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公开(公告)号：US20190152765A1
公开(公告)日：2019-05-23
申请号：US16251933
申请日：2019-01-18
Applicant: MEMS Drive, Inc.
Inventor： Gerardo Morabito , Xiaolei Liu , Guiqin Wang , Roman Gutierrez , Matthew Ng
Abstract: Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.
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公开(公告)号：US10160641B2
公开(公告)日：2018-12-25
申请号：US15468682
申请日：2017-03-24
Applicant: MEMS DRIVE, INC.
Inventor： Roman Gutierrez , Tony Tang , Xiaolei Liu , Matthew Ng , Guiqin Wang
Abstract: A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.
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公开(公告)号：US10033303B2
公开(公告)日：2018-07-24
申请号：US15412679
申请日：2017-01-23
Applicant: MEMS Drive, Inc.
Inventor： Xiaolei Liu , Guiqin Wang , Matthew Ng
Abstract: A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.
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公开(公告)号：US20180076740A1
公开(公告)日：2018-03-15
申请号：US15699306
申请日：2017-09-08
Applicant: MEMS Drive, Inc.
Inventor： XIAOLEI LIU , Matthew Ng , Guiqin Wang
IPC: H02N1/00
Abstract: A micro-electrical-mechanical system (MEMS) actuator includes: a MEMS actuation core, and a multi-piece MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board, wherein the multi-piece MEMS electrical connector includes: a plurality of subcomponents, and a plurality of coupling assemblies configured to couple the plurality of subcomponents together.
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公开(公告)号：US20180072565A1
公开(公告)日：2018-03-15
申请号：US15699007
申请日：2017-09-08
Applicant: MEMS Drive, Inc.
Inventor： Matthew Ng , Xiaolei Liu , Guiqin Wang
IPC: B81C1/00
Abstract: A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.
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Patent Agency Ranking
公开(公告)号：US20170133951A1
公开(公告)日：2017-05-11
申请号：US15412679
申请日：2017-01-23
Applicant: MEMS Drive, Inc.
Inventor： Xiaolei Liu , Guiqin Wang , Matthew Ng
CPC classification number: H02N1/008 , B81B3/0021 , B81B3/0062 , B81B7/0006 , B81B7/008 , B81B7/02 , B81B2201/033 , B81B2201/034 , B81B2201/047 , B81B2203/0118 , B81B2203/0136 , B81B2203/05 , B81B2203/053 , G02B7/09 , G02B27/646 , H01L41/09 , H01L41/0953 , H02N2/02 , H04N5/23287
Abstract: A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.
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公开(公告)号：US09630836B2
公开(公告)日：2017-04-25
申请号：US14872094
申请日：2015-09-30
Applicant: MEMS DRIVE, INC.
Inventor： Roman Gutierrez , Tony Tang , Xiaolei Liu , Matthew Ng , Guiqin Wang
CPC classification number: B81C1/00476 , B81B2201/033 , B81C1/00619 , B81C99/0095 , B81C2201/0132 , B81C2201/056
Abstract: A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.
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公开(公告)号：US20200084381A1
公开(公告)日：2020-03-12
申请号：US16567357
申请日：2019-09-11
Applicant: MEMS Drive, Inc.
Inventor： Xiaolei Liu , Matthew Ng , Guiqin Wang
Abstract: A micro-electrical-mechanical system (MEMS) actuator configured to provide multi-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: a first portion, a second portion, wherein the first portion and the second portion are displaceable with respect to each other, and a locking assembly configured to releasably couple the first portion and the second portion to attenuate displacement between the first portion and the second portion.
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公开(公告)号：US10516348B2
公开(公告)日：2019-12-24
申请号：US15012682
申请日：2016-02-01
Applicant: MEMS Drive Inc.
Inventor： Xiaolei Liu , Guiqin Wang , Matthew Ng
IPC: H02N1/00 , H02N2/02 , H01L41/09 , H04N5/232 , G02B7/09 , G02B27/64 , B81B3/00 , B81B7/00 , B81B7/02
Abstract: A package for moving a platform in six degrees of freedom, is provided. The platform may include an optoelectronic device mounted thereon. The package includes an in-plane actuator which may be a MEMS actuator and an out-of-plane actuator which may be formed of a piezoelectric element. The in-plane MEMS actuator may be mounted on the out-of-plane actuator mounted on a recess in a PCB. The in-plane MEMS actuator includes a plurality comb structures in which fingers of opposed combs overlap one another, i.e. extend past each other's ends. The out-of-plane actuator includes a central portion and a plurality of surrounding stages that are connected to the central portion. The in-plane MEMS actuator is coupled to the out-of-plane Z actuator to provide three degrees of freedom to the payload which may be an optoelectronic device included in the package.
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公开(公告)号：US10211757B2
公开(公告)日：2019-02-19
申请号：US14818086
申请日：2015-08-04
Applicant: MEMS DRIVE, INC.
Inventor： Xiaolei Liu , Roman Gutierrez , Matthew Ng , Guiqin Wang
IPC: H02N1/00
Abstract: An apparatus is provided. The apparatus includes a bidirectional comb drive actuator. The apparatus may also include a cantilever. The cantilever includes a first end connected to the bidirectional comb drive actuator and a second end connected to an inner frame. In addition, the cantilever may include first and second conductive layers for routing electrical signals. Embodiments of the disclosed apparatuses, which may include multi-dimensional actuators, allow for an increased number of electrical signals to be routed to the actuators. Moreover, the disclosed apparatuses allow for actuation multiple directions, which may provide for increased control, precision, and flexibility of movement. Accordingly, the disclosed embodiments provide significant benefits with regard to optical image stabilization and auto-focus capabilities, for example in size- and power-constrained environments.
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