Tamper resistant obfuscation circuit

    公开(公告)号:US11748524B2

    公开(公告)日:2023-09-05

    申请号:US16933509

    申请日:2020-07-20

    CPC classification number: G06F21/86 G06F21/14 G06F21/79

    Abstract: An obfuscation circuit relies on a tamper-resistant nonvolatile memory which encodes a trusted Boolean function. The Boolean function is used to enable several operations relating to circuit obfuscation, including obfuscation of logic circuitry, obfuscation of operand data, and release of IP blocks. The tamper-resistant nonvolatile memory is part of a trusted integrated circuit structure, i.e., one fabricated by a trusted foundry, separate from another integrated circuit structure which contains the various operational logic circuits of the design and is fabricated by an untrusted foundry. The Boolean function is encoded based on a look-up table implemented as a cascaded multiplexer circuit. Multiple obfuscation functions can be so encoded. The obfuscation functions may be reprogrammed using a protocol that relies on symmetric keys, one of which is stored in the tamper-resistant nonvolatile memory.

    RRAM FILAMENT SPATIAL LOCALIZATION USING A LASER STIMULATION

    公开(公告)号:US20230170019A1

    公开(公告)日:2023-06-01

    申请号:US17539295

    申请日:2021-12-01

    Abstract: System and method to localize a position of an RRAM filament of resistive memory device at very low bias voltages using a scanning laser beam. The approach is non-invasive and allows measurement of a large number of devices for creating statistics relating to the filament formation. A laser microscope system is configured to perform a biasing the RRAM cell with voltage (or current). Concurrent to the applied bias, a laser beam is generated and aimed at different positions of the RRAM cell (e.g., by a raster scanning). Changes in the current (or voltage) flowing through the cell are measured. The method creates a map of the current (or voltage) changes at the different laser positions and detects a spot in the map corresponding to higher (or lower) current (or voltage). The method determines the (x,y) position of the spot compared to the edge/center of the RRAM cell.

    AUTOMATED FOCUSING OF A MICROSCOPE OF AN OPTICAL INSPECTION SYSTEM

    公开(公告)号:US20190325568A1

    公开(公告)日:2019-10-24

    申请号:US15955974

    申请日:2018-04-18

    Abstract: Systems, computer-implemented methods, and computer program products to focus a microscope. A system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise an analyzer component that can analyze sub-images of respective sample images to identify one or more sub-images having a maximized variance of a gradient derivative corresponding to the one or more sub-images. The respective sample images can be acquired at one or more focal positions along an optical axis of a microscope. The computer executable components can further comprise a selection component that can select an image, from the respective sample images, that comprises the one or more sub-images identified. The computer executable components can also comprise a focus component that, based on a focal position corresponding to the image selected, can focus the microscope to the focal position.

    INTEGRATED CIRCUIT DEFECT DETECTION USING PATTERN IMAGES

    公开(公告)号:US20190180430A1

    公开(公告)日:2019-06-13

    申请号:US15834602

    申请日:2017-12-07

    Abstract: Techniques that facilitate integrated circuit defect detection using pattern images are provided. In one example, a system generates an equalized pattern image of a pattern image associated with a module under test based on an adaptive contrast equalization technique. The system also identifies a first set of features of the equalized pattern image based on a feature point detection technique and aligns the equalized pattern image with a reference pattern image based on the first set of features and a second set of features of the reference pattern image. Furthermore, the system compares a first set of light intensities of the equalized pattern image to a second set of light intensities of the reference pattern image to identify one or more regions of the module under test that satisfy a defined criterion associated with a defect for the module under test.

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