TOUCH DISPLAY DEVICE
    32.
    发明申请

    公开(公告)号:US20180157358A1

    公开(公告)日:2018-06-07

    申请号:US15451416

    申请日:2017-03-07

    Abstract: A touch display device is provided and includes a substrate, a plurality of light-emitting units, and a plurality of touch electrodes. The substrate includes a first edge. The light-emitting units are disposed on the substrate. The touch electrodes are disposed on the light-emitting units. A first distance is a minimum distance from the first edge to the light-emitting units parallel to the substrate, a second distance is a minimum distance from the first edge to the touch electrodes parallel to the substrate, and the first distance is greater than the second distance.

    TOUCH DISPLAY PANEL
    33.
    发明申请
    TOUCH DISPLAY PANEL 审中-公开

    公开(公告)号:US20180108710A1

    公开(公告)日:2018-04-19

    申请号:US15717959

    申请日:2017-09-28

    Abstract: The disclosure relates to a touch display panel, including a first substrate, an organic light emitting diode (OLED) device layer, a spacer, a first touch electrode, a second touch electrode, and a second substrate opposite to the first substrate. The OLED device layer is disposed on the first substrate and has a light emitting area. The spacer is disposed on the OLED device layer and located outside the light emitting area. The first touch electrode and the second touch electrode are disposed on the OLED device layer. The first touch electrode has a first bridge part. The first bridge part of the first touch electrode is interlaced with the second touch electrode. In particular, at least a portion of the first bridge part is disposed on the spacer.

    ELECTRONIC DEVICE
    34.
    发明申请

    公开(公告)号:US20250169347A1

    公开(公告)日:2025-05-22

    申请号:US19035723

    申请日:2025-01-23

    Abstract: An electronic device provided herein includes an insulation layer having a first space; a conductive element disposed in the first space of the insulation layer; a substrate corresponded to the insulation layer; a metal layer disposed between the insulation layer and the substrate; and an electronic component corresponded to the substrate. The substrate has a second space corresponds to the conductive element. The electronic component is electrically connected to the metal layer and the conductive element.

    ELECTRONIC DEVICE
    35.
    发明申请

    公开(公告)号:US20250132300A1

    公开(公告)日:2025-04-24

    申请号:US19010145

    申请日:2025-01-05

    Abstract: An electronic device is disclosed. The electronic device includes a substrate, a first conductive element disposed above the substrate, a first electronic unit disposed above the first conductive element, a second electronic unit disposed above the first conductive element, and a connection electrode disposed above the first conductive element, wherein the first conductive element is electrically connected to the first electronic unit and the second electronic unit through the connection electrode.

    Light emitting device
    36.
    发明授权

    公开(公告)号:US12253237B2

    公开(公告)日:2025-03-18

    申请号:US18664311

    申请日:2024-05-15

    Abstract: A light emitting device includes a plurality of light emitting elements and a light controller. The light emitting elements emit lights. The light controller is disposed on the light emitting elements for the lights passing through to form output lights. The light controller includes a first optical element, a second optical element and a transparent element disposed between the first optical element and the second optical element, and a thickness of the transparent element is not greater than 0.35 mm.

    Electronic device
    37.
    发明授权

    公开(公告)号:US12218118B2

    公开(公告)日:2025-02-04

    申请号:US18508255

    申请日:2023-11-14

    Abstract: An electronic device is disclosed. The electronic device includes a substrate, a first conductive element disposed above the substrate, a transistor disposed above the first conductive element and the substrate, a first electronic unit disposed above the substrate and electrically connected to the transistor, a second electronic unit disposed above the substrate; and a connection electrode disposed above the first conductive element, the first conductive element is electrically connected to the first electronic unit and the second electronic unit through the connection electrode.

    Electronic device
    38.
    发明授权

    公开(公告)号:US12111531B2

    公开(公告)日:2024-10-08

    申请号:US18096546

    申请日:2023-01-12

    CPC classification number: G02F1/133512 H10K50/865

    Abstract: An electronic device is disclosed by this disclosure. The electronic device includes a pixel substrate and a first light blocking structure. The pixel substrate includes a first pixel. The first light blocking structure is disposed on the pixel substrate, and the first light blocking structure includes a first unit and a second unit. In a top view direction of the electronic device, the first unit and the second unit are separated from each other in a first direction by a first pitch, and the first pixel has an exposed part between the first unit and the second unit. The exposed part has a first length in the first direction, a first ratio is a ratio of the first length to the first pitch, and the first ratio is greater than or equal to 0.4 and less than or equal to 0.85.

    Semiconductor device
    39.
    发明授权

    公开(公告)号:US12087667B2

    公开(公告)日:2024-09-10

    申请号:US18144573

    申请日:2023-05-08

    CPC classification number: H01L23/481 H01L23/53228 H01L29/42372

    Abstract: An electronic device includes: a substrate including a through hole; a connecting element disposed in the through hole; a first insulating layer disposed on the substrate and including a first via; a first conductive element disposed on the first insulating layer and electrically connected to the connecting element through the first via; a second insulating layer disposed on the first conductive element and comprising a second via; a second conductive element disposed on the second insulating layer and electrically connected to the first conductive element through the second via; and a third conductive element disposed under the substrate and electrically connected to the connecting element, wherein, in a cross-sectional view of the electronic device, the second via is not overlapping with the connecting element.

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