摘要:
A semiconductor integrated circuit including on a single chip a plurality of circuit blocks and a plurality of internal power supply circuits for delivering a common supply voltage to the plurality of circuit blocks includes: a shared power supply interconnection for connecting the plurality of circuit blocks and the plurality of internal power supply circuits; and an external pad connected to the shared power supply interconnection. Whether or not each of the internal power supply circuits delivers the supply voltage is controlled by a certain power supply control signal.
摘要:
In a memory cell array, source lines are provided so that each of the source line is connected to ones of memory cells which belong to adjacent two rows and a plurality of source bias control circuits for supplying a source bias potential which is higher than a ground potential and lower than a power supply potential are provided so as to correspond to the source lines, respectively. During a stand-by period, each of the source lines is controlled to be in a state where the source bias potential is supplied and, during an active period, one or more of the source lines which are not connected to one of the memory cells which is to be read out are controlled to be in a state where the source bias potential is supplied.
摘要:
Source potential connection transistors, each supplying a source control potential from a source potential wiring to a source node, are disposed so as to be dispersed in a memory cell array. In addition, a source potential control circuit is disposed inside a row decoder block. With this configuration, the number of the cells connected to each word line can be increased, and the area of the memory core can be reduced. Furthermore, the pattern shape of the diffusion layer constituting the source potential connection transistor is made the same as that of the diffusion layer of a memory cell transistor, whereby mask creation can be facilitated.
摘要:
A semiconductor memory device 1 comprises precharge circuits 31, 32 corresponding to global data line pairs DL0/NDL0, DL1/NDL1, but not a precharge circuit corresponding to a local data line pair LDL/NLDL. In a command waiting state, data line selection switches 21, 22 are controlled to be in a connected state, so that the local data line pair and the global data line pairs are precharged all together while being connected to each other. In a command executing state, one of the data line selection switches 21, 22, the one being not required for command execution, is in an open state. Similarly, a semiconductor memory device comprising only a precharge circuit corresponding to a local data line pair can be provided.
摘要:
A plurality of logic circuits both access the DRAM block by way of an access circuit. The operation clock for the DRAM block is set at a higher frequency than the system clock for the logic circuits. Outputs of a first bit width from the logic circuits are subjected to serial/parallel conversion into data of a second bit width and the data is written into the DRAM block.
摘要:
A large capacity DRAM block, which is accessible by a logic circuit, includes a VBB/VPP power supply circuit. The other DRAM blocks accessible by a logic circuit share the VBB/VPP power supply circuit of the large capacity DRAM block as their VBB/VPP power supply circuit.
摘要:
A semiconductor memory device has a plurality of memory cells each having a first transistor, a second transistor having a source or drain connected to one portion of the source or drain of the first transistor, and a third transistor having a source or drain connected to the other portion of the source or drain of the first transistor. The first transistor accumulates, in the channel thereof, charges transferred from the second and third transistors.
摘要:
Over an active region with two bent portions on a semiconductor substrate, first and second word lines extend to cross these bent portions and to be vertically spaced apart from each other. Around at the center of the active region, a capacitor for storing data thereon and a capacitor contact are formed. A first bit line contact, which is connected to the active region, is formed on the opposite side to the capacitor contact across the first word line over the active region. A second bit line contact, which is also connected to the active region, is formed on the opposite side to the capacitor contact across the second word line over the active region. These first and second bit line contacts are provided substantially symmetrically about the center of the memory cell. In a pair of memory cells adjacent to each other along bit lines, one vertical end of the active region in one of the memory cells is continuous with an associated vertical end of the active region in the other memory cell. And each of the first and second bit line contacts is shared between an adjacent pair of memory cells.
摘要:
A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
摘要:
In a semiconductor storage device, such as a dynamic random access memory (DRAM), in which dynamic data is amplified and read on a bit line, a data line sense amplifier/write buffer connected to a data line of a memory array and a data line sense amplifier control signal generating logic circuit connected to a dummy data line of a dummy memory array are provided. A sense amplifier is activated in accordance with an output signal of the logic circuit.