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    Optical transceiver by FOWLP and DoP multichip integration
    31.
    发明授权
    Optical transceiver by FOWLP and DoP multichip integration 有权

    公开(公告)号：US10001611B2

    公开(公告)日：2018-06-19

    申请号：US15061941

    申请日：2016-03-04

    Applicant: INPHI CORPORATION

    Inventor： Liang Ding ,  Radhakrishnan L. Nagarajan ,  Roberto Coccioli

    IPC: G02B6/42 ,  G02B6/13 ,  G02B6/30 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L25/16 ,  G02B6/12

    Abstract: An optical transceiver by hybrid multichip integration. The optical transceiver includes a PCB with a plurality of prefabricated surface bonding sites. A first chip includes a FOWLP package of multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer is disposed on the PCB by respectively bonding a plurality of conductor balls between the dielectric redistribution layer and the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) in the dielectric molding layer. The optical transceiver further includes a second chip configured as a Sipho die comprising photonics devices embedded in a SOI wafer substantially free from any electronics device process. The second chip is stacked over the first chip with multiple conductor bumps being bonded respectively to the soldering material in the multiple TMVs.

    Driver module for mach zehnder modulator
    32.
    发明授权
    Driver module for mach zehnder modulator 有权

    公开(公告)号：US09998231B2

    公开(公告)日：2018-06-12

    申请号：US15832296

    申请日：2017-12-05

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Todd Rope

    IPC: H04B10/00 ,  H04B10/524 ,  G02F1/01 ,  G02F1/225 ,  H03M1/68 ,  G02F1/21

    CPC classification number: H04B10/5161 ,  G02F1/0123 ,  G02F1/2255 ,  G02F1/2257 ,  G02F2001/212 ,  H03M1/682 ,  H04B10/524 ,  H04B10/541

    Abstract: A single chip dual-channel driver for two independent traveling wave modulators. The driver includes two differential pairs inputs per channel respectively configured to receive two digital differential pair signals. The driver further includes a two-bit DAC per channel coupled to the two differential pairs inputs to produce a single analog differential pair PAM signal at a differential pair output for driving a traveling wave modulator. Additionally, the driver includes a control block having internal voltage/current signal generators respective coupled to each input and the 2-bit DAC for providing a bias voltage, a tail current, a dither signal to assist modulation control per channel. Furthermore, the driver includes an internal I2C communication block coupled to a high-speed clock generator to generate control signals to the control block and coupled to host via an I2C digital communication interface.

    Built-in self test for loopback on communication system on chip
    33.
    发明授权
    Built-in self test for loopback on communication system on chip 有权

    公开(公告)号：US09935706B2

    公开(公告)日：2018-04-03

    申请号：US15679008

    申请日：2017-08-16

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan

    IPC: H04B10/071 ,  H04L12/26 ,  H04L12/933 ,  H04Q11/00 ,  H04B10/40

    CPC classification number: H04B10/071 ,  H04B10/40 ,  H04L43/50 ,  H04L49/109 ,  H04Q11/0005 ,  H04Q2011/0018 ,  H04Q2011/0035

    Abstract: In an example, the present invention includes an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    Optical module
    35.
    发明授权
    Optical module 有权

    公开(公告)号：US09787423B2

    公开(公告)日：2017-10-10

    申请号：US15375031

    申请日：2016-12-09

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan

    IPC: H04J14/02 ,  H04B10/40

    CPC classification number: H04J14/02 ,  H04B10/40

    Abstract: An integrated apparatus with optical/electrical interfaces and protocol converter on a single silicon substrate. The apparatus includes an optical module comprising one or more modulators respectively coupled with one or more laser devices for producing a first optical signal to an optical interface and one or more photodetectors for detecting a second optical signal from the optical interface to generate a current signal. Additionally, the apparatus includes a transmit lane module coupled between the optical module and an electrical interface to receive a first electric signal from the electrical interface and provide a framing protocol for driving the one or more modulators. Furthermore, the apparatus includes a receive lane module coupled between the optical module and the electrical interface to process the current signal to send a second electric signal to the electrical interface.

    Small form factor transmitting device
    37.
    发明授权
    Small form factor transmitting device 有权
    小型发射装置

    公开(公告)号：US09548817B1

    公开(公告)日：2017-01-17

    申请号：US14745316

    申请日：2015-06-19

    Applicant: INPHI CORPORATION ,  Luxnet Corporation

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Pi-Cheng Law

    IPC: H04B10/50 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/068 ,  H01S5/0683

    CPC classification number: H01S5/0612 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4215 ,  G02B6/4271 ,  G02B6/4287 ,  G02B6/4296 ,  H01S5/0064 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/068 ,  H01S5/125 ,  H04B10/501

    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    Abstract translation: 包装的发射机装置包括基座部件，该基部部件包括安装有热电冷却器的平面部分，发射器和耦合透镜组件，以及连接到平面部分的一侧的组装部件。 该装置还包括弯曲成具有第一端部区域和第二端部区域的电路板，该第二端部区域被升高到更高的电平。 布置在平面部分的顶表面上的第一端区包括分别连接到热电和发射器的多个电连接片。 第二端区域包括用于外部连接的电气端口。 另外，该装置包括设置在平面部分上的盖构件。 此外，该装置包括安装到组装部分的圆柱形构件，用于围绕沿其轴线对准耦合透镜组件的隔离器并且连接到光纤以将来自发射器的光信号耦合到光纤。

    Built-in self test for loopback on communication system on chip
    38.
    发明授权
    Built-in self test for loopback on communication system on chip 有权
    内置通信系统芯片环回自检

    公开(公告)号：US09548809B1

    公开(公告)日：2017-01-17

    申请号：US14310988

    申请日：2014-06-20

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan

    IPC: H04B10/071

    CPC classification number: H04B10/071 ,  H04B10/40 ,  H04L43/50 ,  H04L49/109 ,  H04Q11/0005 ,  H04Q2011/0018 ,  H04Q2011/0035

    Abstract: In an example, the present invention includes an integrated system-on-chip device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

    Abstract translation: 在一个示例中，本发明包括集成片上系统设备。 在一个示例中，控制块被配置为以数字格式接收和发送指令给通信块，并且被配置为以模拟格式接收和发送信号以与硅光子器件通信。

    Off quadrature biasing of Mach Zehnder modulator for improved OSNR performance
    39.
    发明授权
    Off quadrature biasing of Mach Zehnder modulator for improved OSNR performance 有权
    马赫曾德调制器的正交偏置关闭，以提高OSNR性能

    公开(公告)号：US09523867B2

    公开(公告)日：2016-12-20

    申请号：US15072866

    申请日：2016-03-17

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Hari Shankar ,  Masaki Kato ,  Yang Fu

    IPC: G02B5/12 ,  G02F1/01 ,  G02F1/035 ,  G02F1/225 ,  H01S3/067 ,  H01S3/16 ,  G02F1/21

    CPC classification number: G02F1/0123 ,  G02B6/12007 ,  G02F1/0147 ,  G02F1/025 ,  G02F1/225 ,  G02F1/2255 ,  G02F2001/212 ,  G02F2202/105 ,  H01S3/06754 ,  H01S3/1608 ,  H01S5/0085 ,  H01S5/0687 ,  H01S5/4012 ,  H01S5/4087 ,  H04B10/505 ,  H04B10/50575

    Abstract: An integrated optical modulator device. The device can include a driver module coupled to an optical modulator. The optical modulator is characterized by a raised cosine transfer function. This optical modulator can be coupled to a light source and a bias control module, which is configured to apply an off-quadrature bias to the optical modulator. This bias can be accomplished by applying an inverse of the modulator transfer function to the optical modulator in order to minimize a noise variance. This compression function can result in an optimized increased top eye opening for a signal associated with the optical modulator. Furthermore, the optical modulator can be coupled to an EDFA (Erbium Doped Fiber Amplifier) that is coupled to a filter coupled an O/E (Optical-to-Electrical) receiver.

    Abstract translation: 集成光调制器装置。 该装置可以包括耦合到光调制器的驱动器模块。 光调制器的特征在于升高的余弦传递函数。 该光调制器可以耦合到光源和偏置控制模块，该偏置控制模块被配置为向光调制器施加非正交偏置。 可以通过将调制器传递函数的反相应用于光调制器来实现该偏置，以便最小化噪声方差。 该压缩功能可以导致用于与光学调制器相关联的信号的优化的增加的顶部眼睛开放。 此外，光调制器可以耦合到耦合到耦合到O / E（光 - 电）接收器的滤波器的EDFA（掺铒光纤放大器）。

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