摘要:
A large capacity DRAM block, which is accessible by a logic circuit, includes a VBB/VPP power supply circuit. The other DRAM blocks accessible by a logic circuit share the VBB/VPP power supply circuit of the large capacity DRAM block as their VBB/VPP power supply circuit.
摘要:
A semiconductor memory device includes a first inverter and a second inverter each having an input and an output, the output of each of the first and second inverters being connected to the input of the other so that data is stored, a CMOS switch configured to connect the input of the first inverter and a write bit line, a read MOS transistor having a gate connected to the output of the first inverter, and a MOS switch configured to connect the read MOS transistor to a read bit line. The first and second inverters have different sizes and are connected to different source power supplies.
摘要:
A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
摘要:
In a semiconductor storage device, such as a dynamic random access memory (DRAM), in which dynamic data is amplified and read on a bit line, a data line sense amplifier/write buffer connected to a data line of a memory array and a data line sense amplifier control signal generating logic circuit connected to a dummy data line of a dummy memory array are provided. A sense amplifier is activated in accordance with an output signal of the logic circuit.
摘要:
The semiconductor integrated circuit includes: a plurality of macro cells; and a serial-parallel conversion circuit for converting a serial signal inputted from outside to generate parallel selection control signals during testing, or an A/D conversion circuit for converting an analog signal inputted from outside to generate digital selection control signals during testing. One or more among, the plurality of macro cells are selected based on the selection control signals and brought to a test operation state.
摘要:
A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.
摘要:
A logic circuit block and a memory circuit block are provided on a semiconductor chip. A timing adjustment circuit block for adjusting the propagation timing of signals is provided on a line between the circuit blocks. A timing adjustment circuit unit includes: a delay element block including a plurality of delay elements for adding different delay amounts to the inter-block signals; a counter circuit block for receiving a timing adjustment control signal from the timing adjustment circuit block; and a fuse circuit block in which a fuse is melted down based on a fuse information signal held by the counter circuit block after a timing verification and which replaces the function of the counter circuit block.
摘要:
In a memory cell array, source lines are provided so that each of the source lines is connected to ones of memory cells which belong to adjacent two rows and a plurality of source bias control circuits for supplying a source bias potential which is higher than a ground potential and lower than a power supply potential are provided so as to correspond to the source lines, respectively. In an active period, the source bias control circuits perform potential control so that one or more of the source lines selected by row predecoders which are not connected to one of the memory cells which is to be read out are controlled to be in a state where the source bias potential is supplied.
摘要:
In a memory cell array, source lines are provided so that each of the source line is connected to ones of memory cells which belong to adjacent two rows and a plurality of source bias control circuits for supplying a source bias potential which is higher than a ground potential and lower than a power supply potential are provided so as to correspond to the source lines, respectively. During a stand-by period, each of the source lines is controlled to be in a state where the source bias potential is supplied and, during an active period, one or more of the source lines which are not connected to one of the memory cells which is to be read out are controlled to be in a state where the source bias potential is supplied.
摘要:
A semiconductor integrated circuit device including a plurality of internal power supply generating circuits arranged on a single chip and a common monitor pad is provided. The internal power supply generating circuits are connected via respective switches to the common monitor pad, and the internal power supply generating circuits and the monitor pad are selectively connectable using the switches.