Surface mount type photo-interrupter and method for manufacturing the same
    31.
    发明申请
    Surface mount type photo-interrupter and method for manufacturing the same 有权
    表面贴装型光电断路器及其制造方法

    公开(公告)号:US20070018123A1

    公开(公告)日:2007-01-25

    申请号:US11485768

    申请日:2006-07-13

    申请人: Masashi Sano

    发明人: Masashi Sano

    IPC分类号: G02B27/00

    摘要: A surface mount type photo-interrupter includes an insulating base, a light emitting element and a light receiving element provided on the insulating base, a first terminal electrode for the light emitting element, a second terminal electrode for the light receiving element, a first primary mold which is transparent and covers the light emitting element, a second primary mold which is transparent and covers the light receiving element, and a secondary mold which is opaque and fixes the first and second primary molds. Each of the first and second terminal electrodes is formed at a side surface and/or a lower surface of the insulating base. The secondary mold is provided with a groove located between the first and second primary molds. Light from the light emitting element passes across the groove to reach the light receiving element.

    摘要翻译: 表面贴装型光电断路器包括绝缘基座,发光元件和设置在绝缘基底上的光接收元件,用于发光元件的第一端子电极,用于光接收元件的第二端子电极,第一基极 模具,其是透明的并且覆盖发光元件,透明并覆盖光接收元件的第二主模具和不透明的第二模具,并且固定第一和第二主模具。 第一和第二端子电极中的每一个形成在绝缘基底的侧表面和/或下表面。 第二模具设置有位于第一和第二主要模具之间的凹槽。 来自发光元件的光穿过凹槽到达光接收元件。

    Reflective sensor
    37.
    发明授权
    Reflective sensor 有权
    反光传感器

    公开(公告)号:US06596986B1

    公开(公告)日:2003-07-22

    申请号:US09700634

    申请日:2000-11-16

    IPC分类号: H01I502

    摘要: A reflection sensor (1) for detecting presence of a detection object is provided. The reflection sensor comprises a light emitting element (31), a light receiving element (32) cooperative with the light emitting element, a first resin body (21) enclosing the light emitting element and including a first surface and a second surface away from the first surface, a second resin body (22) enclosing the light receiving element and including a third surface and a fourth surface away from the third surface, and a third resin body (25) holding the first and the second resin bodies. The reflection sensor further comprises a first pair of leads (5a, 5b) electrically connected to the light emitting element via a wire (4a) for example, and a second pair of leads (5c, 5d) electrically connected to the light receiving element via another wire (4b) for example. The leads of the first pair and the second pair extend out of one side surface (2a) or another side surface (2b) of the third resin body. The leads of the first pair and the second pair have respective free end portions (51a, 51b, 51c, 51d) connected to connecting pads P on a substrate S via solder H. The first resin body and the second resin body have respective upper surfaces and bottom surfaces exposed to outside.

    摘要翻译: 提供一种用于检测检测对象的存在的反射传感器(1)。 反射传感器包括发光元件(31),与发光元件配合的光接收元件(32),包围发光元件的第一树脂体(21),并且包括第一表面和远离该发光元件的第二表面 第一树脂体,第二树脂体和第三树脂体,第二树脂体包围光接收元件,第二树脂体包括第三表面和离开第三表面的第四表面;第三树脂体,保持第一和第二树脂体。 反射传感器还包括经由导线(4a)例如电连接到发光元件的第一对引线(5a,5b)和与光接收元件电连接的第二对引线(5c,5d) 另一根线(4b)例如。 第一对和第二对的引线从第三树脂体的一个侧表面(2a)或另一个侧表面(2b)延伸出来。 第一对和第二对的引线具有经由焊料H连接到基板S上的连接焊盘P的各自自由端部(51a,51b,51c,51d)。第一树脂体和第二树脂体具有各自的上表面 底面暴露在外面。

    Optical semiconductor device for surface mounting
    38.
    发明授权
    Optical semiconductor device for surface mounting 失效
    用于表面安装的光学半导体器件

    公开(公告)号:US06344689B1

    公开(公告)日:2002-02-05

    申请号:US09680444

    申请日:2000-10-06

    IPC分类号: H01L2312

    摘要: An optical semiconductor device for surface mounting includes a semiconductor chip having a light emitting function or a light receiving function and two electrodes of the semiconductor chip sealed into a light-permeable resin package. The electrodes have tip surfaces externally exposed from the sides at the four corners of the resin package. The tip surfaces 4 of the electrodes are located on only the sides 4a of the resin package, but not located on the bottom thereof. In this configuration, when the optical semiconductor device for surface mounting is arranged on the solder paste on a board, its stand-up due to the contraction of the solder paste after the reflow can be avoided.

    摘要翻译: 用于表面安装的光学半导体器件包括具有发光功能或光接收功能的半导体芯片以及密封在透光树脂封装中的半导体芯片的两个电极。 电极具有从树脂封装的四个角处从侧面向外露出的尖端表面。 电极的前端表面4仅位于树脂封装的侧面4a上,但不位于其底部。 在这种结构中,当将用于表面安装的光学半导体器件布置在板上的焊膏上时,可以避免由于焊料在回流之后的收缩而引起的立起。

    Photoelectric tilt-detecting sensor and method of fabricating the same
    39.
    发明授权
    Photoelectric tilt-detecting sensor and method of fabricating the same 失效
    光电倾斜检测传感器及其制造方法

    公开(公告)号:US6011254A

    公开(公告)日:2000-01-04

    申请号:US714988

    申请日:1996-09-17

    摘要: Disclosed is a photoelectric tilt-detecting sensor which, while simple in structure, is reduced of traveling-around of light transmitted therein to thereby improve the signal-to-noise ratio. The tilt-detecting sensor has a light-emitting element and a light-receiving element respectively fixed in an opposed relation in a main body, and slant surfaces provided between the light-emitting element and the light-receiving element to define a space in the main body. The slant surfaces has an elongate groove so that a spherical ball is allowed to stably move therealong. A lid integral with the main body enables bending thereof to enclose the space of the main body. These lid and the main body is formable in one body by using dies through simplified processes, realizing large-scaled production.

    摘要翻译: 公开了一种光电倾斜检测传感器,其结构简单,其中传输的光的行进减少,从而提高信噪比。 倾斜检测传感器具有在主体中分别固定为相对关系的发光元件和受光元件,以及设置在发光元件和光接收元件之间的倾斜表面,以在 主体。 倾斜表面具有细长的槽,使得允许球形球稳定地沿其移动。 与主体成一体的盖子能够弯曲以包围主体的空间。 这些盖子和主体通过简化的工艺,通过使用模具可以在一个体内成型,实现大规模的生产。