公开(公告)号：US5864062A

公开(公告)日：1999-01-26

申请号：US864074

申请日：1997-05-28

申请人： Teruaki Nagahara ,  Hiroshi Otani

发明人： Teruaki Nagahara ,  Hiroshi Otani

IPC分类号： B81C1/00 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  H01L29/84 ,  G01P15/00

CPC分类号： B81C1/0023 ,  G01P1/023 ,  G01P15/125 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025

摘要： A semiconductor acceleration sensor comprises a semiconductor sensor chip for detecting acceleration and an IC chip for processing the signal from this sensor chip, the IC chip is bonded to the sensor chip, the sensor chip is mounted to a die pad, electrical connection is established by lead wires connected to lead terminals, and a package is formed by molding with resin wherein the die pad is electrically connected to a particular lead terminal by a lead wire and is grounded by the particular lead terminal, and the die pad is positioned remote from the mounting surface of the package.

摘要翻译： 半导体加速度传感器包括用于检测加速度的半导体传感器芯片和用于处理来自该传感器芯片的信号的IC芯片，IC芯片被结合到传感器芯片，传感器芯片安装在芯片焊盘上，电连接通过 引线连接到引线端子，并且通过用树脂模制形成封装，其中管芯焊盘通过引线电连接到特定引线端子并且由特定引线端子接地，并且管芯焊盘定位成远离 安装表面的包装。

公开(公告)号：US5726576A

公开(公告)日：1998-03-10

申请号：US630817

申请日：1996-04-10

申请人： Tomoyuki Miyata ,  Hiroshi Otani

发明人： Tomoyuki Miyata ,  Hiroshi Otani

IPC分类号： G01R29/08 ,  G01R31/12 ,  G01R31/08

CPC分类号： G01R31/12 ,  G01R29/0871 ,  G01R29/0892

摘要： A microwave sensor includes a case 1 of an object apparatus in which a discharge may occur; the object apparatus 2; an antenna 3 which is attached to the object apparatus case 1 and receives a microwave signal generated by a discharge; a signal processing unit 4 which is connected to the antenna 3, amplifies and detects the microwave signal, and amplifies the detected video signal; and an output terminal 13 through which the video signal is output.

摘要翻译： 微波传感器包括其中可能发生放电的物体设备的壳体1; 对象装置2; 天线3，其附接到对象设备壳体1并接收由放电产生的微波信号; 连接到天线3的信号处理单元4放大和检测微波信号，并放大检测到的视频信号; 以及输出端子13，通过该输出端子输出视频信号。

公开(公告)号：US5656776A

公开(公告)日：1997-08-12

申请号：US541301

申请日：1995-10-10

申请人： Hiroshi Otani

发明人： Hiroshi Otani

IPC分类号： H01L29/84 ,  B81B7/00 ,  G01P1/02 ,  G01P15/08 ,  H01L23/04

CPC分类号： B81B7/0058 ,  G01P1/02 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/16152

摘要： A semiconductor sensor in a sealed cap package includes a sensing device for transducing a physical quantity into an electrical signal, a stem on which the sensing device is mounted, the stem including through holes in which electrically conducting leads are respectively mounted with electrically insulating sealing members, a cap covering the sensing device and mounted on the stem, and at least one rod extending from a back surface of the stem parallel to the leads for securing the semiconductor sensor to a mount.

摘要翻译： 密封盖封装中的半导体传感器包括用于将物理量转换成电信号的感测装置，其上安装有感测装置的杆，所述杆包括通孔，导电引线分别安装有电绝缘密封构件 ，覆盖感测装置并安装在杆上的盖以及从杆的后表面平行于引线延伸的至少一个杆，用于将半导体传感器固定到安装座上。

公开(公告)号：US5460653A

公开(公告)日：1995-10-24

申请号：US161693

申请日：1993-12-03

申请人： Hiroshi Otani ,  Naotoshi Fukushima ,  Yoshihisa Yamazaki

发明人： Hiroshi Otani ,  Naotoshi Fukushima ,  Yoshihisa Yamazaki

IPC分类号： B05B13/04 ,  B23K1/20 ,  H05K3/34 ,  H05K13/04 ,  B05B3/00 ,  B05C11/00

CPC分类号： H05K13/04 ,  B05B13/041 ,  B23K1/203 ,  H05K3/3489 ,  B23K2201/40

摘要： A device for applying flux to the rear of a printed circuit board loaded with electronic parts on the front thereof and being transported by spraying the flux. The device has a single nozzle which is movable in a reciprocating motion in a direction perpendicular to the moving direction of the circuit board, thereby applying flux to the entire rear surface of the circuit board in a uniform distribution. The range of reciprocation of the nozzle is controlled on the basis of data generated by a sensor which is responsive to the width of the circuit board in transport. A flux feeding device capable of adjusting the amount of flux to be sprayed from the nozzle and a device for preventing the nozzle from being stopped up are associated with the flux applying device.

摘要翻译： 一种用于在其前面装载有电子部件的印刷电路板的后部施加助焊剂并通过喷射助焊剂传输的装置。 该装置具有可沿与电路板的移动方向垂直的方向往复运动的单个喷嘴，从而以均匀的分布向电路板的整个后表面施加通量。 喷嘴的往复运动范围根据传感器产生的数据进行控制，传感器响应于运输中电路板的宽度。 能够调节从喷嘴喷射的焊剂量和用于防止喷嘴堵塞的装置的焊剂供给装置与焊剂施加装置相关联。

公开(公告)号：US5374848A

公开(公告)日：1994-12-20

申请号：US872032

申请日：1992-04-23

申请人： Hiroshi Otani ,  Yoshiharu Takahashi ,  Yasuhiro Murasawa ,  Tadashi Ichimasa

发明人： Hiroshi Otani ,  Yoshiharu Takahashi ,  Yasuhiro Murasawa ,  Tadashi Ichimasa

IPC分类号： H01L23/12 ,  H05K1/18 ,  H05K3/34 ,  H01L23/02

CPC分类号： H05K1/181 ,  H05K2201/097 ,  H05K2201/10522 ,  H05K2201/10689 ,  H05K2203/1572 ,  Y02P70/611

摘要： Cracks in solder connecting terminal leads of an IC to a circuit board are prevented by reducing the stress due to the difference in the coefficients of thermal expansion of a pair of IC packages mounted on opposite surfaces of a circuit board and the circuit board. In this invention, the position of an IC package mounted on the upper surface of a circuit board is spaced from the position of an IC package mounted on the lower surface of the circuit board. Alternatively, the IC packages are mounted on the upper and lower surfaces in directions which are substantially orthogonal. Alternatively, the IC packages are mounted such that the positions of lead portions of one of the upper IC packages are spaced from the positions of the lead portions of the other IC package by a distance which is at least 2.4 times the thickness of the circuit board.

摘要翻译： 通过减少由于安装在电路板和电路板的相对表面上的一对IC封装的热膨胀系数的差异而导致的应力的降低，可以防止IC将电路板的引线焊接到电路板上。 在本发明中，安装在电路板的上表面上的IC封装的位置与安装在电路板的下表面上的IC封装的位置隔开。 或者，IC封装以基本正交的方向安装在上表面和下表面上。 或者，安装IC封装，使得上IC封装之一的引线部分的位置与另一IC封装的引线部分的位置间隔至少为电路板厚度的2.4倍 。