-
公开(公告)号:US20050201193A1
公开(公告)日:2005-09-15
申请号:US11074897
申请日:2005-03-09
申请人: Naoki Kuroda , Yuji Nakai
发明人: Naoki Kuroda , Yuji Nakai
IPC分类号: G06F12/00 , G06F12/04 , G11C7/00 , G11C8/00 , G11C11/4063
CPC分类号: G11C7/10 , G11C7/1006 , G11C2207/107
摘要: A plurality of logic circuits both access the DRAM block by way of an access circuit. The operation clock for the DRAM block is set at a higher frequency than the system clock for the logic circuits. Outputs of a first bit width from the logic circuits are subjected to serial/parallel conversion into data of a second bit width and the data is written into the DRAM block.
摘要翻译: 多个逻辑电路都通过访问电路访问DRAM块。 DRAM块的操作时钟设置在比逻辑电路的系统时钟更高的频率上。 来自逻辑电路的第一位宽的输出经过串行/并行转换为第二位宽的数据,并将数据写入DRAM块。
-
公开(公告)号:US20050201142A1
公开(公告)日:2005-09-15
申请号:US11072298
申请日:2005-03-07
申请人: Naoki Kuroda
发明人: Naoki Kuroda
IPC分类号: G11C11/407 , G11C11/24
CPC分类号: G11C5/147 , G11C11/4074
摘要: A large capacity DRAM block, which is accessible by a logic circuit, includes a VBB/VPP power supply circuit. The other DRAM blocks accessible by a logic circuit share the VBB/VPP power supply circuit of the large capacity DRAM block as their VBB/VPP power supply circuit.
摘要翻译: 可由逻辑电路访问的大容量DRAM块包括VBB / VPP电源电路。 由逻辑电路可访问的其他DRAM块可将大容量DRAM块的VBB / VPP电源电路作为其VBB / VPP电源电路共享。
-
公开(公告)号:US08164938B2
公开(公告)日:2012-04-24
申请号:US12942627
申请日:2010-11-09
申请人: Naoki Kuroda , Yoshinobu Yamagami
发明人: Naoki Kuroda , Yoshinobu Yamagami
IPC分类号: G11C5/06
CPC分类号: G11C11/412 , G11C8/16
摘要: A semiconductor memory device includes a first inverter and a second inverter each having an input and an output, the output of each of the first and second inverters being connected to the input of the other so that data is stored, a CMOS switch configured to connect the input of the first inverter and a write bit line, a read MOS transistor having a gate connected to the output of the first inverter, and a MOS switch configured to connect the read MOS transistor to a read bit line. The first and second inverters have different sizes and are connected to different source power supplies.
摘要翻译: 半导体存储器件包括第一反相器和第二反相器,每个具有输入和输出,第一和第二反相器的每一个的输出连接到另一个的输入,以便存储数据; CMOS开关,被配置为连接 第一反相器的输入和写入位线,具有连接到第一反相器的输出的栅极的读取MOS晶体管和被配置为将读取的MOS晶体管连接到读取位线的MOS开关。 第一和第二逆变器具有不同的尺寸并连接到不同的源电源。
-
公开(公告)号:US07706756B2
公开(公告)日:2010-04-27
申请号:US11626485
申请日:2007-01-24
申请人: Yusuke Sato , Nobuyoshi Maejima , Tomoaki Kudaishi , Shinji Moriyama , Naoki Kuroda , Ryota Sato , Masashi Okano
发明人: Yusuke Sato , Nobuyoshi Maejima , Tomoaki Kudaishi , Shinji Moriyama , Naoki Kuroda , Ryota Sato , Masashi Okano
CPC分类号: H03F3/195 , H01L2224/05554 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/12032 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H03F3/68 , H03F3/72 , H03F2200/111 , H03F2200/294 , H03F2200/451 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
摘要翻译: 提供了一种技术,用于在增强电子设备的性能的同时,实现具有功率放大器电路的电子设备的尺寸的减小。 用于移动通信设备的RF功率模块包括安装在布线板上的第一和第二半导体芯片,无源部件以及第一和第二集成无源部件。 在第一半导体芯片中,形成用于GSM 900和DCS 1800的功率放大器电路的MISFET元件,并且还形成控制电路。 在第一集成无源部件中,形成用于GSM 900的低通滤波器电路,并且在第二集成无源部件中形成用于DCS 1800的低通滤波器电路。 在第二半导体芯片中,形成用于GSM 900和DCS 1800的天线切换电路。 在布线板的上表面上,第二半导体芯片设置在集成的无源元件之间的第一半导体芯片的旁边。
-
公开(公告)号:US20090116318A1
公开(公告)日:2009-05-07
申请号:US12191011
申请日:2008-08-13
申请人: Naoki Kuroda
发明人: Naoki Kuroda
CPC分类号: G11C11/4099 , G11C7/08 , G11C7/14 , G11C7/227
摘要: In a semiconductor storage device, such as a dynamic random access memory (DRAM), in which dynamic data is amplified and read on a bit line, a data line sense amplifier/write buffer connected to a data line of a memory array and a data line sense amplifier control signal generating logic circuit connected to a dummy data line of a dummy memory array are provided. A sense amplifier is activated in accordance with an output signal of the logic circuit.
摘要翻译: 在其中动态数据在位线上被放大和读取的诸如动态随机存取存储器(DRAM)的半导体存储装置中,连接到存储器阵列的数据线的数据线读出放大器/写入缓冲器和数据 提供连接到虚拟存储器阵列的虚拟数据线的线读出放大器控制信号产生逻辑电路。 读出放大器根据逻辑电路的输出信号而被激活。
-
公开(公告)号:US20080169950A1
公开(公告)日:2008-07-17
申请号:US11790737
申请日:2007-04-27
申请人: Naoki Yamada , Naoki Kuroda
发明人: Naoki Yamada , Naoki Kuroda
CPC分类号: H03M1/1071
摘要: The semiconductor integrated circuit includes: a plurality of macro cells; and a serial-parallel conversion circuit for converting a serial signal inputted from outside to generate parallel selection control signals during testing, or an A/D conversion circuit for converting an analog signal inputted from outside to generate digital selection control signals during testing. One or more among, the plurality of macro cells are selected based on the selection control signals and brought to a test operation state.
摘要翻译: 半导体集成电路包括:多个宏小区; 以及用于转换从外部输入的串行信号以在测试期间产生并行选择控制信号的串并转换电路,或用于转换从外部输入的模拟信号以在测试期间产生数字选择控制信号的A / D转换电路。 基于选择控制信号选择多个宏小区中的一个或多个,并进入测试操作状态。
-
公开(公告)号:US20070210866A1
公开(公告)日:2007-09-13
申请号:US11626485
申请日:2007-01-24
申请人: Yusuke Sato , Nobuyoshi Maejima , Tomoaki Kudaishi , Shinji Moriyama , Naoki Kuroda , Ryota Sato , Masashi Okano
发明人: Yusuke Sato , Nobuyoshi Maejima , Tomoaki Kudaishi , Shinji Moriyama , Naoki Kuroda , Ryota Sato , Masashi Okano
IPC分类号: H03F3/68
CPC分类号: H03F3/195 , H01L2224/05554 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/12032 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H03F3/68 , H03F3/72 , H03F2200/111 , H03F2200/294 , H03F2200/451 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
摘要翻译: 提供了一种技术,用于在增强电子设备的性能的同时,实现具有功率放大器电路的电子设备的尺寸的减小。 用于移动通信设备的RF功率模块包括安装在布线板上的第一和第二半导体芯片,无源部件以及第一和第二集成无源部件。 在第一半导体芯片中,形成用于GSM 900和DCS 1800的功率放大器电路的MISFET元件,并且还形成控制电路。 在第一集成无源部件中,形成用于GSM 900的低通滤波器电路,并且在第二集成无源部件中形成用于DCS 1800的低通滤波器电路。 在第二半导体芯片中,形成用于GSM 900和DCS 1800的天线切换电路。 在布线板的上表面上,第二半导体芯片设置在集成的无源元件之间的第一半导体芯片的旁边。
-
公开(公告)号:US20070025171A1
公开(公告)日:2007-02-01
申请号:US11492176
申请日:2006-07-25
申请人: Naoki Kuroda
发明人: Naoki Kuroda
IPC分类号: G11C11/34
摘要: In a memory cell array, source lines are provided so that each of the source lines is connected to ones of memory cells which belong to adjacent two rows and a plurality of source bias control circuits for supplying a source bias potential which is higher than a ground potential and lower than a power supply potential are provided so as to correspond to the source lines, respectively. In an active period, the source bias control circuits perform potential control so that one or more of the source lines selected by row predecoders which are not connected to one of the memory cells which is to be read out are controlled to be in a state where the source bias potential is supplied.
摘要翻译: 在存储单元阵列中,提供源极线,使得每个源极线连接到属于相邻两行的存储单元中的每一个,以及用于提供高于地的源极偏置电位的多个源极偏置控制电路 提供电位并且低于电源电位以分别对应于源极线。 在有源时段中,源极偏置控制电路进行电位控制,使得由行预解码器选择的一个或多个未连接到要读出的存储单元之一的源极线被控制为处于 提供源极偏置电位。
-
公开(公告)号:US20070019490A1
公开(公告)日:2007-01-25
申请号:US11491934
申请日:2006-07-25
申请人: Naoki Kuroda , Masanobu Hirose
发明人: Naoki Kuroda , Masanobu Hirose
IPC分类号: G11C11/34
CPC分类号: G11C17/12 , G11C2207/2227
摘要: In a memory cell array, source lines are provided so that each of the source line is connected to ones of memory cells which belong to adjacent two rows and a plurality of source bias control circuits for supplying a source bias potential which is higher than a ground potential and lower than a power supply potential are provided so as to correspond to the source lines, respectively. During a stand-by period, each of the source lines is controlled to be in a state where the source bias potential is supplied and, during an active period, one or more of the source lines which are not connected to one of the memory cells which is to be read out are controlled to be in a state where the source bias potential is supplied.
摘要翻译: 在存储单元阵列中,提供源极线,使得源极线中的每一个连接到属于相邻两行的存储单元中的每一个,以及用于提供高于地的源极偏置电位的多个源极偏置控制电路 提供电位并且低于电源电位以分别对应于源极线。 在待机期间,每个源极线被控制为处于源极偏置电位被提供的状态,并且在有效周期期间,一个或多个不连接到存储器单元之一的源极线 被读取的数据被控制为处于提供源极偏置电位的状态。
-
公开(公告)号:US07102413B2
公开(公告)日:2006-09-05
申请号:US10726302
申请日:2003-12-01
申请人: Naoki Kuroda
发明人: Naoki Kuroda
IPC分类号: H03K17/62
CPC分类号: G11C29/021 , G11C11/4074 , G11C29/02 , G11C29/12005 , G11C2029/5004 , G11C2207/105
摘要: A semiconductor integrated circuit device including a plurality of internal power supply generating circuits arranged on a single chip and a common monitor pad is provided. The internal power supply generating circuits are connected via respective switches to the common monitor pad, and the internal power supply generating circuits and the monitor pad are selectively connectable using the switches.
摘要翻译: 提供了包括布置在单个芯片上的多个内部电源产生电路和公共监视器焊盘的半导体集成电路器件。 内部电源产生电路通过相应的开关连接到公共监视器焊盘,并且使用开关可以选择性地连接内部电源发生电路和监视器焊盘。
-
-
-
-
-
-
-
-
-