公开(公告)号：US20190152764A1

公开(公告)日：2019-05-23

申请号：US16251838

申请日：2019-01-18

Applicant: MEMS Drive, Inc.

Inventor： Gerardo Morabito ,  Xiaolei Liu ,  Guiqin Wang ,  Roman Gutierrez ,  Matthew Ng

IPC: B81B3/00 ,  H02N1/00 ,  B81B7/00

Abstract: Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

公开(公告)号：US10196259B2

公开(公告)日：2019-02-05

申请号：US14985175

申请日：2015-12-30

Applicant: MEMS DRIVE, INC.

Inventor： Gerardo Morabito ,  Xiaolei Liu ,  Guiqin Wang ,  Roman Gutierrez ,  Matthew Ng

IPC: B81B7/00 ,  B81B3/00 ,  H02N1/00

Abstract: Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

公开(公告)号：US10043704B2

公开(公告)日：2018-08-07

申请号：US15442085

申请日：2017-02-24

Applicant: MEMS Drive, Inc.

Inventor： Roman Gutierrez ,  Tony Tang ,  Xiaolei Liu ,  Guiqin Wang ,  Matthew Ng

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/768 ,  H01L23/485

Abstract: A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

公开(公告)号：US20170197825A1

公开(公告)日：2017-07-13

申请号：US15468682

申请日：2017-03-24

Applicant: MEMS DRIVE, INC.

Inventor： Roman Gutierrez ,  Tony Tang ,  Xiaolei Liu ,  Matthew Ng ,  Guiqin Wang

IPC: B81C1/00

CPC classification number: B81C1/00476 ,  B81B2201/033 ,  B81C1/00619 ,  B81C99/0095 ,  B81C2201/0132 ,  B81C2201/056

Abstract: A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

公开(公告)号：US20170170059A1

公开(公告)日：2017-06-15

申请号：US15442085

申请日：2017-02-24

Applicant: MEMS Drive, Inc.

Inventor： Roman Gutierrez ,  Tony Tang ,  Xiaolei Liu ,  Guiqin Wang ,  Matthew NG

IPC: H01L21/768 ,  H01L23/485

CPC classification number: H01L21/76816 ,  B81B3/0045 ,  B81B7/0029 ,  B81B2203/0353 ,  B81C1/00674 ,  B81C1/00682 ,  B81C2201/0112 ,  B81C2201/0135 ,  H01L21/768 ,  H01L21/76898 ,  H01L23/485 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1461 ,  H01L2924/181

Abstract: A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

公开(公告)号：US12003195B2

公开(公告)日：2024-06-04

申请号：US16584567

申请日：2019-09-26

Applicant: MEMS Drive, Inc.

Inventor： Guiqin Wang ,  Matthew Ng ,  Xiaolei Liu

IPC: H02N2/02 ,  G02B5/20 ,  G02B7/09 ,  G02B27/64 ,  G03B5/02 ,  G03B5/04 ,  G03B11/00 ,  G03B13/36 ,  H02K41/035 ,  H02N1/00

CPC classification number: H02N2/028 ,  G02B5/208 ,  G02B7/09 ,  G02B27/646 ,  G03B5/02 ,  G03B5/04 ,  G03B11/00 ,  G03B13/36 ,  H02K41/0356 ,  H02N1/008 ,  G03B2205/0015 ,  G03B2205/0061 ,  H02K2201/18

Abstract: A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator; and an optoelectronic device coupled to the micro-electrical-mechanical system (MEMS) actuator; wherein the in-plane MEMS actuator includes an electromagnetic actuator portion.

公开(公告)号：US11005392B2

公开(公告)日：2021-05-11

申请号：US16252091

申请日：2019-01-18

Applicant: MEMS Drive, Inc.

Inventor： Xiaolei Liu ,  Roman Gutierrez ,  Matthew Ng ,  Guiqin Wang

IPC: H02N1/00

Abstract: An apparatus is provided. The apparatus includes a bidirectional comb drive actuator. The apparatus may also include a cantilever. The cantilever includes a first end connected to the bidirectional comb drive actuator and a second end connected to an inner frame. In addition, the cantilever may include first and second conductive layers for routing electrical signals. Embodiments of the disclosed apparatuses, which may include multi-dimensional actuators, allow for an increased number of electrical signals to be routed to the actuators. Moreover, the disclosed apparatuses allow for actuation multiple directions, which may provide for increased control, precision, and flexibility of movement. Accordingly, the disclosed embodiments provide significant benefits with regard to optical image stabilization and auto-focus capabilities, for example in size- and power-constrained environments.

公开(公告)号：US20210088804A1

公开(公告)日：2021-03-25

申请号：US17025147

申请日：2020-09-18

Applicant: MEMS Drive, Inc.

Inventor： MATTHEW NG ,  Xiaolei Liu ,  Guiqin Wang

IPC: G02B27/64 ,  H02N1/00 ,  H02K41/035 ,  H02N2/02

Abstract: A multi-axis MEMS assembly is configured to provide multi-axis movement and includes: a first in-plane MEMS actuator configured to enable movement along at least an X-axis; and a second in-plane MEMS actuator configured to enable movement along at least a Y-axis; wherein the first in-plane MEMS actuator is coupled to the second in-plane MEMS actuator.

公开(公告)号：US10442680B2

公开(公告)日：2019-10-15

申请号：US15182389

申请日：2016-06-14

Applicant: MEMS DRIVE, INC.

Inventor： Xiaolei Liu ,  Kegang Huang ,  Guiqin Wang ,  Matthew Ng ,  Benson Mai ,  Changgeng Liu

IPC: H02N2/02 ,  B81B3/00 ,  H01L41/09

Abstract: Electric connection flexures for moving stages of microelectromechanical systems (MEMS) devices are disclosed. The disclosed flexures may provide an electrical and mechanical connection between a fixed frame and a moving frame, and are flexible in the moving frame's plane of motion. In implementations, the flexures are formed using a process that embeds the two ends of each flexure in the fixed frame and moving frame, respectively.

公开(公告)号：US20190227266A1

公开(公告)日：2019-07-25

申请号：US16256495

申请日：2019-01-24

Applicant: MEMS Drive, Inc.

Inventor： GUIQIN WANG ,  Xiaolei Liu ,  Matthew Ng

IPC: G02B13/00 ,  G02B7/09 ,  G03B13/32 ,  G03B17/00 ,  H01L41/09

Abstract: A multi-axis MEMS assembly includes a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement. The micro-electrical-mechanical system (MEMS) actuator includes: an in-plane MEMS actuator, and an out-of-plane MEMS actuator. An optoelectronic device is coupled to the micro-electrical-mechanical system (MEMS) actuator. The out-of-plane MEMS actuator includes a multi-morph piezoelectric actuator.