Abstract:
The present invention provides a semiconductor device which can realize the mounting of a plurality of chips at a high-speed, with high packaging density and at a low cost. In mounting a memory device chip 103 and an ASIC 104 on a wiring chip 102, connection pads 110, 116 are respectively formed along one opposing sides of the memory device chip 103 and the ASIC 104 on the wiring chip 102, the arrangement positions of the respective connection pads 110, 116 define the shortest distance assumes the shortest distance therebetween and, at the same time wiring lines which are formed on the wiring chip 102 are also shortened. Accordingly, it is possible to mount the memory device chip 103 and the ASIC 104 on the wiring chip 102 with high packaging density and, at the same time, since the wiring distance can be shortened, the high speed operation can be realized.
Abstract:
Making a dot pattern so that misalignment in a x direction and a y direction is alternately generated for every adjacent information dots on a virtual grid line, the misalignment is alternately generated in the x direction and the y direction for each dot and this results in that the alternate information dot is necessarily arranged on the same grid line. Therefore, in the case that an optical reading apparatus reads the dot pattern, a search algorithm of a virtual grid line is simplified on an image memory. As a result, the grid point on the image memory is also easy. Therefore, without using a complicated program, it is possible to speed up the reading speed of the dot pattern.
Abstract:
To realize a user-friendly medium and information output thereof by defining a plurality of information in the same region of a dot pattern printed on a surface of a medium, such as a map or the like, and selectively outputting the information through an imaging operation of an imaging unit. [Means for Resolution] A dot pattern that is printed on a medium to be superimposed on a map or the like includes coordinate information and code information. Therefore, information corresponding to the coordinate information and information corresponding to the code information can be selectively and repetitively output.
Abstract:
An evaluation method for lithography apparatus including a coating unit, an exposure unit, a heating unit and a development unit, the evaluation method including forming an evaluation resist pattern by using the lithography apparatus, the evaluation resist pattern including first and second evaluation patterns, the first and second evaluation patterns having different peripheral environments, measuring dimensions of the first and second evaluation patterns to obtain a dimensional difference between the first and second resist evaluation patterns, estimating an exposure dose of a resist when the resist is exposed by the exposure unit, the estimating the exposure dose being performed based on the dimensional difference between the first and second resist evaluation patterns, and estimating an effective heating temperature of the resist when the resist is heated by the heating unit, the estimating the effective heating temperature being performed based on the estimated exposure dose and the dimensional difference.
Abstract:
The present invention provides a semiconductor device which can realize the mounting of a plurality of chips at a high-speed, with high packaging density and at a low cost. In mounting a memory device chip 103 and an ASIC 104 on a wiring chip 102, connection pads 110, 116 are respectively formed along one opposing sides of the memory device chip 103 and the ASIC 104 on the wiring chip 102, the arrangement positions of the respective connection pads 110, 116 define the shortest distance assumes the shortest distance therebetween and, at the same time wiring lines which are formed on the wiring chip 102 are also shortened. Accordingly, it is possible to mount the memory device chip 103 and the ASIC 104 on the wiring chip 102 with high packaging density and, at the same time, since the wiring distance can be shortened, the high speed operation can be realized.
Abstract:
According one embodiment, after receiving, as a received bit sequence, an information bit sequence which has been encoded for an error correction in the form of connecting an error correcting code to the outside of an LDPC code, the received bit sequence is subjected to the LDPC decoding, and then subjected to an error correction corresponding to the error correcting code. When the error correction corresponding to the error correcting code is impossible, a bit with low reliability is detected from the received bit sequence subjected to the LDPC decoding, and the bit is inverted, and then the received bit sequence with the inverted bit is subjected to an error correction corresponding to the error correcting code.
Abstract:
A method for particle beam lithography, such as electron beam (EB) lithography, includes predefining a stencil design having a plurality of cell patterns with information from a cell library, fabricating the stencil design, synthesizing a functional description into a logic circuit design after predefining the stencil design so that one or more characteristics of the stencil design are considered during synthesizing of the functional description into the logic circuit design, optimizing the logic circuit design, generating a layout design from the optimized logic circuit design, and forming the logic circuit on a substrate according to the stencil design and the layout design.
Abstract:
A quadrangular or rectangular area on a medium surface of a printed material and the like is defined as a block. A straight line in a vertical direction and a horizontal direction nuclear along an edge of the block is defined as a reference grid line. A virtual grid point is placed at a predetermined interval on the reference grid line. A reference grid point dot is placed each on a virtual grid point on the horizontal reference grid lines. A straight line connecting the reference grid point dots and virtual grid points on a vertical line is defined as a grid line. An intersection point of grid lines is defined as a virtual grid point. A dot pattern is generated by arranging one or more information dots having a distance and a direction on the base of the virtual grid point. An optical reading means is used to scan the dot pattern into image information. Then, the dot pattern is converted into a numerical value, and the information corresponding to the numerical information is read from a storage means and output.
Abstract:
Stator coils are inclined with respect to the axial direction of annularly arranged coil holding portions and such that at least parts of the stator coils overlap one another. In setting the stator coils on the coil holder, the stator coils are sequentially set on the coil holder in a predetermined direction, which is a coil setting direction, from the starting stator coil so as to overlap one another. The second section of the ending stator coil is set at the same position as a position where the first section of the starting stator coil is set in the circumferential direction or at a position advanced from the position where the first section of the starting stator coil is set in the circumferential direction. The ending stator coil is set on the coil holder to be further inward than the starting stator coil. Therefore, stator coils are evenly arranged.
Abstract:
Purified immunocytes were analyzed for expression frequencies, and the NKIR gene expressed specifically in natural killer (NK) cells was successfully identified. The NKIR gene encodes a receptor. Agonists and antagonists for the receptor can be identified by using the receptor.