摘要:
A plasma etching apparatus includes a processing chamber; a holding unit for holding the substrate within the processing chamber; an electrode plate facing the holding unit; a plurality of supply parts arranged at different radial positions with respect to the substrate for supplying processing gas to a space between the holding unit and the electrode plate; a high frequency power supply that supplies high frequency power to the holding unit and/or the electrode plate to convert the processing gas supplied to the space into plasma; an adjustment unit that adjusts a supply condition for each of the supply parts; and a control unit that controls the adjustment unit to vary the supply condition between a position where an effect of diffusion of processing gas on an active species concentration distribution at the substrate is dominant and a position where an effect of flow of the processing gas is dominant.
摘要:
There is provided a processing method for performing a recovery process on a damaged layer formed on a surface of a low-k film of a target substrate by introducing a processing gas containing a methyl group into a processing chamber. The method includes: increasing an internal pressure of the processing chamber up to a first pressure lower than a processing pressure for the recovery process by introducing a dilution gas into the processing chamber maintained in a depressurized state; then stopping the introduction of the dilution gas, and increasing the internal pressure of the processing chamber up to a second pressure as the processing pressure for the recovery process by introducing the processing gas into a region where the target substrate exists within the processing chamber; and performing the recovery process on the target substrate while the processing pressure is maintained.
摘要:
A control circuit of a semiconductor device includes: a semiconductor element which supplies an electric power to a load; an over-heat protecting unit having: a temperature detecting section which detects a rise in temperature; a latch section which holds an output of the temperature detecting section; and a gate interrupting section which interrupts an input to a gate of the semiconductor element in accordance with the output of the latch section; a control unit which supplies a PWM signal for turning on/off the semiconductor element; a driving electric power supply unit which supplies a driving electric power for driving the over-heat protecting unit; and a timer unit which allows the driving electric power supply unit to supply the driving electric power for a predetermined period when the input to the gate of the semiconductor element is interrupted and the control unit stops to supply the PWM signal.
摘要:
A wiper control apparatus includes a combination switch 2, a wipermotor 7, an autostop (AS) switch 8, a first semiconductor switch element 4 for on/off controlling energization of the wiper motor, a second semiconductor switch element 5 for turning on a closed circuit which passes a reverse current through the wiper motor 7 while the energization for the wiper motor 7 is off, a controller for ON/OFF controlling the first and the second semiconductor switch element, and a current limiting resistor R1 for limiting the current flowing the second semiconductor switch element 5. In this configuration, a wiper control apparatus can be provided which can solve the problem when the abnormality of short-circuiting downstream of the wiper motor occurs, is compact, reliable and surely operable using semiconductor switches and a digital-controlled controller.
摘要:
The magnetron plasma processing apparatus includes a vacuum chamber in which a semiconductor wafer is accommodated. In the chamber, a pair of electrodes are provided to face each other, and the wafer is placed on one electrode. Between a pair of the electrodes, a vertical electric field is formed, and a horizontal magnetic field is formed by the dipole ring magnet to cross perpendicularly to the electric field. The magnetic field has a gradient of the magnetic field intensity such that the intensity is high on the upstream side and is low on the downstream side in the electron-drift direction. Further, the magnetic field is formed such that the intensity is made uniform over a large area including the end portion of the wafer on the upstream side in the electron-drift direction and a region right outside it.
摘要:
A vacuum cleaner with panel portion structure which includes an improved panel main body and a blower facility valve body. The panel main body has an exhaust air port and an opening for a blower facility. The blower facility valve body is provided at a lower side of the panel main body and is rotatably supported so as to normally shut the blower facility opening. A first exhaust air passage is formed between the intermediate exhaust air port to the main body exhaust air port. A second exhaust air passage is formed between the intermediate exhaust air port to the blower facility opening. The first exhaust air passage and the second exhaust air passage are changed over by the blower facility valve body. The improved blower facility structure permits the development of a series of vacuum cleaners with and without a blower facility.
摘要:
Disclosed is a crimp machine capable of eliminating product management for a relay connector per an ID. In the crimp machine, by a power source line, a ground line, and a signal line being positioned between a terminal mount table to which a crimp connector disposed in the relay connector is mounted and a crimp blade, and by the crimp blade being move close to a terminal mount table, the power source line, the ground line, and the signal line are thus crimped, wherein a connection terminal is disposed on the terminal mount table and an ID is made to output from the connection terminal.
摘要:
In a semiconductor device manufacturing method, an etching mask (75b) having a predetermined opening pattern is formed on an etching target film (74) disposed on a target object. Then, an etching process is performed on the etching target film (74) through the opening pattern of the etching mask (75b) within a first process chamber, thereby forming a groove or hole (78a) in the etching target film. Then, the target object treated by the etching process is transferred from the first process chamber to a second process chamber, within a vacuum atmosphere. Then, a silylation process is performed on a side surface of the groove or hole (78a), which is an exposed portion of the etching target film (74), within the second process chamber.
摘要:
A load control unit for controlling the supply of an electric power to a load from battery in accordance with a pulse-width modulation control includes: a reference voltage generating unit; a first charging/discharging unit; a second charging/discharging unit connected in series to the first charging/discharging unit to charge and discharge in reverse to those of the first charging/discharging unit; a first comparing unit that compares the voltage of the first charging/discharging unit with the reference voltage and switches between the charge and discharge of the first charging/discharging unit to generate a triangle wave; and a second comparing unit that compares a divided voltage by dividing the voltage of the battery with the voltage of the triangle wave generated by the first comparing unit to generate a PWM pulse. The ratio of capacities between the first and second charging/discharging units approximates to the ratio of resistances for obtaining the divided voltage.
摘要:
A control circuit of a semiconductor device includes: a semiconductor element which supplies an electric power to a load; an over-heat protecting unit having: a temperature detecting section which detects a rise in temperature; a latch section which holds an output of the temperature detecting section; and a gate interrupting section which interrupts an input to a gate of the semiconductor element in accordance with the output of the latch section; a control unit which supplies a PWM signal for turning on/off the semiconductor element; a driving electric power supply unit which supplies a driving electric power for driving the over-heat protecting unit; and a timer unit which allows the driving electric power supply unit to supply the driving electric power for a predetermined period when the input to the gate of the semiconductor element is interrupted and the control unit stops to supply the PWM signal.