公开(公告)号：US20070099426A1

公开(公告)日：2007-05-03

申请号：US11316845

申请日：2005-12-27

申请人： Manabu Tsujimura ,  Akira Fukunaga ,  Yutaka Wada ,  Itsuki Kobata

发明人： Manabu Tsujimura ,  Akira Fukunaga ,  Yutaka Wada ,  Itsuki Kobata

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/02074 ,  C25F7/00 ,  H01L21/3212 ,  H01L21/32125

摘要： A polishing method polishes a substrate so as to remove an interconnect metal film and a barrier film formed on portions other than interconnect recesses. The method includes performing a first polishing process of polishing a surface of the substrate After performing the first polishing process, the surface of the substrate is cleaned. After cleaning, a second polishing process is performed for further polishing the surface of the substrate. At least one of performing the first polishing process and performing the second polishing process includes performing electrolytic polishing.

摘要翻译： 抛光方法抛光衬底以去除互连金属膜和形成在互连凹槽之外的部分上的阻挡膜。 该方法包括进行抛光基板的表面的第一抛光处理。在进行第一抛光处理之后，清洁基板的表面。 在清洁之后，执行第二抛光工艺以进一步抛光衬底的表面。 执行第一抛光处理并执行第二抛光处理中的至少一个包括进行电解抛光。

公开(公告)号：US20060289298A1

公开(公告)日：2006-12-28

申请号：US10554594

申请日：2004-04-22

申请人： Itsuki Kobata ,  Yasushi Toma ,  Yuzo Mori

发明人： Itsuki Kobata ,  Yasushi Toma ,  Yuzo Mori

IPC分类号： C25D17/00

CPC分类号： C25F7/00 ,  C25F3/00 ,  H01L21/32115

摘要： The present invention provides an electrolytic processing apparatus which can suppress the growth of a gas, which is inevitably generated during electrochemical processing, into bubbles thereby effectively preventing the formation of pits in a surface of a workpiece. The electrolytic processing apparatus includes an electrode section (44) including processing electrodes (76) and feeding electrodes (78) both having a diameter of not more than 1 mm, a substrate holder (42) for holding a workpiece (W), a power source (46) for applying a voltage between the processing electrodes and the feeding electrodes, a fluid supply section (72) for supplying a fluid between the electrode section and the workpiece, and a drive section (56, 62) for moving the electrode section and the workpiece relative to each other in such a manner that the processing electrodes pass every point in a processing surface of the workpiece.

摘要翻译： 本发明提供一种电解处理装置，其可以将电化学处理中不可避免地产生的气体的生长抑制成气泡，从而有效地防止在工件的表面中形成凹坑。 所述电解处理装置包括具有直径不大于1mm的处理电极和馈电电极（78）的电极部（44），用于保持工件（W）的基板保持架（42） 用于在处理电极和馈电电极之间施加电压的源极（46），用于在电极部分和工件之间提供流体的流体供应部分（72），以及用于使电极部分 以及相对于彼此的工件，使得处理电极通过工件的处理表面中的每个点。

公开(公告)号：US07101465B2

公开(公告)日：2006-09-05

申请号：US10337357

申请日：2003-01-07

申请人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

发明人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

IPC分类号： C25D17/00

CPC分类号： B23H5/08

摘要： There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.

摘要翻译： 提供了一种电解处理装置，包括：与工件接触或接近工件的处理电极; 用于向工件供电的供电电极; 离子交换器，其设置在所述工件和所述处理电极之间的至少一个空间中，以及所述工件与所述馈电电极之间; 用于在处理电极和馈电电极之间施加电压的电源; 以及液体供给部，用于将液体供给到工件与存在有离子交换器的处理电极和供电电极中的至少一个之间的空间。 还提供了具有该电解处理装置的基板处理装置。

公开(公告)号：US20060091005A1

公开(公告)日：2006-05-04

申请号：US10528584

申请日：2003-10-02

申请人： Yasushi Toma ,  Itsuki Kobata

发明人： Yasushi Toma ,  Itsuki Kobata

IPC分类号： B23H3/04 ,  C25B11/00

CPC分类号： C25F7/00 ,  B23H3/02 ,  B23H9/00

摘要： An electrolytic processing apparatus has at least one processing electrode (86) and at least feeding electrode (86) disposed on the same side as the processing electrode (86) with respect to a substrate (W). An organic compound having an ion exchange group is chemically bonded to at least one of a surface of the processing electrode (86) and a surface of the feeding electrode (86b) to form an ion exchanger (90). The electrolytic processing apparatus also has a substrate holder (42) for holding the substrate (W) and bringing the substrate (W) into contact with or close to the processing electrode (86). The electrolytic processing apparatus includes a power supply (48) for applying a voltage between the processing electrode (86) and the feeding electrode (86), and a fluid supply unit (92, 94) for supplying a fluid between the substrate (W) and the processing electrode (86).

摘要翻译： 电解处理装置具有至少一个处理电极（86），并且至少馈送电极（86）相对于衬底（W）设置在与处理电极（86）相同的一侧上。 具有离子交换基团的有机化合物化学键合到处理电极（86）的表面和供电电极（86b）的表面中的至少一个上以形成离子交换器（90）。 电解处理装置还具有用于保持基板（W）并使基板（W）与处理电极（86）接触或靠近的基板保持架（42）。 电解处理装置包括用于在处理电极（86）和供电电极（86）之间施加电压的电源（48），以及用于在衬底（W）和衬底（W）之间提供流体的流体供应单元（92,94） 和处理电极（86）。

公开(公告)号：US20050121328A1

公开(公告)日：2005-06-09

申请号：US10485204

申请日：2003-01-31

申请人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Osamu Nabeya

发明人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Osamu Nabeya

IPC分类号： C25F3/00 ,  C25F7/00 ,  H01L21/3063 ,  H01L21/3213 ,  C25B9/00 ,  C25B15/00

CPC分类号： C25F3/00 ,  C25F7/00 ,  H01L21/3063 ,  H01L21/32134

摘要： This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that can come close to a workpiece, a feeding electrode for feeding electricity to the workpiece, an ion exchanger disposed in the space between the workpiece and the processing and the feeding electrodes, a fluid supply section for supplying a fluid between the workpiece and the ion exchanger, and a power source, wherein the processing electrode and/or the feeding electrode is electrically divided into a plurality of parts, and the power source applies a voltage to each of the divided electrode parts and can control voltage and/or electric current independently for each of the divided electrode parts.

摘要翻译： 本发明涉及一种电解处理装置和方法，其用于处理形成在基板表面上的导电材料，或用于去除附着在基板表面上的杂质。 一种电解处理装置，包括可以靠近工件的处理电极，用于向工件供电的供给电极，设置在工件和处理之间的空间中的离子交换器和供电电极，流体供应部分 用于在工件和离子交换器之间供应流体，以及电源，其中处理电极和/或馈电电极被电分为多个部分，并且电源向每个分开的电极部分施加电压 并且可以分别对每个分割电极部分分别控制电压和/或电流。

公开(公告)号：US06368493B1

公开(公告)日：2002-04-09

申请号：US09645405

申请日：2000-08-25

申请人： Yuzo Mori ,  Mitsuhiko Shirakashi ,  Takayuki Saito ,  Yasushi Toma ,  Akira Fukunaga ,  Itsuki Kobata

发明人： Yuzo Mori ,  Mitsuhiko Shirakashi ,  Takayuki Saito ,  Yasushi Toma ,  Akira Fukunaga ,  Itsuki Kobata

IPC分类号： B23H300

CPC分类号： C25F3/00 ,  B23H3/08

摘要： An anode as a workpiece, and a cathode opposed to the anode with a predetermined spacing are placed in ultrapure water. A catalytic material promoting dissociation of the ultrapure water and having water permeability is disposed between the workpiece and the cathode. A flow of the ultrapure water is formed inside the catalytic material, with a voltage being applied between the workpiece and the cathode, to decompose water molecules in the ultrapure water into hydrogen ions and hydroxide ions, and supply the resulting hydroxide ions to a surface of the workpiece, thereby performing removal processing of or oxide film formation on the workpiece through a chemical dissolution reaction or an oxidation reaction mediated by the hydroxide ions. Thus, clean processing can be performed by use of hydroxide ions in ultrapure water, with no impurities left behind on the processed surface of the workpiece.

公开(公告)号：US08133380B2

公开(公告)日：2012-03-13

申请号：US12222733

申请日：2008-08-14

申请人： Takayuki Saito ,  Tsukuru Suzuki ,  Yuji Makita ,  Kaoru Yamada ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Kazuto Hirokawa ,  Mitsuhiko Shirakashi ,  Yasushi Toma ,  Itsuki Kobata

发明人： Takayuki Saito ,  Tsukuru Suzuki ,  Yuji Makita ,  Kaoru Yamada ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Osamu Nabeya ,  Kazuto Hirokawa ,  Mitsuhiko Shirakashi ,  Yasushi Toma ,  Itsuki Kobata

IPC分类号： B23H3/10

CPC分类号： C25F3/00 ,  B01J49/30 ,  C25F7/00

摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

摘要翻译： 用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。 再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。

公开(公告)号：US07655118B2

公开(公告)日：2010-02-02

申请号：US10485204

申请日：2003-01-31

申请人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Osamu Nabeya

发明人： Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Hozumi Yasuda ,  Itsuki Kobata ,  Osamu Nabeya

IPC分类号： C25F3/16 ,  C25F7/00

CPC分类号： C25F3/00 ,  C25F7/00 ,  H01L21/3063 ,  H01L21/32134

摘要： This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that can come close to a workpiece, a feeding electrode for feeding electricity to the workpiece, an ion exchanger disposed in the space between the workpiece and the processing and the feeding electrodes, a fluid supply section for supplying a fluid between the workpiece and the ion exchanger, and a power source. The processing electrode and/or the feeding electrode is electrically divided into a plurality of parts, and the power source applies a voltage to each of the divided electrode parts and can control voltage and/or electric current independently for each of the divided electrode parts.

摘要翻译： 本发明涉及一种电解处理装置和方法，其用于处理形成在基板表面上的导电材料，或用于去除附着在基板表面上的杂质。 一种电解处理装置，包括可以靠近工件的处理电极，用于向工件供电的供给电极，设置在工件和处理之间的空间中的离子交换器和供电电极，流体供应部分 用于在工件和离子交换器之间供应流体，以及电源。 处理电极和/或馈电电极被分成多个部分，并且电源向每个分割的电极部分施加电压，并且可以为每个分割的电极部分独立地控制电压和/或电流。

公开(公告)号：US20070095659A1

公开(公告)日：2007-05-03

申请号：US10559724

申请日：2004-07-28

申请人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

发明人： Hozumi Yasuda ,  Ikutaro Noji ,  Kazuto Hirokawa ,  Takeshi Iizumi ,  Itsuki Kobata

IPC分类号： C25D17/00

CPC分类号： C25F7/00 ,  H01L21/32115

摘要： The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can perform processing of a substrate without destroying devices formed in the substrate even when a fragile material is employed in the substrate and which can reduce non-uniformity in the contact pressure of an electrode member on a substrate during processing, thereby equalizing the processing amount in the entire processing surface of the substrate and the surface roughness after processing. The electrolytic processing apparatus includes: a substrate holder for holding a substrate; an electrode base provided with an electrode member for contact with the substrate, held by the substrate holder, in the presence of a liquid to effect processing of the substrate; and a support base for floatingly supporting the electrode base by a floating mechanism.

摘要翻译： 本发明提供一种电解处理装置和电解处理方法，其即使在基板中使用易碎材料，也可以在不破坏形成在基板中的装置的情况下进行基板的处理，并且可以降低基板的接触压力的不均匀性 电极部件在处理时在基板上，从而使基板的整个加工面的加工量与加工后的表面粗糙度相等。 电解处理装置包括：用于保持基板的基板保持件; 电极基体，设置有用于与所述基板接触的电极部件，所述电极部件由所述基板保持件保持在所述液体的存在下，以进行所述基板的加工; 以及用于通过浮动机构浮动地支撑电极基座的支撑基座。

公开(公告)号：US07208076B2

公开(公告)日：2007-04-24

申请号：US10485177

申请日：2002-09-11

申请人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

发明人： Itsuki Kobata ,  Mitsuhiko Shirakashi ,  Masayuki Kumekawa ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Kaoru Yamada ,  Yuji Makita ,  Hozumi Yasuda

IPC分类号： C25F7/00 ,  C25F5/00 ,  C25F3/14

CPC分类号： H01L21/6708 ,  C25F3/00 ,  C25F7/00

摘要： A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.