公开(公告)号：US20050268457A1

公开(公告)日：2005-12-08

申请号：US11111935

申请日：2005-04-22

申请人： Hiroshi Ebihara ,  Ken Kobayashi ,  Hiroshi Nasu ,  Daido Komyoji

发明人： Hiroshi Ebihara ,  Ken Kobayashi ,  Hiroshi Nasu ,  Daido Komyoji

IPC分类号： H05K13/04 ,  B23P19/00 ,  H01L21/60 ,  H05K13/08

CPC分类号： H05K13/0413 ,  H01L24/75 ,  H01L2924/12041 ,  H01L2924/12042 ,  H05K13/0409 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53196 ,  H01L2924/00

摘要： The electronic component mounting apparatus has a board holding part for holding a circuit board, a mounting mechanism for mounting an electronic component on the circuit board, and a grinding part for grinding a suction surface of a suction nozzle of the mounting mechanism. After mounting of the electronic components on the circuit board are repeated a predetermined number of times, the suction surface is ground. In the electronic component mounting apparatus, by continuously moving the suction nozzle in the Y-direction relative to the grinding part and moving the suction nozzle up and down, and bringing the suction surface of the suction nozzle in intermittent contact with the grinding surface of the grinding member with ultrasonic vibrations applied, the suction surface can be ground while preventing the occurrence of a large deformation of the suction nozzle.

摘要翻译： 电子部件安装装置具有用于保持电路板的板保持部，用于将电子部件安装在电路基板上的安装机构和用于研磨安装机构的吸嘴的吸引面的研磨部。 将电子部件安装在电路板上重复预定次数之后，将吸入面研磨。 在电子部件安装装置中，通过使吸嘴相对于研磨部在Y方向上连续移动，并且使吸嘴上下移动，使吸嘴的吸引表面与 通过施加超声波振动的研磨部件，能够吸引吸入面，同时防止吸嘴发生大的变形。

公开(公告)号：US20050034302A1

公开(公告)日：2005-02-17

申请号：US10891524

申请日：2004-07-15

申请人： Naoto Hosotani ,  Kazuki Fukada ,  Keiichi Iwata ,  Daido Komyoji

发明人： Naoto Hosotani ,  Kazuki Fukada ,  Keiichi Iwata ,  Daido Komyoji

IPC分类号： B23K3/08 ,  H05K3/34 ,  H05K3/30

CPC分类号： B23K3/087 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12042 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/1121 ,  H05K2203/1581 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261 ,  H01L2924/00014 ,  H01L2924/00

摘要： When a component that has a connection portion to be connected to the electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than the fusing point of a connection material for connecting the electrode of the board with the connection portion is connected to the board with interposition of the connection material between the electrode of the board and the connection portion, a cooling member is brought in contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and the quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, carrying out the fusing of the connection material while preventing the occurrence of thermal damage to the weak heat-resistant portion.

摘要翻译： 当具有要连接到板的电极的连接部分和具有比用于将板的电极连接到连接部分的连接材料的熔点低的耐热性能的弱耐热部分的部件 通过在板的电极和连接部之间插入连接材料而连接到板，通过加热连接材料来加热连接材料，冷却部件与弱的耐热部分或其邻近部分接触 与放置构件接触，并且经由基板传导到弱耐热部的热量通过被传导到冷却构件而被减少，进行连接材料的熔合同时防止对弱的热损伤的发生 耐热部分。

公开(公告)号：US06673386B2

公开(公告)日：2004-01-06

申请号：US09892737

申请日：2001-06-28

申请人： Daido Komyoji ,  Naoko Matsuda ,  Akira Fukano ,  Katsutoshi Ogawa ,  Akira Kumon ,  Hiroyuki Naka

发明人： Daido Komyoji ,  Naoko Matsuda ,  Akira Fukano ,  Katsutoshi Ogawa ,  Akira Kumon ,  Hiroyuki Naka

IPC分类号： B05D314

CPC分类号： H05K3/102 ,  H01J9/02 ,  H01J2217/49207 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method for forming a pattern on a surface of a panel substrate, includes electrically charging pattern-forming material particles, jetting out the electrically charged pattern-forming material particles through a nozzle by applying electrostatic force to the pattern-forming material particles to form a pattern, and fixing the pattern onto the panel substrate.

摘要翻译： 一种用于在面板基板的表面上形成图案的方法，包括对图案形成材料颗粒进行充电，通过对图案形成材料颗粒施加静电力，通过喷嘴喷射带电图案形成材料颗粒，形成 图案，并将图案固定在面板基板上。