Comb drive with non-parallel overlapping comb fingers

    公开(公告)号:US10523134B2

    公开(公告)日:2019-12-31

    申请号:US14656618

    申请日:2015-03-12

    Abstract: A comb drive includes an inactive comb finger array and an opposing active comb finger array positioned to oppose the inactive comb finger array and configured to move in a non-linear path relative to the inactive comb finger array, wherein each comb finger array includes a comb spine and a plurality of comb fingers extending from its comb spine, and each comb finger on the active comb finger array is shaped to match a non-parallel profile. The non-parallel profile may be tapered, curved, or selected to linearize the capacitance in a gap between adjacent comb fingers from the inactive comb finger array when a comb finger from the active comb finger array moves through the gap.

    MEMS ACTUATOR STRUCTURES RESISTANT TO SHOCK
    3.
    发明申请

    公开(公告)号:US20190152765A1

    公开(公告)日:2019-05-23

    申请号:US16251933

    申请日:2019-01-18

    Abstract: Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

    Simplified MEMS device fabrication process

    公开(公告)号:US10160641B2

    公开(公告)日:2018-12-25

    申请号:US15468682

    申请日:2017-03-24

    Abstract: A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

    MEMS actuator package architecture

    公开(公告)号:US10033303B2

    公开(公告)日:2018-07-24

    申请号:US15412679

    申请日:2017-01-23

    Abstract: A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.

    MEMS ACTUATION SYSTEMS AND METHODS
    6.
    发明申请

    公开(公告)号:US20180076740A1

    公开(公告)日:2018-03-15

    申请号:US15699306

    申请日:2017-09-08

    Abstract: A micro-electrical-mechanical system (MEMS) actuator includes: a MEMS actuation core, and a multi-piece MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board, wherein the multi-piece MEMS electrical connector includes: a plurality of subcomponents, and a plurality of coupling assemblies configured to couple the plurality of subcomponents together.

    MEMS ACTUATION SYSTEMS AND METHODS
    7.
    发明申请

    公开(公告)号:US20180072565A1

    公开(公告)日:2018-03-15

    申请号:US15699007

    申请日:2017-09-08

    Abstract: A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

    MEMS locking system
    10.
    发明授权

    公开(公告)号:US11095820B2

    公开(公告)日:2021-08-17

    申请号:US16567357

    申请日:2019-09-11

    Abstract: A micro-electrical-mechanical system (MEMS) actuator configured to provide multi-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: a first portion, a second portion, wherein the first portion and the second portion are displaceable with respect to each other, and a locking assembly configured to releasably couple the first portion and the second portion to attenuate displacement between the first portion and the second portion.

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