摘要:
There are provided a display panel mounted in a tiltable manner on the front face portion of a main body portion, an operation panel to be mounted in a tiltable manner on the display panel, a tilt control part for controlling to tilt the display panel in response to a first tilt command and to tilt the operation panel in response to a second tilt command, and a memory part for storing inclination angle information of the operation panel corresponding to the inclination angle of the display panel. The tilt control part tilts the display panel in response to the first tilt command, and also tilts the operation panel based on the inclination angle information of the operation panel stored in the memory part.
摘要:
During the low load operation, this fuel injection control device reduces the initial armature displacement speed of the solenoid actuator that drives the open-close valve against the low fuel pressure in the balance chamber, thereby lowering impact noise produced in the solenoid portions. When the engine is determined to be idling, a command pulse width which energizes the solenoids of the solenoid actuator is calculated according to the target injection amount, the common rail pressure, and the target fuel injection timing. Since the initial period of the command pulse width, i.e., pull-in current conduction period, is set shorter than the pull-in current conduction period for the high load operation of the engine, the initial armature displacement speed of the solenoid becomes relatively slow reducing the impact noise of the armature abutting against the stopper.
摘要:
An object of the present invention is to provide a safe and highly effective insulin resistance improving agent or therapeutic agent for type II diabetes. According to the present invention, an insulin resistance improving agent or a therapeutic agent for type II diabetes comprising a compound represented by general formula (I) (wherein R1, R2, and R3 are the same as or different from each other, and each represents lower alkyl, lower alkenyl, lower alkynyl, aralkyl, araryl, phenyl, or a hydrogen atom) or a salt thereof as an active ingredient can be provided.
摘要:
Disclosed is a pressure sensor 1 for a vehicle including a sensing element 10 for measuring the pressure of brake fluids in fluid passages, a sensor housing 20 for accommodating the sensing element 10, and contact probes 30 that are electrically connected to the sensing element 10 and an electronic control unit 300 (control unit). Each contact probe 30 includes a sleeve 31, a coil spring 32 (elastic member) housed in the sleeve 31, the rod 33 inserted into the sleeve 31. The sleeve 31 is connected to the sensing element 10 in a state that the sleeve 31 is fixed in the sensor housing 20, and the rod 33 is pressed to the electronic unit 300 by pressing force of the coil spring 32.
摘要:
A diesel engine exhaust gas after-treatment device comprising a first temperature sensor that detects the temperature either upstream or downstream from a filter as a first temperature and detects the filter's other temperature as a second temperature, and a microcomputer. The microcomputer calculates the filter's hypothetical bed temperature from the temperature of either of the first and second temperatures; calculates the heat radiation coefficient from the filter to the external atmosphere according to the exhaust gas flow rat; and calculates the second temperature's estimated temperature based on the heat radiation coefficient and the above-described one first temperature. The filter's estimated bed temperature is found based on the above-described hypothetical bed temperature and the above-described detected second temperature and the above-described second temperature's estimated temperature. The microcomputer regenerates the filter based on the estimated bed temperature.
摘要:
To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.
摘要:
A map screen is displayed in a left half area of a display panel and an real image such as a satellite photograph depicting a surface of an earth and an aerial photograph is displayed in the remaining right half area thereof based on real image data. The real images on different scales (the image as the wide area display and the image as the detailed display) can be displayed in the right half area on the display panel. A default condition of two-screen display is set to display the real image as the wide area display in the right half area.
摘要:
A device and method for coupling leads to integrated circuit packages via lead frame rail members. The lead frame rail members consist of resilient leads coupled to a first rail and other resilient leads coupled to a second rail. The first rail is connected to the second rail such that the leads of the first rail are separated from and oppose the leads of the second rail. The coupling device consists of a main frame, a spreading means, an insertion means, and a releasing means. The spreading means is coupled to the main frame and is adapted to spread the leads of each rail of a lead frame rail member away from the opposing leads of the other rail such that an integrated circuit package can be inserted between the opposing leads at intervals along the rail member. The insertion means is coupled to the main frame and is adapted to insert coupling material between the integrated circuit packages and the leads. The releasing means is also coupled to the main frame and is adapted to release the resilient leads of each rail member such that the coupling material is clamped between the leads and the package. Also included in the invention is a method for coupling leads to a plurality of integrated circuit packages.