摘要:
The present invention relates to a semiconductor memory device incorporating a column redundancy circuit using a decoded fuse. The column redundancy circuit is capable of designating a repaired address during a parallel test mode of memory operation when an address input is a "don't care," and it is particularly useful in a multiple input/output memory architecture which uses one column select per I/O line. The column redundancy circuit includes: transmitting means comprised of the data input/output lines for transmitting the data of the memory cell; column decoder and input/output control circuits connected to the transmitting means and decoding a column address input to input data; a circuit connected to the transmitting means and outputting a given signal to the column decoder and input/output control circuits in response to a plurality of output signals output from fuses and a signal for controlling the transmitting means; a plurality of decoded fuse circuits, the levels of which are determined by one fuse connected to the circuit; multiplexers for selectively transmitting data from one of the data input/output lines to a specific data bus line among a plurality of data bus lines; and a decoding circuit which receives the outputs of the decoded fuse circuits and generates a redundancy signal.
摘要:
Provided is a semiconductor memory device using a layout scheme where a bottom conductive layer in a peripheral circuit region, which is simultaneously formed with a self-align contact, is connected to one electrode of a power decoupling capacitor. Predetermined capacitors selected among a plurality of capacitors are connected to each other in parallel by using a conductive layer that is simultaneously formed with the self-align contact in a cell array region. Herein, the conductive layer and the self-align contact may be made of the same material. It is possible to embody the decoupling capacitor of a single stage cell type by connecting the conductive layer to a top interconnection layer. In addition, other embodiments implement the decoupling capacitor in a two-stage cell type by connecting a plurality of decoupling capacitors in series by means of the conductive layer in the peripheral circuit region.
摘要:
A circuit generates a boosted voltage in a semiconductor memory device, where the semiconductor memory device includes a memory cell array having a plurality of non-edge sub-arrays and at least one edge sub-array. The circuit includes a plurality of boosted voltage generators configured to generate a boosted voltage having different current driving capabilities to activate the non-edge sub-arrays and the edge sub-arrays and to supply the boosted voltage to the memory cell array.
摘要:
Provided is a semiconductor memory device using a layout scheme where a bottom conductive layer in a peripheral circuit region, which is simultaneously formed with a self-align contact, is connected to one electrode of a power decoupling capacitor. Predetermined capacitors selected among a plurality of capacitors are connected to each other in parallel by using a conductive layer that is simultaneously formed with the self-align contact in a cell array region. Herein, the conductive layer and the self-align contact may be made of the same material. It is possible to embody the decoupling capacitor of a single stage cell type by connecting the conductive layer to a top interconnection layer. In addition, other embodiments implement the decoupling capacitor in a two-stage cell type by connecting a plurality of decoupling capacitors in series by means of the conductive layer in the peripheral circuit region.
摘要:
A semiconductor memory device includes at least four memory cell array blocks, each having an array of memory cells, row and column decoders for selecting a memory cell designated by a row and column address, an I/O line for inputting/outputting data of the memory cell array block, and an I/O driver connected to the I/O line for selectively driving data to/from a selected memory cell. A first data line transmits the data, being connected between the I/O driver of one memory cell array block and the I/O driver of another memory cell array block oppositely arranged with respect to a central portion of the semiconductor memory device. A second data line transmits the data by connecting the first data lines of at least two memory cell array blocks disposed adjacent to each other. A data sense amplifier, connected to the second data line, senses and amplifies the data, and a data output unit, connected to the data sense amplifier, outputs the amplified data to an external lead frame. Therefore, the present invention has an advantage in that a relatively small layout area in required and a relatively low amount of power is consumed.
摘要:
A semiconductor memory device comprises a substrate comprising a first cell array region, a first sense circuit region, a second sense circuit region, and a second cell array region that are arranged in order from a first side to a second side. First and second bit lines are coupled to a plurality of memory cells in the first cell array region, and first and second complementary bit lines are coupled to a plurality of memory cells in the second cell array region. A first column selector is formed in the first sense circuit region and is coupled to the first bit line and the first complementary bit line. A second column selector is formed in the second sense circuit region and is coupled to the second bit line and the second complementary bit line. The first column selector and the second column selector are formed directly adjacent to each other.
摘要:
A high voltage generator is provided. The high voltage generator may comprise a high voltage output node, a plurality of pumping stages, a plurality of charge transfer elements, and a field relieving unit. The plurality of pumping stages sequentially pump charges in response to a sequentially enabled plurality of pump signals and output the pumped charges, respectively. The plurality of charge transfer elements sequentially transfer the charges sequentially pumped by the plurality of pumping stages to the next pumping stage and transfer the charge of an output node of the last pumping stage to the high voltage output node. The field relieving unit reduces the voltage of the input terminal of at least one of the plurality of charge transfer elements. The high voltage generator reduces hot carrier injection in charge transfer transistors without decreasing pumping efficiency.
摘要:
Provided is a bit line bridge detection method for selectively floating even-numbered or odd-numbered bit lines. The bit line bridge detection method simultaneously activates even-numbered sense amplifiers and odd-numbered sense amplifiers in response to a sense amplifier enable signal. The even-numbered sense amplifiers and the odd-numbered sense amplifiers are selectively disabled in response to a sense amplifier disable signal generated at a predetermined time after the sense amplifier enable signal is generated, and an even-numbered or odd-numbered sense amplifier selection signal which is stored in a mode register. As a result, the even-numbered bit lines and the odd-numbered bit lines are selectively floated. If data input to memory cells is inverted, a bit line bridge is detected.
摘要:
A memory core includes a first sub-memory array including a plurality of first memory cells, a second sub-memory array including a plurality of second memory cells, a bit line amplification circuit configured to amplify a voltage difference between the first bit line and the second bit line, and a column selection circuit including a first column selection transistor and a second column selection transistor, wherein the first and the second selection transistors share a drain and electrically couple the complementary bit line pair to a complementary local input/output line pair, respectively. As a result, the data error due to the distance mismatching can be reduced.
摘要:
A layout structure for sub word line drivers and method thereof. The example layout structure may include at least one N-channel transistor arrangement having a cross sectional width and a cross sectional length, the N-channel transistor arrangement oriented such that the cross sectional length extends along a first direction, the first direction oriented along a sub word line driver from a first sub array block to a second sub array block. The example method may arrange the at least one N-channel transistor between the first and second sub array blocks.