公开(公告)号：US20160276325A1

公开(公告)日：2016-09-22

申请号：US14767902

申请日：2014-09-18

Applicant: INTEL CORPORATION

Inventor： Vijay K. NAIR ,  Thorsten MEYER

IPC: H01L25/16 ,  H01L21/56 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/162 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/48227 ,  H01L2224/96 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/15323 ,  H01L2924/15331 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3651 ,  H01L2924/00014 ,  H01L2224/81

Abstract: Embodiments of the invention include multi-die package and methods of making such multi-die packages. In an embodiment a mold layer has a first surface and a second surface that is opposite from the first surface. One or more first electrical components that each have a solderable terminal that is oriented to face the first surface of the mold layer. The mold layer may also have one or more second electrical components that each have a second type of terminal that is oriented to face the second surface of the mold layer. Embodiments may also include one or more conductive through vias formed between the first surface of the mold layer and the second surface of the mold layer. Accordingly an electrical connection may be made from the second surface of the mold layer to the first electrical components that are oriented to face the first surface of the mold layer.

Abstract translation: 本发明的实施例包括多管芯封装和制造这种多管芯封装的方法。 在一个实施例中，模具层具有与第一表面相对的第一表面和第二表面。 一个或多个第一电气部件，其每个具有被定向成面向模具层的第一表面的可焊接端子。 模具层还可以具有一个或多个第二电气部件，每个第二电气部件具有定向成面向模具层的第二表面的第二类型的端子。 实施例还可以包括在模具层的第一表面和模具层的第二表面之间形成的一个或多个导电通孔。 因此，可以从模具层的第二表面到面向模具层的第一表面的第一电气部件进行电连接。