摘要:
This methods and devices described herein relate to displays and methods of manufacturing cold seal fluid-filled displays, including MEMS. The fluid substantially surrounds the moving components of the MEMS display to reduce the effects of stiction and to improve the optical and electromechanical performance of the display. The invention relates to a method for sealing a MEMS display at a lower temperature such that a vapor bubble does not formforms only at temperatures about 15° C. to about 20° C. below the seal temperature. In some embodiments, the MEMS display apparatus includes a first substrate, a second substrate separated from the first substrate by a gap and supporting an array of light modulators, a fluid substantially filling the gap, a plurality of spacers within the gap, and a sealing material joining the first substrate to the second substrate.
摘要:
Fuel cell electrodes are fabricated on electrode base substrates. The electrode substrates can be evenly and uniformly covered with electrocatalysts, which are supported on carbon nanomaterials, and ionomers by means of filtration and pressing. The electrodes can be used as anodes or cathodes for membrane fuel cells, such as DMFC and PEMFC.
摘要:
A self-adhering label for application to the sidewall of cured and vulcanized wheeled-vehicle tire. The label comprises a display layer comprising a natural rubber or a synthetic rubber material, an image carried by a first surface of the display layer, the image further comprising visible text or a graphical image formed from an ink having expandable and contractible properties and an adhesive layer applied to a second surface of the display layer, the second surface opposite the first surface, the adhesive layer having expandable and contractible properties similar to the display layer.
摘要:
A method of fabricating carbon nanotube (CNT) pattern includes the following steps. First, one surface of a first transparent substrate is denoted as the first surface. A CNT thin film layer is coated on the first surface by a thin film deposition method. Then, a second substrate is disposed opposite to the first surface coated with a CNT thin film layer. By adopting a laser transfer method, a laser source irradiates on the CNT thin film layer coated on the fist surface, such that the CNT on the irradiated area explodes to depart from the first surface due to the high temperature resulted from the energy imparted by the laser light, so as to form a CNT pattern on the opposite second substrate.
摘要:
A method for producing an embossed information plate, e.g., a license plate, wherein desired indicia are embossed in the front surface in relief form and retroreflective sheeting is adhered to the background portions of the front surface. A reflective sheeting having a low-tack, heat-activated adhesive on its backside is tacked to a plate blank. When the plate blank is embossed with desired indicia, the sheeting is simultaneously cut out according to the indicia. After the cut-out portions of the sheeting are removed, the embossed plate and trimmed sheeting which is tacked thereto are passed between a series of pairs of co-acting, resilient lamination rollers wherein the roller of each pair which contacts the sheeting is heated. The rollers conform to the contour of the indicia and heat the sheeting and adhesive, thereby causing the adhesive to effectively wet the surface of the plate and activating it as the sheeting is simultaneously laminated to the plate.
摘要:
The present invention relates to a method for manufacturing a composite sheet comprising an aerogel sheet, which comprises: a step (S10) of preparing a fiber sheet (10); a step (S20) of laminating the aerogel sheet (30) on each of both surfaces of the fiber sheet (10); and a step (S30) of applying heat and a pressure to the aerogel sheet (30) and the fiber sheet (10), which are laminated, to bond the sheets to each other and to manufacture the composite sheet (40) in which the aerogel sheet (30), the fiber sheet (10), the aerogel sheet (30) are laminated.
摘要:
A method for manufacturing a display device 10 includes a substrate supporting step for supporting a plastic substrate 19 on a support substrate 50, with the plastic substrate 19 curved, and a thin film lamination step for laminating a plurality of thin films on the plastic substrate 19 supported on the support substrate 50.
摘要:
In a carbon black (CB)/PTFE composite porous sheet that can be used as a gas diffusion layer in an electrochemical device in applications involving electro chemical reaction such as a polymer electrolyte fuel cell, electrolysis, gas sensor and the like, wrinkle or breakage may be produced due to its flexibility. A method is provided which makes it possible to easily handle this sheet that is difficult to handle, without giving rise to wrinkle or breakage.The present invention relates to a method for laminating the composite sheet on MEA, comprising the steps of: providing a membrane electrode assembly (MEA); providing a composite sheet comprising functional powder and polytetrafluoroethylene (PTFE); providing a release film; superimposing the composite sheet on the release film and pressing them at normal temperature; superimposing the composite sheet having the release film pressed at normal temperature thereto on MEA and hot-pressing them; and separating the release film from the composite sheet.
摘要:
A present invention relates to a film for manufacturing a semiconductor device in which a cover film is pasted onto a laminated film, wherein the shrinkage in the longitudinal direction and in the lateral direction in the laminated film after peeling the cover film and leaving for 24 hours at a temperature of 23±2° C. is in a range of 0 to 2% compared to the laminated film before pasting of the cover film.
摘要:
Wafer structures and wafer bonding methods are provided. In some embodiments, a wafer bonding method includes providing a conductive wafer and a plurality of insulating wafers, the conductive wafer being larger than the insulating wafers; performing a pre-treatment operation on the conductive wafer, the insulating wafers, or both; and directly bonding the insulating wafers to the conductive wafer.