摘要:
A semiconductor memory device having a data read path maintains a higher power voltage supplied to an input/output sense amplifier in the input/output path, through which data passes during a data read operation, than the voltage supplied to other circuit components in the data read path, thereby achieving a high data read speed.
摘要:
Disclosed herein is a semiconductor memory device which comprises a memory cell array having a plurality of memory cells and a plurality of bit line pairs connected to the memory cells. The device has two data line pairs corresponding to the memory cell array. Furthermore, the device comprises a plurality of selecting transistors connected to the bit line pairs and selecting two bit line pairs to connect the two selected bit line pairs to the two data line pairs in response to a column selection signal. The selecting transistors corresponding to the column selection signal are laid out to share source/drain to data line contacts with contiguous those to be selected by another column selection signal.
摘要:
A layout for a semiconductor memory device with a triple well structure, comprises a plurality of memory cell regions arranged in a matrix, a plurality of first circuit regions respectively arranged between adjacent ones of the memory cell regions along the first direction and each having the circuits to code and drive the word lines of corresponding memory cell region, a plurality of second circuit regions respectively arranged between adjacent ones of the memory cell regions in the second direction perpendicular to the first direction and each having the circuit to sense the bit line of corresponding bit line, a plurality of third circuit regions respectively arranged between adjacent ones of the first and second circuit regions, first drive elements applied with at least two well-bias voltages to drive the circuits of the first circuit regions, and second drive elements applied with another well-bias voltage to drive the circuit of the second circuit regions, wherein the first and second drive elements are respectively arranged in two adjacent ones of the third circuit regions.
摘要:
The present invention relates to a semiconductor memory device incorporating a column redundancy circuit using a decoded fuse. The column redundancy circuit is capable of designating a repaired address during a parallel test mode of memory operation when an address input is a "don't care," and it is particularly useful in a multiple input/output memory architecture which uses one column select per I/O line. The column redundancy circuit includes: transmitting means comprised of the data input/output lines for transmitting the data of the memory cell; column decoder and input/output control circuits connected to the transmitting means and decoding a column address input to input data; a circuit connected to the transmitting means and outputting a given signal to the column decoder and input/output control circuits in response to a plurality of output signals output from fuses and a signal for controlling the transmitting means; a plurality of decoded fuse circuits, the levels of which are determined by one fuse connected to the circuit; multiplexers for selectively transmitting data from one of the data input/output lines to a specific data bus line among a plurality of data bus lines; and a decoding circuit which receives the outputs of the decoded fuse circuits and generates a redundancy signal.
摘要:
The time required for testing high-density semiconductor memory devices is reduced by circuits and methodology for rapidly writing test data bits into the memory array. A common word line enable signal is arranged to turn on all of the word lines in the array simultaneously. Test data bits are applied to the array by gating them onto the I/O lines so that separate test bit lines are not required. A fast test enable signal gates the test bits onto the I/O lines in all columns of the array simultaneously, so that all of the memory cells receive test bits at one time. The new circuitry has the further advantages of reduced area and capacitance, the latter further contributing to reducing the test data write time.