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公开(公告)号：US06750853B2
公开(公告)日：2004-06-15
申请号：US09960957
申请日：2001-09-25
IPC分类号： G09G500
CPC分类号： G06F3/0436
摘要： A surface acoustic waves is excited from an excitation element disposed on a substrate, the surface acoustic wave propagated on the substrate is received by a receiving element positioned on the substrate so as to face the excitation element, and the position of an object touching the substrate is detected based on the reception result. The wave number of a burst wave applied to excite the excitation element is made equal to the number of the comb-like electrode fingers of an IDT of the excitation element.
摘要翻译： 表面声波从设置在基板上的激励元件激发，传播在基板上的表面声波被位于基板上的接收元件接收以面对激励元件，并且物体接触基板的位置 基于接收结果来检测。 将激励激发元件的突发波的波数设定为等于激励元件的IDT的梳状电极指的数量。
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公开(公告)号：US20080316187A1
公开(公告)日：2008-12-25
申请号：US12222405
申请日：2008-08-08
IPC分类号： G06F3/041
CPC分类号： G06F3/0436
摘要： Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion.
摘要翻译： 触摸面板装置的每个换能器包括压电薄膜，设置在压电薄膜的一个表面的平板电极和设置在压电薄膜的另一个表面上的梳状电极。 梳状电极具有连接多个梳状电极指的一端的多个梳状电极指和线性总线电极。 多个布线电极设置在与换能器的总线电极并联的任何换能器的外侧，并且连接到任何换能器的总线电极和平板电极。 每个布线电极包括通过在基板上印刷含有微粒的银浆而形成的电极基体部分和通过将含有大颗粒和细颗粒的银膏以混合的方式印刷在电极基体上而形成的电极主体。
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公开(公告)号：US20060132000A1
公开(公告)日：2006-06-22
申请号：US11283844
申请日：2005-11-22
IPC分类号： H01L41/047
CPC分类号： G06F3/0436 , H01L41/0477 , H01L41/0805 , H01L41/29 , H01L41/316
摘要： A piezoelectric device (X) includes a substrate (11) a piezoelectric film (12), a first electrode (13), and a second electrode (14). At least one of the first electrode (13) and the second electrode (14) is interposed between the substrate (11) and the piezoelectric film (12), and made of an Al alloy containing 0.1 to 3 wt % of at least one metal selected from the group consisting of Ti, Cr, Ni, Cu, Zn, Pd, Ag, Hf, W, Pt and Au.
摘要翻译： 压电装置（X）包括基板（11），压电膜（12），第一电极（13）和第二电极（14）。 第一电极（13）和第二电极（14）中的至少一个插入在基板（11）和压电膜（12）之间，由含有0.1〜3重量％的至少一种金属 选自Ti，Cr，Ni，Cu，Zn，Pd，Ag，Hf，W，Pt和Au组成的组。
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公开(公告)号：US20060038798A1
公开(公告)日：2006-02-23
申请号：US11017838
申请日：2004-12-22
IPC分类号： G09G5/00
CPC分类号： G06F3/0436
摘要： A transducer for excitation including two electrode, and at least one of the two electrodes is a comb-like electrode including a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode finger is connected. When dividing the transducer into two areas in the length direction of the bus electrode, at least one connection portion for one of the two electrodes is disposed in one of the two areas, while at least one connection portion for the other electrode is disposed in the other area.
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公开(公告)号：US20050073505A1
公开(公告)日：2005-04-07
申请号：US10781791
申请日：2004-02-20
IPC分类号： G06F3/043 , G06F3/03 , G06F3/033 , G06F3/041 , H01L41/047 , H01L41/09 , H01L41/18 , H01L41/22 , H03H3/08 , H03H9/145 , G09G5/00 , H01L41/04 , H01L41/08 , H02N2/00
CPC分类号： H03H3/08 , G06F3/0436 , H01L41/047 , H01L41/0477
摘要： A piezoelectric element includes a substrate, a lower electrode on the substrate, a piezoelectric layer on the lower electrode, and an upper electrode on the piezoelectric layer. The upper electrode includes a common base and a plurality of parallel branches extending from the base. The branches are arranged at a regular interval or pitch λ1. The lower electrode faces the branches of the upper electrode via the piezoelectric layer. The thickness h of the piezoelectric layer and the branch pitch λ1 are determined to satisfy an inequality 0.005≦h/λ1≦0.1. The lower electrode has a hillock occurrence rate which is no greater than 0.1%.
摘要翻译： 压电元件包括衬底，衬底上的下电极，下电极上的压电层和压电层上的上电极。 上电极包括公共基座和从基座延伸的多个平行分支。 分支以规则间隔或间距λ1排列。 下电极经由压电层面对上电极的分支。 压电层的厚度h和分支间距λ1被确定为满足不等式0.005 <= H / LAMBDA1 <= 0.1。 下电极具有不大于0.1％的小丘发生率。
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公开(公告)号：US08283735B2
公开(公告)日：2012-10-09
申请号：US12688302
申请日：2010-01-15
CPC分类号： B32B37/12 , B32B2309/027 , B32B2309/68 , B32B2310/0806 , B32B2457/00 , B81B2207/096 , B81C1/00301 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface.
摘要翻译： 包装装置包括装置基板和包装单元。 器件衬底包括形成在器件衬底中的第一表面和器件。 包装单元包括面向设备基板的绝缘层。 绝缘层包括结合到第一表面的第二表面。 绝缘层中的外围表面的至少一部分的金属浓度高于绝缘层中的器件基板侧的端面的金属浓度。 第一表面的轮廓从第二表面的轮廓向内退回。
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公开(公告)号：US20100024547A1
公开(公告)日：2010-02-04
申请号：US12502499
申请日：2009-07-14
IPC分类号： G01C19/56
CPC分类号： G01C19/5719
摘要： An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation.
摘要翻译： 角速度传感器包括两个摆动部分，它们被设置为在X轴方向和Y轴方向上摆动，其中振动部分在X轴方向上彼此间隔开。 该传感器还包括能够产生驻波振荡的两个耦合光束，该驻波振荡在X轴方向上延伸并且在Y轴方向上彼此间隔开，并且摆动部分位于它们之间。 耦合梁通过固定柱连接到支撑基板。 耦合光束由第一和第二连接部分桥接，第一连接部分也连接到振荡部分之一和第二连接部分之一。 固定柱在驻波振荡的固定点处连接到耦合梁。 连杆部分包括在驻波振荡的固定点处连接到耦合梁的加宽部分。
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公开(公告)号：US08289723B2
公开(公告)日：2012-10-16
申请号：US12458604
申请日：2009-07-16
CPC分类号： G01P15/125 , B81C1/00301 , G01C19/5719 , G01P1/023 , G01P15/0802 , H01L21/76898 , H01L23/481 , H01L2924/0002 , Y10T29/49128 , H01L2924/00
摘要： A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer.
摘要翻译： 一种方法包括在包括在第一晶片中的第一区域中形成凹槽以形成由凹槽限定的布线区域; 在槽中形成绝缘部分; 在形成有所述布线区域的所述第一晶片的表面之后，在形成所述绝缘部分之后，将包括器件形成区域的器件晶片的第一表面接合; 在将所述第一晶片连接到所述器件晶片之后，在所述第一晶片的布线区域中形成通孔，所述孔延伸穿过所述第一晶片; 用导电材料填充孔; 将第二晶片连接到与所述第一表面相对的所述器件晶片的第二表面，所述第二晶片包括第二区域; 在将第一晶片连接到器件晶片之后，通过使第一晶片变薄来暴露布线区域; 以及在使所述第一晶片变薄之后切割所述器件晶片，所述第一晶片和所述第二晶片。
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公开(公告)号：US08230740B2
公开(公告)日：2012-07-31
申请号：US12502499
申请日：2009-07-14
CPC分类号： G01C19/5719
摘要： An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation.
摘要翻译： 角速度传感器包括两个摆动部分，它们被设置为在X轴方向和Y轴方向上摆动，其中振动部分在X轴方向上彼此间隔开。 该传感器还包括能够产生驻波振荡的两个耦合光束，该驻波振荡在X轴方向上延伸并且在Y轴方向上彼此间隔开，并且摆动部分位于它们之间。 耦合梁通过固定柱连接到支撑基板。 耦合光束由第一和第二连接部分桥接，第一连接部分也连接到振荡部分之一和第二连接部分之一。 固定柱在驻波振荡的固定点处连接到耦合梁。 连杆部分包括在驻波振荡的固定点处连接到耦合梁的加宽部分。
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公开(公告)号：US09372202B2
公开(公告)日：2016-06-21
申请号：US13618643
申请日：2012-09-14
IPC分类号： H05K7/00 , G01P15/125 , B81C1/00 , G01C19/5719 , G01P1/02 , G01P15/08 , H01L21/768 , H01L23/48
CPC分类号： G01P15/125 , B81C1/00301 , G01C19/5719 , G01P1/023 , G01P15/0802 , H01L21/76898 , H01L23/481 , H01L2924/0002 , Y10T29/49128 , H01L2924/00
摘要： A packaged device of one embodiment includes a device layer section, and first and second packaging members. The device layer section is one where a movable microdevice including a movable part and a terminal part is formed. The first packaging member is joined to the device layer section, and includes a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region. The second packaging member is joined to a side of the device layer section opposite the first packaging member.
摘要翻译： 一个实施例的包装装置包括装置层部分，以及第一和第二包装部件。 装置层部是形成有可动部和端子部的可动微型装置的部分。 第一包装部件连接到器件层部分，并且包括设置在与端子部分相对应的位置处的布线区域和延伸穿过布线区域的导电插塞。 第二包装部件与第一包装部件相对的装置层部分的一侧连接。
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