公开(公告)号：US20190295869A1

公开(公告)日：2019-09-26

申请号：US16356074

申请日：2019-03-18

Applicant: Mattson Technology, Inc.

Inventor： Rolf Bremensdorfer ,  Johannes Keppler ,  Michael X. Yang ,  Thorsten Hülsmann

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/324

Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., arears proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.

公开(公告)号：US20250167008A1

公开(公告)日：2025-05-22

申请号：US18952428

申请日：2024-11-19

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Matthias Bauer ,  Rolf Bremensdorfer ,  Alexandr Cosceev ,  Silke Hamm ,  Dieter Hezler ,  Eric Agha ,  Christian Pfahler ,  Kartik Shah ,  Alex Wansidler

IPC: H01L21/67

Abstract: A gas delivery system for a thermal processing apparatus is disclosed. The gas delivery system includes a cover plate and a distribution plate extending axially between a first surface and a second surface, the first and second surfaces extending perpendicular to the axial direction, the distribution plate having a distribution area comprising plurality of holes extending axially therethrough. The gas delivery system includes one or more collars coupled axially between the cover plate and the distribution plate, the collar, the cover plate, and the distribution plate together defining an interior chamber and a gas supply coupled to the collar to provide process gas from a gas source to the interior chamber. The total area of the holes is from about 0.1% to about 0.9% of a total area of the distribution area on the distribution plate. Thermal processing apparatuses and methods of use are also provided.

公开(公告)号：US20250096032A1

公开(公告)日：2025-03-20

申请号：US18959076

申请日：2024-11-25

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

Inventor： Manuel Sohn ,  Rolf Bremensdorfer ,  Silke Hamm ,  Alex Wansidler

IPC: H01L21/687 ,  C23C14/30 ,  C23C14/50 ,  H01L21/67

Abstract: Support plates and support structures for thermal processing systems to heat workpieces are provided. In one example, a thermal processing apparatus is provided that includes a plurality of heat sources, a rotatable support plate, and a support structure having a flexibility in the radial direction of the rotatable support plate that is greater than a flexibility in the azimuthal direction of the rotatable support plate. Also provided are support plates for supporting a workpiece in a thermal processing apparatus. The support plate can include a base defining a radial direction and an azimuthal direction and at least one support structure extending from the base having a flexibility in the radial direction of the base that is greater than a flexibility in the azimuthal direction of the base.

公开(公告)号：US20240347356A1

公开(公告)日：2024-10-17

申请号：US18756672

申请日：2024-06-27

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Rolf Bremensdorfer ,  Dieter Hezler

IPC: H01L21/67 ,  F27B17/00 ,  F27D7/02 ,  G01J5/10 ,  G01J5/58 ,  H05B1/02 ,  H05B3/00 ,  G01J5/00

CPC classification number: H01L21/67115 ,  F27B17/0025 ,  F27D7/02 ,  G01J5/10 ,  G01J5/58 ,  H01L21/67248 ,  H05B1/0233 ,  H05B3/0047 ,  G01J5/0007

Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, a rotation system configured to rotate the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.

公开(公告)号：US20240055242A1

公开(公告)日：2024-02-15

申请号：US18494486

申请日：2023-10-25

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Dixit Desai ,  Alex Wansidler ,  Dieter Hezler ,  Joseph Cibere ,  Rolf Bremensdorfer ,  Pete Lembesis ,  Michael Yang

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32119 ,  H01J37/32449 ,  H01J37/32651 ,  H01J2237/20214

Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.

公开(公告)号：US11837447B2

公开(公告)日：2023-12-05

申请号：US17242383

申请日：2021-04-28

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Dixit Desai ,  Alex Wansidler ,  Dieter Hezler ,  Joseph Cibere ,  Rolf Bremensdorfer ,  Pete Lembesis ,  Michael Yang

IPC: H01J37/32

CPC classification number: H01J37/32724 ,  H01J37/32119 ,  H01J37/32449 ,  H01J37/32651 ,  H01J2237/20214

Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.

公开(公告)号：US11721539B2

公开(公告)日：2023-08-08

申请号：US17533593

申请日：2021-11-23

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

Inventor： Michael X. Yang ,  Rolf Bremensdorfer ,  Dave Camm ,  Joseph Cibere ,  Dieter Hezler ,  Shawming Ma ,  Yun Yang

IPC: H01J61/073 ,  H01J61/86 ,  H05H1/48 ,  H01J61/52 ,  H01J61/28

CPC classification number: H01J61/86 ,  H01J61/0732 ,  H01J61/28 ,  H01J61/526 ,  H05H1/48

Abstract: Apparatus, systems, and methods for processing workpieces are provided. An arc lamp can include a tube. The arc lamp can include one or more inlets configured to receive water to be circulated through the arc lamp during operation as a water wall, the water wall configured to cool the arc lamp. The arc lamp can include a plurality of electrodes configured to generate a plasma in a forming gas introduced into the arc lamp via the one or more inlets. The forming gas can be or can include a mixture of a hydrogen gas and an inert gas, the hydrogen gas in the mixture having a concentration less than 4% by volume. The hydrogen gas can be introduced into the arc lamp prior to generating the plasma. The arc lamp may be used for processing workpieces.

公开(公告)号：US20230098442A1

公开(公告)日：2023-03-30

申请号：US18074713

申请日：2022-12-05

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

Inventor： Rolf Bremensdorfer ,  Johannes Keppler ,  Michael X. Yang ,  Thorsten Hülsmann

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/687

Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., arears proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.

公开(公告)号：US11610824B2

公开(公告)日：2023-03-21

申请号：US17183992

申请日：2021-02-24

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

Inventor： Michael Storek ,  Rolf Bremensdorfer ,  Markus Lieberer ,  Michael Yang

IPC: H01L21/66 ,  G01J5/04 ,  H01L21/67

Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.

公开(公告)号：US11521868B2

公开(公告)日：2022-12-06

申请号：US16356074

申请日：2019-03-18

Applicant: Mattson Technology, Inc. ,  Beijing E-Town Semiconductor Technology Co., Ltd.

Inventor： Rolf Bremensdorfer ,  Johannes Keppler ,  Michael X. Yang ,  Thorsten Hülsmann

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/687

Abstract: Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.