摘要:
A DC-DC converter includes a regeneration preventing circuit to bring a synchronous rectifying switching element to an OFF-state when an output of an error amplifier is lower than a lower-limit potential of a triangular-wave signal, that is, when the output of the error amplifier deviates from a voltage range of the triangular-wave signal in a side (direction), which would cause a smaller ON duty ratio of a main switching element. This configuration prevents a rise of voltage in an input side due to a regenerative operation at startup when a pre-bias voltage exists. Also, the configuration prevents fluctuations of an output voltage at a sudden change of a load current and a drop of the output voltage at transition from a soft start state to a normal operation state when the load current is small.
摘要:
The invention is directed to enhancement of performance of a back surface incident type semiconductor device having a light receiving element and a manufacturing method thereof without increasing a manufacturing cost. A supporting body is attached to a front surface of a semiconductor substrate formed with a light receiving element and its pad electrode. Then, the supporting body is etched to form a via hole penetrating the supporting body and exposing the pad electrode. Then, a wiring connected to the pad electrode and extending onto a front surface of the supporting body through the via hole is formed. Lastly, the semiconductor substrate is separated into a plurality of semiconductor dies by dicing. The semiconductor device is mounted so that the supporting body faces a circuit board.
摘要:
A stacked MCM is manufactured at reduced cost without using expensive apparatus. A first wiring and a second wiring are formed on a surface of a semiconductor chip of a first semiconductor device through an insulation film. A glass substrate having an opening to expose the second wiring is bonded to the surface of the semiconductor chip on which the first wiring and the second wiring are formed. A third wiring is disposed on a back surface and a side surface of the semiconductor chip through an insulation film and connected to the first wiring. And a conductive terminal of another semiconductor device is connected to the second wiring through the opening.
摘要:
A method for manufacturing a porous structured material comprises the steps of: preparing a reactant solution that contains a metal compound and a surfactant, coating a substrate with the reactant solution, and holding the substrate in an atmosphere containing water vapor. In a thin film of an oxide having a porous structure, a surfactant is retained in the pores, and the pore walls contain tin oxide crystals.
摘要:
To reuse glass used in a flat panel display, processing suitable for global environment such as processing of separating a lead component must be realized. A disassembly processing method for a flat panel display having a structure in which a face plate and rear plate mainly containing glass are airtightly joined via a frame with frit glass is characterized by including the step of separating the face plate and rear plate joined with the frit glass. The separation step is characterized by separating the face plate and rear plate by cutting, dissolution, or melting.
摘要:
A piezoelectric transformer inverter includes an inverter unit and a step-down chopper unit. The inverter unit includes a ceramic piezoelectric transformer whose secondary terminal is to be connected to a fluorescent tube, a drive unit which is connected to a primary terminal of the ceramic piezoelectric transformer, and an inverter control circuit for controlling luminance of the fluorescent tube to a desired value. The step-down chopper unit includes a switching device which is disposed on the side where the voltage of the inverter unit is input, a free wheeling device connected between the switching device and a reference potential, and a PWM feedback control circuit for providing a feedback control to maintain an average voltage of the rectangular-wave voltage of the switching device constant. In the piezoelectric transformer inverter, even when the feedback control by the PWM feedback control circuit is impossible, the on-duty of the chopper unit is restricted so that it is not greater than a given amount.
摘要:
An aromatic polyamide resin composition useful for producing compression-molded resin articles having an excellent impact strength, comprising 3 to 40% by weight of PEEK resin fibers, the balance consisting of an aromatic polyamide resin particles, and optionally, 10% by weight or less of PTFE resin particles, which effectively enhance the abrasion resistance of the compression-molded resin article.
摘要:
A process for preparing aromatic polyamides which comprising contacting (I) a solution or dispersion consisting of a solution or dispersion in a polar, non-basic and inert organic liquid medium of at least one starting material selected from the group consisting ofI. an aromatic aminocarboxylic acid halide hydrohalogenide,Ii. a mixture of an aromatic dicarboxylic acid halide and an aromatic diamine dihydrohalogenide, andIii. a low molecular weight aromatic polyamide having an inherent viscosity of no greater than 0.2 as measured on a solution of 0.5 gram of the polyamide in 100 ml of concentrated sulfuric acid at 30.degree.C., with(II) an aqueous slurry consisting of a dispersion in water of a sodium carbonate hydrate.
摘要:
A packaged semiconductor device is manufactured by a simplified manufacturing process, and is reduced in cost, in thickness and in size. A device component and a pad electrode connected with the device component are formed on a semiconductor substrate. A supporter is bonded to a top surface of the semiconductor substrate through an adhesive layer. Then, there is formed a protection layer that has an opening at a location corresponding to the pad electrode and covers a side surface and a back surface of the semiconductor substrate. A conductive terminal is formed on the pad electrode at the location corresponding to the opening formed in the protection layer. No wiring layer or conductive terminal is formed on the back surface of the semiconductor substrate. A conductive terminal is formed on a periphery of the supporter outside of and next to the side surface of the semiconductor substrate.
摘要:
A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are disposed in a cavity provided in the insulating substrate so that the ends face each other. The discharge electrodes are electrically connected to the circuit elements and or the wiring pattern.