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44 条记录 (耗时 0.026 秒)

    Photo-interrupter and manufacturing method thereof
    31.
    发明申请
    Photo-interrupter and manufacturing method thereof 审中-公开
    光电断路器及其制造方法

    公开(公告)号：US20050056796A1

    公开(公告)日：2005-03-17

    申请号：US10910636

    申请日：2004-08-04

    申请人： Teruo Takeuchi

    发明人： Teruo Takeuchi

    IPC分类号： H01L31/12 ,  H03K17/94 ,  G02B27/00

    CPC分类号： H03K17/941 ,  H03K2217/94104

    摘要： A photo-interrupter includes a light-emitting-side internal device provided with a light-emitting chip and formed by molding, and a light-receiving-side internal device provided with a light-receiving chip and formed by molding. The light-emitting-side internal device has a light output face, and the light-receiving-side internal device has a light input face. The light-emitting-side internal device and the light-receiving-side internal device are held by a casing, such that the light output face and the light input face are opposite to each other with a gap interposed therebetween. The light output face and the light input face are respectively disposed in first and second slits formed in the casing. The light output face and the light input face are respectively flush with surfaces of the casing around the first and second slits.

    摘要翻译： 光断续器包括设置有发光芯片并通过模制形成的发光侧内部装置，以及设置有受光芯片并通过模制形成的光接收侧内部装置。 发光侧内部装置具有光输出面，受光侧内部装置具有光输入面。 发光侧内部装置和受光侧内部装置由壳体保持，使得光输出面和光输入面彼此相对并间隔开。 光输出面和光输入面分别设置在形成在壳体中的第一和第二狭缝中。 光输出面和光输入面分别与第一和第二狭缝周围的壳体的表面齐平。

    Resin composition
    32.
    发明授权
    Resin composition 失效
    树脂组成

    公开(公告)号：US4312796A

    公开(公告)日：1982-01-26

    申请号：US85054

    申请日：1979-10-15

    申请人： Toshiaki Kobayashi ,  Teruo Takeuchi ,  Mamoru Nakamura

    发明人： Toshiaki Kobayashi ,  Teruo Takeuchi ,  Mamoru Nakamura

    IPC分类号： C08K13/02 ,  C08L27/06 ,  C08L51/04 ,  C08L55/02 ,  C08K5/09 ,  C08K3/32

    CPC分类号： C08L27/06 ,  C08K13/02 ,  C08L55/02 ,  C08L51/04

    摘要： A resin composition which does not substantially corrode molds, said composition being obtained by blending(I) 100 parts by weight of a resin composition composed of 5 to 80% by weight of (A) an acrylonitrile-butadiene-styrene copolymer resin or a methacrylic ester-butadiene-styrene copolymer resin and 95 to 20% by weight of (B) a vinyl chloride resin obtained by polymerizing vinyl chloride or a monomeric mixture composed mainly of vinyl chloride in the presence of a cycloolefin compound, with(II) 0.5 to 15 parts by weight of (C) a lead-type stabilizer comprising an inorganic acid salt of lead and an organic acid salt of lead in a weight ratio of from 1:10 to 15:1 or (D) a tin-type stabilizer comprising an alkyltin maleate and an alkyltin mercaptide in a weight ratio of from 1:10 to 15:1.

    摘要翻译： 所述组合物通过将（I）100重量份由5-80重量％的（A）丙烯腈 - 丁二烯 - 苯乙烯共聚物树脂或甲基丙烯酸甲酯组成的树脂组合物 酯 - 丁二烯 - 苯乙烯共聚物树脂和95〜20重量％的（B）通过在环烯烃化合物存在下将氯乙烯或主要由氯乙烯组成的单体混合物与（II）0.5聚合而得到的氯乙烯树脂， 15重量份的（C）包含铅的无机酸盐和铅的有机酸盐的重量比为1:10至15:1的铅型稳定剂，或（D）包含 马来酸烷基锡和重量比为1:10至15:1的烷基锡硫醇盐。

    SEMICONDUCTOR LIGHT EMITTING DEVICE
    33.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
    半导体发光器件

    公开(公告)号：US20130307014A1

    公开(公告)日：2013-11-21

    申请号：US13614779

    申请日：2012-09-13

    申请人： Mami Yamamoto ,  Kazuhiro Inoue ,  Yasunori Nagahata ,  Teruo Takeuchi ,  Hidenori Egoshi

    发明人： Mami Yamamoto ,  Kazuhiro Inoue ,  Yasunori Nagahata ,  Teruo Takeuchi ,  Hidenori Egoshi

    IPC分类号： H01L33/52

    CPC分类号： H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0095 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    摘要： According to an embodiment, a semiconductor light emitting device includes a insulating base and a semiconductor light emitting element and resin. The insulating base includes a first face, a second face opposite to the first face, and a side face connecting to the first face and the second face, a recess portion being provided on the side face extending from the first face to the second face. The insulating base also includes a first metal layer blocking an opening of the recess portion, a second metal layer on an inner face of the recess portion, and a third metal layer on the second face, the third metal being electrically connected to the first metal layer via the second metal layer. A semiconductor light emitting element is fixed on the first face; and resin covers the first face and seals the semiconductor light emitting element.

    摘要翻译： 根据实施例，半导体发光器件包括绝缘基底和半导体发光元件和树脂。 所述绝缘底座包括第一面，与所述第一面相反的第二面以及与所述第一面和所述第二面连接的侧面，在从所述第一面向所述第二面延伸的侧面设置有凹部。 绝缘基底还包括阻挡凹部的开口的第一金属层，凹部的内表面上的第二金属层和第二面上的第三金属层，第三金属电连接到第一金属 层经由第二金属层。 半导体发光元件固定在第一面上; 并且树脂覆盖第一面并密封半导体发光元件。