/1433 , B81B1/006 , B81B2203/0338 , B81C1/00119 , F04B19/006 , F04B43/046
Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
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