公开(公告)号：USD290002S

公开(公告)日：1987-05-26

申请号：US637909

申请日：1984-08-06

申请人： Yasuo Tanaka

设计人： Yasuo Tanaka

公开(公告)号：USD288559S

公开(公告)日：1987-03-03

申请号：US618598

申请日：1984-06-08

申请人： Yasuo Tanaka

设计人： Yasuo Tanaka

公开(公告)号：USD260787S

公开(公告)日：1981-09-15

申请号：US8332

申请日：1979-01-31

申请人： Yasuo Tanaka

设计人： Yasuo Tanaka

公开(公告)号：US20100222951A1

公开(公告)日：2010-09-02

申请号：US12161692

申请日：2007-05-07

申请人： Yasuo Tanaka ,  Yutaka Watanabe ,  Kichio Nakajima ,  Tomohiko Yasuda ,  Takashi Yagyu

发明人： Yasuo Tanaka ,  Yutaka Watanabe ,  Kichio Nakajima ,  Tomohiko Yasuda ,  Takashi Yagyu

IPC分类号： G06F19/00 ,  F16D31/02

CPC分类号： B60W20/10 ,  B60K6/46 ,  B60K7/0007 ,  B60L11/08 ,  B60L2200/36 ,  B60L2240/14 ,  B60L2240/421 ,  B60L2250/28 ,  B60W10/06 ,  B60W10/08 ,  B60W10/30 ,  B60W20/00 ,  B60W2300/125 ,  E02F9/2075 ,  E02F9/2246 ,  F02D29/02 ,  F02D29/04 ,  F02D29/06 ,  Y02T10/6217 ,  Y02T10/6286 ,  Y02T10/646 ,  Y02T10/70 ,  Y02T10/7077

摘要： Engine driving characteristics are achieved for driving a hydraulic system during non-traveling and traveling in an electrically driven dump truck.When a shift lever 16 is located at a neutral position, the target revolution speed Nr1 corresponding to the operation amount (p) of an accelerator pedal 1 is calculated on the basis of first target revolution speed characteristics (Nr1(p)) which are suitable for driving of a hydraulic pump for working so that an electronic governor 4a is controlled on the basis of this target revolution speed. When the shift lever 16 is located at a forward position, the target revolution speed Nr2 corresponding to the operation amount of the accelerator pedal 1 is calculated on the basis of second target revolution speed characteristics (Nr2(p)) which are suitable for driving of electric motors 12R, 12L so that the electronic governor 4a is controlled on the basis of this target revolution speed.

摘要翻译： 在电动自卸车不行驶和行驶期间，实现用于驱动液压系统的发动机驱动特性。 当变速杆16位于中立位置时，基于适合的第一目标转速特性（Nr1（p））来计算与加速器踏板1的操作量（p）对应的目标转速Nr1 用于驱动用于工作的液压泵，从而基于该目标转速来控制电子调速器4a。 当变速杆16位于前进位置时，基于适合于驾驶的第二目标转速特性（Nr2（p））来计算与加速器踏板1的操作量对应的目标转速Nr2 电动机12R，12L，从而基于目标转速来控制电子调速器4a。

公开(公告)号：US07767553B2

公开(公告)日：2010-08-03

申请号：US11243973

申请日：2005-10-06

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： H01L21/00

CPC分类号： H05K3/1233 ,  H01L51/0022 ,  H05K2203/0264 ,  H05K2203/074

摘要： Conductive ink is printed onto a wafer held on a vertically movable stage by using a squeegee to force the conductive ink through a stencil. The stencil is supported from below by a supporting member adjacent to the periphery of the stage. After the conductive ink has been printed through the stencil, pneumatic pressure is applied to the stencil from above, and the stage is lowered to separate the wafer from the stencil. The supporting member holds the stencil taut while the stage is being lowered, so that the stencil does not warp downward and the printed conductive ink leaves the stencil at substantially the same time at all points on the wafer surface, preventing the premature escape of air and loss of pneumatic pressure.

摘要翻译： 通过使用刮板将导电油墨印刷在保持在垂直移动台上的晶片上，以迫使导电油墨通过模板。 模板通过邻近台周边的支撑构件从下方支撑。 在通过模板印刷导电油墨之后，气动压力从上方施加到模板，并且阶段被降低以将晶片与模板分离。 支撑构件在台阶下降时保持模板拉紧，使得模板不向下翘曲，并且印刷的导电油墨在晶片表面上的所有点处基本上同时离开模板，防止空气过早逸出，并且 气动压力损失。

公开(公告)号：US07601051B2

公开(公告)日：2009-10-13

申请号：US11905743

申请日：2007-10-03

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： B24B1/00

CPC分类号： B24B7/228 ,  B24D7/06

摘要： A grinding machine for grinding a workpiece, including a chucking table having a chucking area and a grinder head. The grinder head includes a spinning disk rotating about a rotation axis and a plurality of grindstones, which are circularly arranged on a surface of the spinning disk, whereby a slit is created between the adjacent grindstones, wherein both of the adjacent grindstones is arranged to make contact with an edge of the workpiece while grinding the workpiece.

摘要翻译： 一种用于研磨工件的磨床，包括具有夹紧区域的夹紧台和研磨头。 研磨头包括围绕旋转轴线旋转的旋转盘和多个磨石，其圆形地布置在旋转盘的表面上，由此在相邻的砂轮之间形成狭缝，其中两个相邻的磨石被布置成 在磨削工件时与工件的边缘接触。

公开(公告)号：US07436073B2

公开(公告)日：2008-10-14

申请号：US11523657

申请日：2006-09-20

申请人： Yasuo Tanaka

发明人： Yasuo Tanaka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/16 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3463 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A junction structure, and a semiconductor device including the same, for a junction of a terminal pad and solder, including an underlying base on which said terminal pad is formed; a nickel layer disposed on the terminal pad; a palladium layer or a gold layer disposed on the nickel layer; the solder; and a zinc system material layer provided between the palladium layer or the gold layer and the solder. The terminal pad and the solder may be provided in a semiconductor device in which the terminal pad lies inside the semiconductor device, and the zinc system material layer is formed between the terminal pad and the solder. The terminal pad may be provided over a substrate, the solder may be provided in the semiconductor device, and the zinc system material layer is then formed between the terminal pad of the substrate and the solder of the semiconductor device.

摘要翻译： 一种结构结构及包括该结结构的半导体器件，用于端子焊盘和焊料的接合处，包括形成有所述端子焊盘的基底; 设置在所述端子焊盘上的镍层; 设置在镍层上的钯层或金层; 焊料; 以及设置在钯层或金层与焊料之间的锌系材料层。 端子焊盘和焊料可以设置在其中端子焊盘位于半导体器件内部的半导体器件中，并且在端子焊盘和焊料之间形成锌系材料层。 端子焊盘可以设置在衬底上，焊料可以设置在半导体器件中，然后在衬底的端子焊盘和半导体器件的焊料之间形成锌系材料层。

公开(公告)号：US20080124843A1

公开(公告)日：2008-05-29

申请号：US12007874

申请日：2008-01-16

申请人： Shinji Ohuchi ,  Yasuo Tanaka

发明人： Shinji Ohuchi ,  Yasuo Tanaka

IPC分类号： H01L21/56

CPC分类号： H01L24/11 ,  H01L21/56 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A resin sealed semiconductor device includes a semiconductor chip having a main surface, a plurality of surface electrodes formed on the main surface of the chip, a plurality of projection electrodes formed the main surface, each projection electrode being connected to respective one surface electrodes, and a resin shield covering the main surface, the surface electrodes and side surfaces of the projection electrodes, the resin having a thermal expansion coefficient in the range of 8-10 ppm/° C. and a Young's modulus in the range of 1.8-2.0 Gpa.

摘要翻译： 树脂密封半导体器件包括具有主表面的半导体芯片，形成在芯片的主表面上的多个表面电极，形成主表面的多个突起电极，每个突起电极连接到相应的一个表面电极，以及 覆盖主表面，表面电极和突起电极的侧表面的树脂屏蔽，该树脂的热膨胀系数在8-10ppm /℃的范围内，杨氏模量在1.8-2.0Gpa的范围内 。

公开(公告)号：US07172162B2

公开(公告)日：2007-02-06

申请号：US11126317

申请日：2005-05-11

申请人： Suguru Mizukoshi ,  Tomio Shibuya ,  Yasuo Tanaka ,  Shunya Jinnai ,  Masato Kanbe

发明人： Suguru Mizukoshi ,  Tomio Shibuya ,  Yasuo Tanaka ,  Shunya Jinnai ,  Masato Kanbe

IPC分类号： F16L3/22

CPC分类号： B60H1/00557 ,  F16L3/2235

摘要： A clamp device for mounting elongated components such as pipes on a support such as a car body comprises a first clamp to be mounted on the support and a second clamp to be mounted in a recess in the first clamp. The clamp device is constructed to permit limited transverse movement of the second clamp in the recess, to accommodate bending or curving of elongated components held by the second clamp. The first clamp may also hold elongated components.

摘要翻译： 用于将细长部件（例如管道）安装在诸如车体的支撑件上的夹紧装置包括要安装在支撑件上的第一夹具和要安装在第一夹具中的凹部中的第二夹具。 夹持装置被构造成允许第二夹具在凹部中的有限的横向移动，以适应由第二夹具保持的细长部件的弯曲或弯曲。 第一夹具还可以保持细长部件。

公开(公告)号：US07140103B2

公开(公告)日：2006-11-28

申请号：US10170614

申请日：2002-06-14

申请人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

发明人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

IPC分类号： H01K3/10

CPC分类号： H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2203/0723 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 μm thickness, forming an electrolytic copper plating layer of 0.5 to 3 μm thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 μm thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.

摘要翻译： 一种制造高密度印刷电路板的方法，包括：提供一种具有孔和最外铜箔厚度为5μm或更小的超薄铜箔包覆板，通过无电镀铜将表面镀覆以形成0.1层 使用无电镀铜层作为电极，形成0.5〜3μm厚的电解镀铜层，在铜镀层的一部分上形成电镀抗蚀剂层，形成6〜30μm的图案镀铜层 通过电解电镀，去除电镀抗蚀剂层，并蚀刻整个表面以除去薄的电解铜层，化学镀铜层和超薄铜箔层至少在铜表面上形成的电镀抗蚀剂层的厚度 其中未形成图案铜镀层。