摘要:
A variable impedance power supply line and a variable impedance ground line supplying voltages VCL1 and VSL1, respectively, are set to a low impedance state in a stand-by cycle and in a row related signal set period, and to a high impedance state in a column circuitry valid time period. Variable impedance power supply line and variable impedance ground line supplying voltages VCL2 and VSL2, respectively, are set to a high impedance state in the stand-by cycle, and low impedance state in the active cycle and in the row related signal reset time period. Inverters operate as operating power supply voltage of voltages VCL1 and VSL2 or voltages VCL2 and VSL1, in access with a logic level of an output signal in the stand-by cycle and in the active cycle. Thus a semiconductor memory device is provided in which subthreshold current in the stand-by cycle and active DC current in the active cycle can be reduced.
摘要:
On transistors P1, P2, N1 and N2 constituting an NAND gate, a interconnection pattern W of metal having high melting point and aluminum interconnection patterns Al1 and Al2 are stacked. A local line LL for connecting transistors P1, P2, N1 and N2 to each other is formed by the interconnection pattern W of metal having high melting point, signal lines SL and SL′ for signal input/output between the NAND gate and the outside are formed by aluminum interconnection pattern Al1, and power supply lines VL and VL′ for applying power supply potentials Vcc and Vss to the NAND gate are formed by the aluminum interconnection pattern Al2. As compared with the prior art in which the local line LL is formed by the aluminum interconnection pattern Al1, the degree of freedom in layout can be improved and the layout area can be reduced.
摘要:
A variable impedance power supply line and a variable impedance ground line supplying voltages VCL1 and VSL1, respectively, are set to a low impedance state in a stand-by cycle and in a row related signal set period, and to a high impedance state in a column circuitry valid time period. Variable impedance power supply line and variable impedance ground line supplying voltages VCL2 and VSL2, respectively, are set to a high impedance state in the stand-by cycle, and low impedance state in the active cycle and in the row related signal reset time period. Inverters operate as operating power supply voltage of voltages VCL1 and VSL2 or voltages VCL2 and VSL1, in accordance with a logic level of an output signal in the stand-by cycle and in the active cycle. Thus a semiconductor memory device is provided in which subthreshold current in the stand-by cycle and active DC current in the active cycle can be reduced.
摘要:
A semiconductor circuit device having a triple-well structure wherein a predetermined potential level is supplied to a top well without a contact region formed in the top well is disclosed. In an N-type ion implantation step for forming an N-type well region (1) in a P-type semiconductor substrate (5), a mask of a predetermined configuration is used so that ions are not implanted into a region of a portion which is to serve as a bottom portion (1B) of the well region (1). Then, the N-type well region (1) is formed which is shaped such that a portion (6) having P-type properties remains partially in the bottom portion (1B). The P-type portion (6) establishes electrical connection between a P-type well region (2) and the semiconductor substrate (5) to permit the potential applied to a contact region (4) to be supplied to the well region (2) therethrough. The portion (6) may include a plurality of portions (6) which allow uniform potential supply. This structure may be applied to basic cells of a memory cell array block.
摘要:
A semiconductor integrated circuit device realizing high speed operation and low current consumption and ensure reliability evaluation is provided. Reference voltage generating circuits for generating reference voltages of mutually different voltage levels are provided for power supply pads respectively, and voltage down converters for down converting power supply voltages of corresponding external power supply pads to corresponding reference voltage levels and transmitting the lowered voltages to corresponding internal power supply lines are provided corresponding to respective reference voltage generating circuits. Further, a switching transistor is provided at an output node of the reference voltage generating circuit which is rendered conductive at a stress acceleration mode for connecting the corresponding external power supply pad to the output node of the corresponding reference voltage generating circuit.
摘要:
Each of divided bit line pairs is selectively connected to a sub-input/output line pair through transfer gates. A register is connected to the sub-input/output line pair. Data is transferred through the sub-input/output line pair between the register and a selected bit line pair. A sense amplifier is connected to each of the bit line pairs. Sense amplifiers are independently driven by separate sense amplifier activating signals. Therefore, even if data is transferred to the selected bit line pair from the register, fluctuations in potential on the bit line pair caused in such a case does not affect a sense amplifier activating signal connected to a non-selected bit line pair. As a result, data stored in the non-selected memory cell is prevented from being destroyed.
摘要:
In a dynamic RAM of a CSL system, a memory array is divided into a plurality of memory array portions, and bit line pairs provided in the respective memory array portions are connected to their corresponding I/O line pairs simultaneously in response to a CSL output. In such an RAM, only the I/O line pair of a memory array portion to be accessed is precharged to the level of V.sub.CC -V.sub.th, while the I/O line pair of a memory array portion not to be accessed is precharged to the level of 1/2.multidot.V.sub.CC which is the same level as the bit line pairs. This makes it possible to achieve a faster data reading operation and also prevent unnecessary currents from flowing between the bit line pairs and the I/O line pair in the unaccessed memory array portion.
摘要:
In a semiconductor integrated circuit device, a voltage setting circuit for setting a voltage level on the sub power source voltage line according to a reference voltage from a reference voltage generating circuit, is provided between a main power source voltage line and a sub power source voltage line. While a current consumption at the standby cycle is reduced, increase of the access delay is prevented. The voltage setting circuit includes a differential amplifier for differentially amplifying a voltage on the sub power source line and the reference voltages and a transistor responsive to an output of the differential amplifier for causing a current flow between the main and sub power source lines, or alternatively a diode-connected insulated gate type transistor receiving the reference voltage at a back gate thereof.
摘要:
A timing generating circuit generates a signal SRE defining a period in which a self-refreshing operation is carried out based on a signal extRAS and a signal extCAS. An internal voltage down-converting circuit controls the level of an internal power supply voltage intVcc to be generated in the period defined by the signal SRE lower in the self-refreshing operation than in a normal operation. As a result, a semiconductor memory device is obtained which reduces current consumption in the self-refreshing operation by simple control in an internal circuit.
摘要:
An external clock signal ext.CLK applied to an external clock input pad is transferred to two internal clock generation circuits independent from each other through two independent input first stage circuits. An internal clock signal int.CLK1 controlling the operations of row related circuits and column related circuits is supplied by a first clock generation circuit and an internal clock signal int.CLK2 controlling an output buffer circuit is supplied from a second clock generation circuit.